According to TrendForce’s latest memory spot price trend report, regarding DRAM spot prices, demand has yet to show improvement, leading to increased inventory pressure on suppliers, which indicates the potential for larger price drops in the future. As for NAND flash, the overall price trend is still shifting to a reduction, which led to a small drop in prices for packaged dies and wafers from the spot market. Details are as follows:

DRAM Spot Price:

Continuing from last week, demand has yet to show improvement, leading to increased inventory pressure on suppliers. Consequently, suppliers are more willing to offer price concessions in the spot market. Overall, spot transactions continue to show low volumes. Additionally, the prices that buyers are willing to accept are significantly lower than the official prices set by sellers, resulting in a stalemate. Therefore, there is a potential for larger price drops in the future. The average spot price of mainstream chips (i.e., 1Gx8 2666MT/s) fell by 0.20% from US$1.989 last week to US$1.985 this week.

NAND Flash Spot Price:

Sluggishness persists among spot market transactions after the opening in August, where buyers are maintaining their strong on-the-fence sentiment. Despite emergence of demand for partial stocking orders, the overall price trend is still shifting to a reduction due to a lack of continuity, which led to a small drop in prices for packaged dies and wafers from the spot market this week, where 512Gb TLC wafer has fallen by 0.58% in spot prices, now arriving at US$3.272.

According to a report from The Wall Street Journal citing sources on August 13th, it’s revealed that Chinese internet companies and telecom operators have been testing Huawei’s latest processor, the “Ascend 910C,” in recent weeks. Reportedly, Huawei has informed potential customers that this new chip is comparable to NVIDIA’s H100 GPU, which cannot be directly sold in China.

Huawei’s ability to continue advancing its chip technology is a sign of its efforts to counter U.S. sanctions. However, the report also indicated that Huawei is already experiencing production delays with its current chips. The company faces additional U.S. restrictions, limiting its access to parts for production equipment and the latest memory used in AI hardware.

The sources cited by the same report point out that, TikTok’s parent company ByteDance, search giant Baidu, and state-owned telecom operator China Mobile are in preliminary talks with Huawei to secure the Ascend 910C chip. These negotiations suggest that Huawei could secure orders for more than 70,000 chips, valued at approximately USD 2 billion.

Reportedly, Huawei aims to begin shipping the Ascend 910C in October, but the final delivery schedule might differ from the initial plan and could be subject to adjustments.

Under U.S. sanctions, customers in China are forced to purchase the H20 from NVIDIA, which is a “downgraded” version of the AI chip designed specifically for the Chinese market.

Per a previous report from South China Morning Post, it’s expected that Chinese tech giants may be considering a shift towards local AI products, which could pose a challenge to NVIDIA. Currently, China accounts for 17% of NVIDIA’s revenue in the 2024 fiscal year, making the competition in the Chinese market increasingly fierce for NVIDIA.

Compared to NVIDIA’s customers in China, NVIDIA’s U.S. customers, such as OpenAI, Amazon, and Google, will soon have access to NVIDIA’s latest Blackwell architecture chips, including new products like the GB200, which NVIDIA claims offer significantly improved performance compared to existing products.

Meanwhile,  Wall Street Journal also has cited sources, pointed out that NVIDIA is working on another China-oriented chip called B20, but the design might have trouble getting U.S. approval for China export if the regulations are further tighten.

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• [News] NVIDIA Reportedly Developing Tailored Version of the Blackwell Series for Chinese Market
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(Photo credit: NVIDIA)

On August 13th, as per a report from Wallstreetcn citing industry sources, it’s indicated that SK hynix has raised the price of its DDR5 DRAM by 15% to 20%. Per the sources, the price hike by hynix is primarily due to the production capacity being squeezed by HBM3/3e. Additionally, the increased orders for AI servers downstream have also strengthened SK hynix’s resolve to raise DDR5 prices.

According to industry sources cited by Economic Daily News, for Taiwanese manufacturers, Nanya Technology has recently started mass production of DDR5, just in time to benefit from this price surge. Module makers such as ADATA and Team Group are also likely to see gains from low-cost inventory.

Nanya Technology has begun shipping its 16Gb DDR5, developed using its 1B process. Nanya Technology is optimistic that the DRAM market is on a clear path to recovery. This may due to last year’s production cuts by the three major memory manufacturers—Samsung, SK hynix, and Micron—as well as the strong demand for HBM driven by generative AI. The resulting chain reaction is expected to positively impact various types of DRAM.

SK hynix previously announced that its entire HBM production capacity for 2024 has been fully booked, with almost all of its 2025 capacity also sold out. To meet customer demand, SK hynix plans to convert over 20% of its existing DRAM production lines to mass-produce HBM.

