As the semiconductor industry continues to advance, it has sparked an arms race among Samsung, Intel, and TSMC in acquiring extreme ultraviolet (EUV) equipment. When asked about when TSMC would adopt the extremely expensive High Numerical Aperture EUV (High-NA EUV) lithography equipment, as per a report from Economic Daily News, TSMC’s Senior Vice President of Business Development and Global Sales at TSMC, Kevin Zhang, also revealed his insight regarding the matter in an interview.

Reportedly, High-NA EUV machines are priced as high as USD 380 million each, more than double the cost of regular EUV machines. Samsung and Intel have already invested heavily, purchasing several High-NA EUV machines ahead of TSMC, hoping to gain a competitive edge through more advanced equipment.

Industry sources cited by the report point out that Kevin Zhang did not reveal the exact timeline for TSMC’s purchase of High-NA EUV, indicating that TSMC is confident and will not blindly expand its procurement just because competitors have made early purchases. Instead, TSMC will continue to strategically plan its advanced manufacturing processes, steadily preparing to meet upcoming challenges.

Youtube channel TechTechPotato recently uploaded a 29-minute interview with Kevin Zhang. During the interview, Zhang emphasized that TSMC was the very first in terms of bringing EUV into high-volume manufacturing as early as the 7nm generation.

Zhang pointed out that TSMC currently leads in the usage, mass production, and production efficiency of EUV technology. Zhang also mentioned that scalability and manufacturing costs are significant factors to consider. He believes that TSMC’s R&D team will make the best decision regarding when and where to apply the next generation of EUV technology.

Notably, according to a report from The Chosun Daily, it pointed out that TSMC was expected to maximize the capabilities of its existing EUV equipment and utilize them through multi-patterning techniques. Simultaneously, the company was also evaluating the scale at which additional equipment may be introduced.

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(Photo credit: ASML)

Recently, it was reported that Huawei filed a patent infringement lawsuit against MediaTek in a Chinese local court. According to a report from TechNews, in response, MediaTek and its subsidiaries, HFI Innovation and MTK Wireless, have initiated countermeasures by filing a lawsuit against Huawei in a UK court, accusing Huawei of patent infringement.

MediaTek has stated that the case against Huawei is now in the judicial process and has declined to comment further. On the other hand, Huawei has not publicly responded to the matter.

A report from Chinese media outlet YiCai further cited sources, revealing that the dispute between MediaTek and Huawei over patent fees has been continuing for two to three years, yet the two parties are still unable to reach an agreement due to pricing issues.

On July 18, a report from Nikkei indicated that Huawei had filed a patent infringement lawsuit against MediaTek in a Chinese local court, drawing industry attention. On July 19, MediaTek issued an announcement stating that the lawsuit has no significant impact on the company, that it has entered the judicial process, and that the company will not comment further.

Industry sources cited by TechNews further suggest that Huawei’s lawsuit against MediaTek for patent infringement likely involves 5G (and possibly 4G, 3G, etc.) cellular network mobile communication technology. Reportedly, the reason for the lawsuit is that Huawei proposed a corresponding fee to MediaTek based on terminal patent licensing prices, but MediaTek considered the price too high, leading to the impasse.

Notably, both Huawei and MediaTek hold a large number of related patents. As of the end of 2022, Huawei possessed over 120,000 validly authorized patents worldwide. According to another report from YiCai, it owns 20% of the world’s 5G and Wi-Fi 6 patents, 10% of 4G patents, and 15% of NB-IoT and LTE-M patents.

As for MediaTek, it held over 13,000 patents globally by the end of 2022, with 1,200 patents granted in that year alone. These figures only include granted patents, excluding pending applications. Additionally, MediaTek ranks first among Taiwanese companies in the number of global patents for 5G, Wi-Fi, and HEVC/VVC technologies.

Industry sources cited by the Commercial Times also note that in recent years, China’s technological capabilities have significantly improved, and companies have been actively applying for patents domestically and internationally. With the support of the Chinese government, they have also started to frequently engage in patent litigation. Last year, Chinese courts received 5,062 technical intellectual property and monopoly cases.

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(Photo credit: MediaTek)

According to Reuters, engineers at Amazon’s chip lab in Austin, Texas, recently tested highly confidential new servers. Per the Economic Times, the director of engineering at Amazon’s Annapurna Labs under AWS Rami Sinno revealed that these new servers feature Amazon’s AI chips, which can compete with NVIDIA’s chips.

It’s reported that Amazon is developing processors to reduce reliance on the costly NVIDIA chips, which will power some of Amazon’s AWS AI cloud services.

Amazon expects to use its self-developed chips to enable customers to perform complex calculations and process large amounts of data at a lower cost. The company’s competitors, Microsoft and Alphabet, are also pursuing similar efforts.

However, Amazon is a late starter in AI chip field, but a industrial leader in non-AI processing chip, whose main non-AI processing chip, Graviton, has been in development for nearly a decade and is now in its fourth generation. The other two AI chips, Trainium and Inferentia, are newer designs.

