Recently, China’s National Integrated Circuit Industry Investment Fund Phase II (referred to as the ““Big Fund” Phase II”) has made frequent investment, successively acquiring stakes in the wafer manufacturing company Chongqing Xinlian Microelectronics Co., Ltd. (referred to as “XLMEC”) and the new silicon wafer enterprise Taiyuan Jinke Silicon Material Technology Co., Ltd. (referred to as “Jinke Silicon Material”).

“Big Fund” Phase II give priority to investing in semiconductor equipment and materials industries, with an emphasis on the upstream industrial chain covering film equipment, testing equipment, as well as materials like photoresists and masks.

According to statistics from Wechat Account Global Semiconductor, the “Big Fund” Phase II has initiated several investment over the past half year, involving companies such as IC design company Joywell Semi, EDA tool development startup Amedac, semiconductor equipment company SMIF, ceramic material developer Genori, EDA tool company Nine Cube, IP supplier KNL, JCET Auto Electronics (Shanghai) and CMOS millimeter-wave radar SoC chip company Calterah.

• “Big Fund” Phase II Invested Fab XLMEC with CNY 2.1 Billion

Recently, according to the latest information from QCC, Chongqing XLMEC has undergone several industrial and commercial changes. Notably, “Big Fund” Phase II has been added as a new shareholder, with a committed investment amounting to CNY 2.155 billion, representing a stake of 24.77% in XLMEC.

XLMEC’s business scope includes integrated circuit design, integrated circuit manufacturing, integrated circuit chip and product manufacturing, integrated circuit chip design and services, and semiconductor device-specific equipment manufacturing.

The company is positioned as a leading specialty process wafer fabrication plant in the western region of China, with the goal of becoming an advanced automotive-grade chip manufacturing company. As a fully state-owned company, it undertakes a project of building a 12-inch advanced specialty integrated circuit process line.

The first phase of the project plans for a capacity of 20,000 wafers, dedicated to becoming a significant strategic backup for the national integrated circuit industry in the west of China, ensuring the security of the integrated circuit supply chain.

Located in the Xiyong Microelectronics Industrial Park in Chongqing, XLMEC is counted as a focal project jointly developed by the Chongqing and High-tech Zone governments as part of the “33618” modern manufacturing cluster system and a key project for the transformation and upgrading of Chongqing’s high-end manufacturing and integrated circuit industries.

As a major project initiated by the Chongqing Municipal Government, it has a total investment exceeding several billion yuan, focusing on the R&D and production of 55-28nm technology nodes, with a planned total capacity of 40,000 wafers per month, of which the first phase capacity is 20,000 wafers per month.

• “Big Fund” Phase II Jointly Established a Silicon Material Company in Taiyuan Shanxi

As per Tianyancha, Jinke Silicon Material was established on July 15 with a registered capital of CNY 5.5 billion. It is jointly held by “Big Fund” Phase II, Taiyuan Jinke Semiconductor Technology Co., Ltd. (referred to as “Taiyuan Jinke Semiconductor”), and Taiyuan Fenshui Capital Management Co., Ltd, with a business scope including the manufacturing of semiconductor discrete devices, electronic special materials, other electronic devices, and integrated circuits.

In terms of equity structure, “Big Fund” Phase II holds 27.27%, Taiyuan Jinke Semiconductor 50.91%, and Taiyuan Fenshui Capital Management 21.82%. It is understood that Taiyuan Jinke Semiconductor is a wholly-owned subsidiary of Shanghai ZINGSEMI, which is itself wholly owned by National Silicon Industry Group (NSIG).

On June 11, NSIG announced its plan to invest in the capacity upgrade project for 300mm silicon wafers used in integrated circuits, with a total expected investment of about CNY 13.2 billion. It is learned that this investment will be implemented in two parts: the Taiyuan project and the Shanghai project, with the former expected to involve a total investment of about CNY 9.1 billion.

The implementing entity for the Taiyuan project is Jinke Silicon Material, which was co-founded by three parties: ZINGSEMI or its subsidiary (intended investment of CNY 2.8 billion), the “Big Fund” Phase II (intended investment of CNY 1.5 billion), and Taiyuan Fenshui Capital Management or its subsidiary (intended investment of CNY 1.2 billion), with a total joint investment of CNY 5.5 billion.

