Semiconductors


2022-02-09

Undaunted by deadlocked US-Sino relations, China’s packaging and testing industry has emerged from the pandemic a champion

Undaunted by deadlocked US-Sino relations, the great pandemic of 2020, and the US Department of Commerce's ban on Huawei's use of software and equipment produced by US manufacturers in the same year, China’s packaging and testing industry has, instead, used these factors as stimulus get back on tr...

2022-02-08

8-inch Wafer Capacity Remains Tight, Shortages Expected to Ease in 2H23, Says TrendForce

From 2020 to 2025, the compound annual growth rate (CAGR) of 12-inch equivalent wafer capacity at the world's top ten foundries will be approximately 10% with the majority of these companies focusing on 12-inch capacity expansion, which will see a CAGR of approximately 13.2%, according to TrendForc...

2022-01-24

Price Drop of NAND Flash Products for 1Q22 Expected to Taper to 8-13% QoQ Decline, Says TrendForce

NAND Flash prices for 1Q22 are expected to decline by 8-13% QoQ, compared to TrendForce’s previous forecast of 10-15% QoQ, primarily due to PC OEMs’ increased orders for PCIe 3.0 products and the impact of the lockdown in Xi’an on PC OEMs’ price negotiation approaches. To mitigate potential...

2022-01-18

As Pandemic Resurges, Certain Productions Lines Suspended at Murata Fukui Takefu but Yet to Affect Production or Shipping, Says Trendforce

The allocation of Murata's primary production hubs and production capacity is as follows: 56% in Japan, 36% in China, 3% in Singapore, and 5% in the Philippines, according to TrendForce’s investigations. Recently, a cluster of employees at Murata's Fukui Takefu Plant tested positive for the COVID...

2022-01-14

Heterogeneous Integration Expected to Become Key Part of Packaging Technology Thanks to Development from EDA Companies

Although current semiconductor process technologies have evolved to the 3nm and 5nm nodes, SoC (system on a chip) architecture has yet to be manufactured at these nodes, as memory and RF front-end chiplets are yet to reach sufficient advancements in transistor gate length and data transmission perfo...

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