The highly anticipated 18th International Microsystems, Packaging, Assembly, and Circuits Technology Conference, also known as IMPACT 2023, took place with grandeur from October 25th to 27th at Hall 1 of Taipei Nangang Exhibition Center. This prestigious event was co-organized by leading institution...

On November 27, Kingston, the global leader in memory modules, and Longsys, acclaimed as key memory module maker in China, jointly announced the establishment of a new joint venture company in China. This strategic move aligns with the resurgence in the memory market, with Kingston taking the lead t...

Market speculations rumored that TSMC might cut its capital expenditure for next year to USD 28-30 billion. This potential reduction, ranging from 6.3% to 12.5% compared to this year, is attributed to the shared use of certain process equipment and the utilization of deferred budgets from the curren...

In the Q3 of 2023 (July-September), global sales of semiconductor manufacturing equipment faced a substantial 11% decline, marking the most significant drop in four years and the second consecutive quarter of contraction. Notably, Taiwan's market saw a nearly 50% reduction in sales, while the Chines...

According to a report from Taiwan's Commercial Times, industry experts assert that Silicon Photonics (SiPh) is poised to revolutionize the cloud industry as communication transmission speeds surge beyond 1.6 Tbps. Utilizing Co-Packaged Optics (CPO) for integration, SiPh combines optical components a...