As TSMC stands at the core of the global semiconductor industry, NVIDIA founder Jensen Huang stirred up an AI frenzy when he visited Taiwan in June. According to a report from Commercial Times, during his visit, he met with TSMC founder Morris Chang and then-President C.C. Wei, and personally visited TSMC’s headquarters.

According to a report by Mirror Media on July 23rd, sources revealed that Huang requested TSMC to set up a dedicated CoWoS production line for NVIDIA at an external facility. However, this request was met with skepticism from TSMC’s senior management, resulting in a tense situation.

Notably, TSMC Chairman C.C. Wei recently pointed out that despite strong AI demand, the company has yet to achieve a supply-demand balance and continues to increase production capacity. Many customers are eager for advanced process capacity, and TSMC is striving to balance pricing and capacity. Wei also revealed that the profit margins for advanced packaging CoWoS are being adjusted to align more closely with the company’s average profit levels.

C.C. Wei emphasized TSMC’s commitment to meeting customer demands with three “Whatever” statements. Regarding timelines, he revealed that supply will remain tight through 2025, with hopes for improvement by 2026.

Sources cited by the report further estimates that current utilization rates for 5nm and 3nm processes are at full capacity. To address demand, production for 3nm is set to increase gradually from 100,000 wafers per month to approximately 125,000 wafers per month by the second half of the year.

The 2nm process is expected to start mass production in the fourth quarter of 2025, with a target monthly output of 30,000 wafers. With future expansion at the Kaohsiung plant, the combined monthly capacity of the Hsinchu Science Park and Kaohsiung facilities is projected to reach 120,000 to 130,000 wafers.

Despite escalating geopolitical risks, Wei stated that there will be no changes to TSMC’s expansion strategy, with projects in Arizona, Japan’s Kumamoto, and future European facilities proceeding as planned.

Currently, TSMC’s investment in its U.S. facilities has reached USD 65 billion. The Arizona site is expected to have three plants, with the first two set to start production in 2025 and 2028, focusing on 4/3nm and 3/2nm nodes, respectively.

TSMC’s advanced packaging plans in Taiwan include facilities in Hsinchu Science Park, Miaoli Zhunan, Taichung Central Taiwan Science Park, Tainan Southern Taiwan Science Park (taking over Longtan InFO), and Taoyuan Longtan (significantly expanding CoWoS). Construction is also scheduled to begin in 2024 at Miaoli Tongluo and Chiayi Science Park.

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(Photo credit: TSMC)

Recent comments from former U.S. President Donald Trump on protection fees have hit semiconductor stocks hard and brought TSMC back into the spotlight for investors.

As per a report from Barron’s, it’s suggested that America’s stance towards Taiwan is not the best diplomatic strategy. The following key figures highlight TSMC’s importance to both the U.S. and the global economy.

• 700 Billion

After Bloomberg published an exclusive interview with Trump, the Nasdaq Composite Index plummeted 2.8% on July 17th. Large semiconductor stocks, including TSMC and the seven major U.S. tech giants, collectively lost about USD 700 billion in market value overnight.

The report from Barron’s suggested that this phenomenon indicates that the market views TSMC not just as a foundry but also as a crucial supplier of key components for America’s largest and most important enterprises.

• 92%

According to the Semiconductor Industry Association, TSMC manufactures 92% of the world’s advanced semiconductors, while South Korea produces the remaining 8%.

Barron’s noted that though the U.S. aims to increase domestic production of advanced chips, targeting 20% of advanced chips to be produced locally by 2030,. However this will take some time to achieve.

• 33%

TSMC taks pride in itself that it is the world’s first dedicated semiconductor foundry. Namely, all chips produced by TSMC are supplied to semiconductor companies that do not manufacture their own chips. For companies like NVIDIA, AMD, Broadcom, Qualcomm, and others, TSMC is a major supplier.

Barron’s noted that approximately one-third of their chip manufacturing expenses go to TSMC. This has further underscored the significance of the company.

• 45%

NVIDIA and other companies purchase chips from TSMC and then resell them to other companies. According to Barron’s, Microsoft, Meta, Alphabet, Amazon, and Tesla contribute about 45% of NVIDIA’s sales. Although Apple currently doesn’t purchase many chips from NVIDIA, about 27% of Qualcomm’s sales and 17% of Broadcom’s sales come from Apple.

In theory, without TSMC, there would be no iPhone, AI servers, or other electronic products people rely on. For this reason, Tae Kim, a technology journalist at Barron’s, refers to the true risk of disruptions in TSMC’s operations as a “Global Depression.”

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(Photo credit: TSMC)

As TSMC and other major chip manufacturers compete for AI business opportunities, chip production capacity is unable to keep up with demand. Industry sources cited in a report from NIKKEI claimed that the slow expansion of high-end chip production capacity is due to different packaging and testing technologies used by various companies and calls for the industry to standardize as soon as possible.