Samsung, on the other hand, is said to be actively trying to catch up with SK hynix, looking to allocate around 30% of its DRAM production capacity to HBM.

The significant adjustments by Samsung and SK hynix to their production lines have severely squeezed the capacity for DDR4 and DDR5 DRAM, potentially leading to a sharp reduction in supply and causing prices to rise. Reportedly, SK hynix’s price increase for DDR5 primarily targets contract prices.

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• [News] Nanya Technology Chairman Names 10nm 1B Process as Key Expansion Focus for the Year
• [News] DRAM Price Surge Halts, Could HBM Demand Drive Price Increases?

(Photo credit: Nanya Technology)

In the memory sector, the era beyond 10nm seems to be around the corner, as giants have revealed plans on the production of 1c DRAM. SK hynix, according to a report by The Elec, is said to develop a 4F2 (square) DRAM in order to reduce the high cost associated with the extreme ultraviolet (EUV) processes since the commercialization of 1c DRAM.

During an industry conference on Monday, Seo Jae Wook, a SK hynix researcher, questioned the profitability of producing DRAM with EUV technology. Instead, he said that SK hynix is exploring the possibility of manufacturing future DRAMs using vertical gate (VG) or 3D DRAM structure, according to the report.

Sources cited by the report indicate that Samsung and SK hynix are both targeting to apply 4F2 for DRAM at the 10nm node and beyond. According to Seo, by applying VG or the 3D DRAM structure, the cost of the EUV processes can be reduced by half.

SK hynix’s VG, or the so-called 4F2 by memory makers internally, is similar to the vertical channel transistor (VCT) of its South Korean competitor Samsung, The Elec explains.

In short, unlike the traditional 2D DRAM, which only uses the horizontal plane, 4F2, or 3D DRAM, is a cell array structure where transistors are stacked vertically. In the structure, various parts including the source, gate, drain, and capacitor are stacked from bottom to top. As the word line connects to the gate, the bit line connects to the source.

According to the report, arranging the cell array in this manner can reduce the die surface area by 30% compared to 6F2 DRAM.

However, according to a previous report by TweakTown, though the 4F2 design possesses the advantages of being compact and power-efficient, its complexity demands extreme precision in fabrication, higher-quality materials for production, and extensive research to make it scalable and suitable for mass production.

According to TweakTown, Samsung is anticipated to finalize the initial development of VCT DRAM by 2025, with 3D DRAM expected to enter the market by 2030.

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• [News] SK hynix Reportedly Develops NAND over 400 Layers, Eyeing Mass Production Ready by 2025
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(Photo credit: SK hynix)

Per a report by the Vietnam News Agency, Vietnamese Prime Minister Phạm Minh Chính recently signed Government Decree No. 791/QĐ-TTg on the establishment of the National Steering Committee for Semiconductor Industry Development.

The main tasks and functions of the steering committee include assisting the Prime Minister and the government in researching, guiding, and coordinating the resolution of important and cross-departmental matters related to promoting the development of Vietnam’s semiconductor industry; researching, consulting, and advising on directions and solutions to promote the industry’s growth; and guiding the coordination among various departments, government agencies, relevant organizations, and entities to vigorously advance the development of Vietnam’s semiconductor industry.

Semiconductor industry is one of the strategically important global industries, and it undoubtedly represents a significant development opportunity for Vietnam.

It is reported that the semiconductor, as one of Vietnam’s nine national-level products, has been included in the country’s key development priorities for the next 30 to 50 years.

According to its National Semiconductor Industry Strategy, Vietnam aims to become a global center for semiconductor chip design, packaging, and testing by 2030.

To achieve this goal, the Vietnamese government has introduced a series of preferential policies and incentives to encourage foreign enterprises to invest in the country.

Moreover, the government has established the National Innovation Center (NIC) to create a high-tech ecosystem and beef up the training of professionals to meet the needs of developing semiconductor industry.

Currently, Vietnam has drawn in investment from foreign enterprises such as Intel, ASE Group, Samsung Electronics, Amkor, Qualcomm, ONSemi, Renesas, Texas Instruments, NXP, Marvell, Synopsys, Hana, and Anpei. In fact, with global capital investment, Vietnam’s semiconductor industry ecosystem is gradually taking shape in recent years.

Vietnam’s Minister of Planning and Investment Nguyễn Chí Dũng stated that Vietnam boasts some conditions and factors conducive to the development of semiconductor industry, involving a stable political system, a favorable geographical location, and attractive investment incentive policies.

The Vietnamese government has been committed to developing semiconductor industry and hopes to attract more and more large enterprises to invest in Vietnam.

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• [News] Nvidia CEO Visits Vietnam, Plans to Establish Chip R&D Base

(Photo credit: Intel)