Upon its establishment, Jinke Silicon Material will primarily engage in the 300mm semiconductor silicon wafer business, implementing the capacity upgrade Taiyuan project for 300mm silicon wafers used in integrated circuits.

This project is scheduled to achieve a total capacity of 600,000 wafers per month for crystal pulling (including heavily doped wafers) and 200,000 wafers per month for slicing, grinding, and polishing (including heavily doped wafers). It will also promote the continuous upgrade and iteration of 300mm silicon wafer technology to meet the process requirements of various technical nodes in Chinese market.

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• [News] China’s Big Fund Phase Three Commences, Injecting 344 Billion RMB into Semiconductor Industry Growth
• [News] Big Fund II Infuses HLMC with an Additional USD 1 Billion, Potentially Eyeing on More Advanced Processes

(Photo credit: XLMEC)

In the Q2 earnings call today (July 18th), TSMC Chairman and CEO C.C. Wei introduced the concept of “Foundry 2.0,” redefining the foundry industry to further include sectors like packaging, testing, mask making, and others, the latest report by Technews noted.

C.C. Wei pointed out that under this new definition, TSMC’s foundry market share was 28% in 2023, and the foundry industry is expected to grow by 10% in 2024, while TSMC’s share will increase further. According to data from TrendForce, under the original definition of foundry, TSMC’s market share was 61.2%.

On the other hand, the semiconductor giant projects the entire semiconductor market, excluding memory, to grow by 10% in 2024.

TSMC’s CFO and spokesperson Wendell Huang explained that the reason for TSMC to propose “Foundry 2.0” is due to the involvement of IDM manufacturers in the foundry market, which has blurred the boundaries of the traditional foundry industry.

Moreover, C.C. Wei highlighted the strong demand for TSMC’s 3nm and 5nm processes. Thanks to the strong demand from AI and smartphones for advanced nodes, Wei believes that 2024 will be a strong year for TSMC. Meanwhile, the company also expects this year’s financial forecast and revenue to increase by 24-26% (mid-20%).

TSMC’s 3nm process accounted for 15% of wafer sales revenue in the second quarter of 2024, while 5nm and 7nm accounted for 35% and 17%, respectively. Overall, revenue from advanced processes (7nm and below) reached 67% of total wafer sales revenue for the quarter.

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• [News] TSMC Projects 7.5% Q3 Revenue Growth, Adjusts Full-Year CAPEX Range
• [News] TSMC Reports Strong Q2 Financial Results, with 3nm Accounting for 15% of Shipments

(Photo credit: TSMC)

TSMC held its earnings call earlier today. Looking ahead to the third quarter, the company estimates that, based on an exchange rate of USD 1 to TWD 32.5, revenue will fall between USD 22.4 billion and USD 23.2 billion, representing at least a 7.5% increase quarter-over-quarter. Additionally, TSMC estimates that the gross margin for this quarter will be between 53.5% and 55.5%.

TSMC has announced consolidated revenue for the second quarter of TWD 673.51 billion, an increase of 13.6% quarter-over-quarter and 40.1% year-over-year. The accumulated consolidated revenue for the first half of the year is TWD 1.26 trillion, an increase of 27.9% year-over-year. The company’s profit for the second quarter was TWD 247.845 billion, a quarter-over-quarter increase of 9.9% and a year-over-year increase of 36.3%, with earnings per share of TWD 9.56.

TSMC Chairman and CEO C.C.Wei stated that TSMC continues to invest in advanced processes and support customer needs to ensure their success. He emphasized that TSMC’s success is tied to the success of its customers.

Wei further expressed satisfaction with the success of TSMC’s customers over the past few years, noting that leading-edge nodes continue to be produced in Taiwan. He also highlighted the close collaboration with customers and the sharing of value, expressing confidence that these strategies will enable TSMC to continue to grow healthily.

In order to support customer demand, TSMC has slightly narrowed its capital expenditure forecast range. The original range of USD 28-32 billion has been revised to an estimated range of USD 30-32 billion. This adjustment aligns roughly with market expectations; however, TSMC did not raise the upper limit but instead moved the lower limit upward.

