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Semiconductors
In-Depth Analyses
Disruption in 2.5D/3D Packaging: Hybrid Bonding Rising as New Cornerstone
The surge in AIGC and new technologies such IoT, AI, 5G, AR/VR are driving a huge demand for computational power of high-end chips. This has been even outpacing the performance increase offered by the long-standing Moore's Law, ushering in a "post-Moore" era where revolutions in advanced chip design...
In-Depth Analyses
Can MediaTek and NVIDIA Collaborate on Smartphone Chips?
Recently, there has been news of collaboration between NVIDIA and MediaTek. Speculation suggests that the future collaboration may extend to smartphone SoCs, allowing MediaTek to enhance the graphical computing and AI performance of Dimensity smartphone SoCs through NVIDIA's GPU technology licensing...
Insights
Spot Prices of DDR5 Decline, No Recovery Seen in Memory Spot Prices
According to the latest weekly memory spot prices published by TrendForce, the spot prices of DDR5 chips have returned to a downward trend, resulting in no signs of recovery in overall spot prices. For more details, please refer to the information below: DRAM Spot Market: Spot prices of DDR5 chi...
In-Depth Analyses
Server Specification Upgrade: A Bountiful Blue Ocean for ABF Substrates
ChatGPT's debut has sparked a thrilling spec upgrade in the server market, which has breathed new life into the supply chain and unlocked unparalleled business opportunities. Amidst all this, the big winners look set to be the suppliers of ABF (Ajinomoto Build-up Film) substrates, who are poised to ...
Press Releases
DDR3&4 Are Still on Downward Trajectory, Mainstream Wafer Prices Remain in Decline
TrendForce’s latest research indicates that, as production cuts to DRAM and NAND Flash have not kept pace with weakening demand, the ASP of some products is expected to decline further in 2Q23. DRAM prices are projected to fall 13~18%; NAND Flash is expected to fall between 8~13%. DRAM Spot Mar...
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