David Brown, AWS’s Vice President of Compute and Networking, stated that in some cases, the performance of these chips can be 40% to 50% higher compared to NVIDIA’s, and their cost is supposed to be about half of the same models of NVIDIA’s chips.

AWS accounts for nearly 20% of Amazon’s total revenue. The company’s revenue from January to March surged by 17% from the same period last year, reaching USD 25 billion. AWS controls about one-third of the cloud computing market, with Microsoft’s Azure comprising about 25%.

Amazon stated that it deployed 250,000 Graviton chips and 80,000 custom AI chips to handle the surge in platform activity during the recent Prime Day.

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(Photo credit: Amazon)

According to a report from Commercial Times, TSMC’s advanced processes continue to experience strong demand, with major tech companies such as Apple, Qualcomm, NVIDIA, and AMD nearly fully booking TSMC’s 3nm capacity, while the order visibility extends into 2025.

As per the same report, the supply chain of the foundry giant’s 3nm process is also expected to continue the momentum, benefiting companies like Gudeng Precision Industrial (Gudeng), KINIK Company (KINIK), Solar Applied Materials Technology Corp (Solar Applied Materials), YEEDEX and GreenFiltec.

Industry sources cited by the same report indicate that TSMC’s wafer prices for advanced process are expected to see double-digit percentage increases by 2025. Chairman C.C. Wei recently mentioned that TSMC’s wafer pricing is strategic, as values regarding products may differ. The progress in pricing negotiations with customers is “so far so good,” and TSMC is confident about achieving a balance between price and capacity.

A report from Wccftech also suggested that Apple’s upcoming A18 Pro SoC and NVIDIA’s next-generation “Rubin” architecture will both use the 3nm process. Following the widespread adoption of TSMC’s 3nm process, the 3nm supply chain has attracted significant market attention, with expectations for operational boosts in the coming year.

In the semiconductor industry, per the sources cited by Commercial Times, Gudeng has captured about 70% of the market share for EUV POD. As EUV lithography has become a standard in advanced processes, TSMC has been adopting EUV technology starting from the 7nm process node and increasing its usage in later generations. The number of EUV layers used per wafer has been growing, which bodes well for Gudeng as it continues to benefit from this trend.

In the semiconductor sputtering target materials sector, TSMC has traditionally relied on products from international suppliers. However, with a push towards domestic equipment and consumables, Solar Applied Materials entered TSMC’s advanced 7nm process supply chain last year and has now also become a supplier for the 3nm process. Solar Applied Materials’ revenue from semiconductor targets was 4% last year and is expected to reach 10% this year, with a target of 20% by 2026, according to the report.

YEEDEX specializes in supplying components for the front-end processes, such as precision vaccum chucks for EUV equipment. As the industry moves to 3nm processes, wafer thinness increases, making precision vaccum chucks crucial for improving yield rates.

GreenFiltec specializes in extractable chemical filters and AMC Micro Pollution Control services. Through innovative material research and development for filters, GreenFiltec prevents invisible gas molecules from settling in the air. These filters are key consumables for cost control and yield improvement. In the domestic advanced process market, GreenFiltec has captured over 50% of the market share, and its operations are expected to benefit similarly next year, the report noted.

KINIK produces reclaimed wafers and diamond discs. Its high-spec diamond disc products have gained continuous and expanded adoption from major clients, achieving over 70% market share in the 3nm segment. The sources cited by Commercial Times expect that as major clients’ 3nm production capacity reaches full utilization, KINIK’s performance will significantly improve starting next year.

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(Photo credit: TSMC)

According to a report from UDN, China’s largest semiconductor packaging and testing company, JCET, has completed the planning and verification work for the first phase of the “JCET Microelectronics Wafer-level Microsystems Integration High-end Manufacturing Project.”

The project will soon be completed and put into production. Once operational, it will have an annual production capacity of 6 billion high-end advanced packaging chips, providing one-stop services from collaborative packaging design to chip production for 5G, artificial intelligence, and other applications.

As per WeChat account DRAMeXchange citing sources, the project is a major industrial initiative in Jiangsu Province, China, with a total investment of CNY 10 billion. Upon completion of the first phase, the project will have an annual production capacity of 6 billion high-end advanced packaging chips.

The project will focus on leading-edge high-performance packaging technologies, such as 2.5D/3D high-density wafer-level packaging. JCET Microelectronics commenced construction of its new plant in the eastern part of Jiangyin City on July 29, 2022, with the project expected to be completed and put into production between June and July 2024.

At the groundbreaking ceremony in 2022, JCET CEO Zheng Li stated that this project will represent the highest production technology level and largest single-investment smart manufacturing project in China’s integrated circuit packaging and testing and chip manufacturing industry. Thus, it will support end applications such as 5G, artificial intelligence, the Internet of Things, and automotive electronics, covering key strategic customers worldwide.

This project, per Li, will further enhance JCET’s global market competitiveness in the chip manufacturing sector, aiming to achieve a higher industrial position in the global integrated circuit industry.

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(Photo credit: JCET Group)