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• [News] TSMC Reports Strong Q2 Financial Results, with 3nm Accounting for 15% of Shipments
• [News] TSMC Reportedly Sees Strong 4nm Demand, with NVIDIA’s Order Up by 25%

(Photo credit: TSMC)

Moments before TSMC’s earnings call, TSMC has released its financial results for the second quarter of 2024. Reportedly, TSMC announced consolidated revenue of NTD 673.51 billion, net income of NTD 247.85 billion, and diluted earnings per share of NTD 9.56 (USD 1.48 per ADR unit) for the quarter ended June 30, 2024.

(Photo credit: TSMC)

Compared to the same period last year, TSMC reported a 40.1% increase in second quarter revenue, with net income and diluted EPS also rising by 36.3%. Quarter-over-quarter comparisons with the first quarter of 2024 showed a 13.6% increase in revenue and a 9.9% increase in net income. All financial figures were prepared in accordance with TIFRS on a consolidated basis.

(Photo credit: TSMC)

In US dollars, TSMC’s second quarter revenue reached USD 20.82 billion, marking a 32.8% year-over-year increase and a 10.3% increase from the previous quarter. The quarter saw a gross margin of 53.2%, an operating margin of 42.5%, and a net profit margin of 36.8%.

During the second quarter, sales of 3-nanometer chips accounted for 15% (up from 9% of the first quarter) of total wafer revenue, while 5-nanometer chips accounted for 35%, and 7-nanometer chips accounted for 17%. Advanced technologies, including 7-nanometer and more advanced chips, constituted 67% of total wafer revenue.

(Photo credit: TSMC)

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• [News] TSMC Reportedly Sees Strong 4nm Demand, with NVIDIA’s Order Up by 25%
• [News] TSMC and Intel Boost Their 2025 Capital Spending to Lead in the AI Era

(Photo credit: TSMC)

On July 17th, silicon wafer giant GlobalWafers announced that it is setting up a research and development center in Sherman, Texas, and constructing a 12-inch silicon wafer production line in St. Peters, Missouri. This move is expected to strengthen its US semiconductor supply chain. It is worth noting that the company has signed a preliminary memorandum of understanding with the US Department of Commerce and will receive a USD 400 million subsidy under the CHIPS Act.

US Secretary of Commerce Gina Raimondo noted that the US government is revitalizing the leadership position of the US semiconductor supply chain, encompassing materials, manufacturing, and R&D. GlobalWafers’ investment will enhance the US’s role in the semiconductor supply chain, provide locally sourced silicon wafers needed for advanced processes, and bolster the security of the supply chain.

GlobalWafers stated that its subsidiaries, GlobalWafers America (GWA) and MEMC, have signed a non-binding preliminary memorandum of understanding with the US Department of Commerce. Under the US CHIPS and Science Act, they will receive a USD 400 million subsidy, which is expected to be used for the construction costs of the Texas and St. Peters plants.

Upon completion, its production base in Sherman, Texas, will be the first advanced silicon wafer plant in the US with an integrated process in over 20 years.

At the Sherman, Texas production base, the initial phase of construction will create 1,200 jobs. Additionally, there will be 750 high-paying positions for production operators, technicians, and engineers in the future, with mass production expected to begin in 2026.

Once the St. Peters, Missouri plant is completed, it will be the only advanced 12-inch SOI  wafer production base in the US. It is expected to create 500 construction jobs and 130 high-paying positions.

Among the top 5 companies globally controlling over 80% of the 12-inch silicon wafer market, including GlobalWafers, 90% of these wafers are currently produced in East Asia. As per the plan, GlobalWafers’ plant in Sherman, Texas, will manufacture wafers for advanced, mature, and memory chips, while the St. Peters, Missouri plant will focus on wafers for defense and aerospace applications.

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• [News] Announcement on Additional Subsidies for Chip Act Expected This Week; Intel Could Receive Billions
• [News] US Allocates USD 39 Billion Subsidy to Semiconductor Industry for Establishing Plants

(Photo credit: GlobalWafers)