The semiconductor industry enters the era of integration. Various foundries are focusing on advanced packaging technologies, but the terminology surrounding advanced packaging can be daunting. This article aims to explain these terms in the simplest way possible. According to a report from TechNe...

In 2022, Intel engaged in negotiations with the Italian government, planning to invest USD 5 billion in constructing a packaging and testing facility. This project would also receive subsidies from the Italian government, expected to cover 40% of the construction costs, along with additional subsidi...

Chip giant NVIDIA kicked off its annual Graphics Processing Unit (GPU) Technology Conference (GTC) today, with CEO Jensen Huang announcing the launch of the new artificial intelligence chip, Blackwell B200. According to a report from TechNews, this new architecture, Blackwell, boasts a massive GP...

Benefited from robust demand in downstream application markets, the silicon carbide (SiC) industry is in high gear. According to TrendForce, the SiC power device market is expected to reach USD 5.33 billion by 2026, with its mainstream applications still highly reliant on electric vehicles and renew...

According to sources cited by Reuters,  TSMC is reportedly considering plans to establish a production line for its CoWoS technology in Japan. However, TSMC has yet to make any further decisions, and they have declined to comment on the matter. CoWoS is an advanced packaging technology that stac...