Intel has recently announced that it will discontinue integrating DRAM into CPU packaging following Lunar Lake (LNL). However, this actually reveals deeper issues: Intel’s crisis in product planning and organizational decision-making. TrendForce's latest analysis points out that this setback...

According to TrendForce's latest memory spot price trend report, regarding DRAM, spot prices of reball DDR4 chips from decommissioned modules finally showed signs of halting their decline, as DDR4 chips from the Chinese supplier have remained mostly stable. As for NAND flash, spot prices are expecte...

Samsung Electronics unveiled its year-end leadership reshuffle on November 27, aiming to drive the company's next phase of growth and bolster its future competitiveness, with a strong focus on the semiconductor business. Jeon Young-hyun, who was appointed head of the Device Solutions (DS) divisio...

Advanced packaging remains a hot topic, with multiple projects worldwide making significant progress. TSMC Establishes First Advanced Packaging Zone According to reports from Taiwanese media, TSMC has acquired 30 hectares of land in the Southern Taiwan Science Park to establish its first "Advanced...

Is one of the largest purchases in the tech industry turning into a mirage? According to the latest report by Bloomberg, Qualcomm's interest in acquiring Intel has waned, as the challenges involved in acquiring the entirety of Intel have made the deal less appealing to the U.S. chip giant. Howeve...