As semiconductor manufacturing processes evolve more gradually, 3D packaging emerges as an effective means of prolonging Moore's Law and enhancing the computational prowess of ICs. Within the realm of 3D stacking technology, the Interuniversity Microelectronics Centre (imec) based in Belgium categor...

In recent developments, Samsung Foundry, a subsidiary of Samsung Electronics, has disclosed that it has initiated discussions with major chip clients, gearing up to provide services utilizing 1.4nm and 2nm processes. It's been said that Samsung being ahead in the production of 3nm GAA (gate-all-a...

ASE Holdings conducted an earning conference on October 26th to unveil its Q3 financial results and offer insights into future business prospects. All eyes are on ASE's progress in CoWoS advanced packaging. Joseph Tung, the Chief Financial Officer (CFO) of ASE, expressed confidence in AI and ongoing...

GlobalWafers has achieved a milestone by successfully advancing silicon carbide (SiC) crystal growth to 8-inch wafers, aligning with major international players in the industry. The company foresees the commencement of small-scale shipments of 8-inch SiC products in Q4 2024, with substantial growth ...

According to Reuter's report, the merger negotiations between Western Digital and Japan's Kioxia Holdings have been terminated as the two companies could not reach an agreement on the terms. This potential merger aimed to create one of the largest memory chip manufacturers globally but faced obstacl...