Jim Hamajima, President of the Japan office of the Semiconductor Equipment and Materials International (SEMI), recently stated in an interview with NIKKEI that leading chip manufacturers like Intel and TSMC should adopt international standards for back-end processes to effectively and quickly increase production capacity.

Hamajima further noted that each company is trying to apply unique solutions in back-end processes, with TSMC and Intel using different technical standards, which leads to inefficiencies.

Semiconductor manufacturing is divided into two major parts: front-end and back-end processes. While the photolithography technology used in front-end processes widely adopts international standards set by SEMI, packaging and testing in back-end processes vary among manufacturers. For example, TSMC uses CoWoS technology for advanced packaging, while Samsung Electronics uses I-Cube technology.

In recent years, chip manufacturers have actively invested in the development of advanced packaging technologies, primarily because front-end processes face technical bottlenecks, making back-end processes the key to gaining a competitive edge.

Hamajima believes that the current state of back-end processes in the semiconductor industry is “Balkanized,” with each company adhering to its own technologies, leading to a fragmented industry. He warns that this issue will start to impact profit margins as more powerful chips are produced in the future.

Hamajima stated that if semiconductor manufacturers adopt standardized automated production technologies and material specifications, it will be easier to acquire manufacturing equipment and upstream material supplies when expanding production capacity.

Hamajima is a director of a recently launched consortium led by Intel and 14 Japanese companies to jointly develop automated systems for back-end processes. The collaborating companies include Japanese companies such as Omron, Yamaha Motor, Resonac, and Shin-Etsu Polymer, a subsidiary of Shin-Etsu Chemical Industry.

Hamajima noted that Japan, with its numerous automation equipment and semiconductor material suppliers, is an ideal location to test international standards for back-end processes.

He also acknowledged that currently, Intel is the only multinational chip manufacturer in the alliance, which might lead to the development of technical standards that favor Intel. However, he emphasized that the alliance welcomes other chip manufacturers to join, and the research outcomes will serve as a reference for future industry standard-setting.

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(Photo credit: TSMC)

Recently, after reporting a loss of USD 7 billion in its manufacturing business for 2023, Intel stated that its investment in France and Italy could not be realized for the time being, which is worth several billion euros and can potentially create thousands of jobs. Relevant investment plans for chip plants mentioned above may have been suspended.

Intel noted in a statement, “Investment in France has been paused,” citing “significant changes in economic and market conditions” since 2022.

The company had selected a location southwest of Paris as a new R&D center for artificial intelligence (AI) and high-performance computing (HPC). The center is planned to open by the end of 2024 and will employ 450 people.

Intel added that the “scope” of the project is undergoing adjustment, and France remains a choice for Intel’s future R&D center.

Two years ago, Intel began negotiations with Italy on plans to invest up to EUR 4.5 billion to build a manufacturing plant in the country. This plant would create 1,500 jobs for Intel and 3,500 jobs for suppliers.

When it comes to the status of the Italian plant, Intel said it currently focused on its active manufacturing projects in Ireland, Germany, and Poland. However, Italy’s Minister of Business, Adolfo Urso, stated in March of this year that Intel had delayed its investment in Italy.

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(Photo credit: Intel)

According to sources cited in a report from Reuters, NVIDIA is said to be planning to design a new flagship AI chip tailored for the Chinese market, which will still comply with current U.S. export control regulations.

NVIDIA, the global AI chip giant, unveiled its Blackwell chip series in March this year, with mass production expected to start later this year. The B200 chip in this series boasts powerful performance, capable of completing chatbot response tasks at speeds up to 30 times faster than the previous generation.

The sources cited by Reuters further point out that NVIDIA will collaborate with China’s Inspur to launch and sell this chip, tentatively codenamed B20. Inspur is one of NVIDIA’s primary distribution partners in China.

Currently, NVIDIA’s spokesperson has declined to comment on this news, and Inspur has also not issued any statements.

The U.S. government, citing national security concerns, began strictly tightening controls on the export of advanced semiconductors to China in 2023. Since then, NVIDIA has released three chips specifically for the Chinese market.

Per a previous report from TechNews citing industry sources, it is also believed that the US will significantly escalate the trade war after the presidential election, intensifying export restrictions on China.

It is noteworthy that the US government previously announced the imposition or increase of tariffs on Chinese electric vehicles, semiconductors, lithium batteries, and other products, with the semiconductor tariff rate set to rise from 25% to 50% by 2025.  Meanwhile, for the future direction of the US, it can be inferred that chips manufactured in Taiwan and South Korea may also face tariffs.

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(Photo credit: NVIDIA)