While still working in the final stage of HBM3e qualification with NVIDIA, Samsung Electronics is also advancing in the AI memory market with custom high bandwidth memory (HBM) solutions. According to reports by PassionateGeekz and China Flash Market, the memory giant is collaborating with major clients, such as AMD and Apple, to develop tailored HBM products, which are expected to be commercially available in the era of HBM4.

Citing Choi Jang-seok, head of Samsung’s new business planning team at memory division, the reports note that many customers of Samsung are switching from traditional, general HBM to customized products, as the latter promises better performance, power and area (PPA), while offering greater value than current options.

PassionateGeekz notes that at the Samsung Foundry Forum 2024 earlier this week, Choi further highlighted two forms of customized HBM Samsung has been developing. It is worth noting that Samsung is developing a large-capacity HBM4 memory with a single stack capacity of 48GB, which is expected to enter production in 2025.

On the other hand, Samsung also illustrated the innovation of the 3D stacking of HBM DRAM and customer-specific logic chips. By bypassing the interposer and base die required in the existing 2.5D packaging solution, the HBM chip can be directly integrated into the computing SoC in 3D. Samsung’s custom HBM, therefore, by eliminating intermediaries and substrates, can significantly reduce power and area.

TrendForce also observed that for HBM4, standard processes and capacities have been settled. The three major suppliers are in the development stage, with each buyer initiating custom requests. For future generations of HBM, new directions have been proposed, as HBM may no longer be just arranged next to the SoC main chip but could also stack directly on top of it.

While all the options are still under feasibility discussion and not finalized, TrendForce believes the future HBM industry will shift towards more customized production. Compared to other DRAM products, this approach aims to break away from the framework of commodity DRAM in terms of pricing and design, offering more specialized solutions.

Read more

• [News] Samsung Establishes New HBM Team to Advance HBM3, HBM3e and HBM4 Development
• [News] Overview of Expansion Plans by HBM Giants

(Photo credit: Samsung)

According to an official release of Japanese semiconductor supplier Resonac, the “US-JOINT” alliance, comprising major semiconductor manufacturing companies from Japan and the United States, has been established to focus on next-generation semiconductor packaging. From Japan, six companies are participating, led by Resonac, MEC, Urvac, Namix, TOK, and Towa. The US participants include Azimuth, KLA, Kulicke & Soffa, and Moses Lake Industries.

In this alliance, Japanese companies primarily represent the materials sector, while the US companies include not only a materials company (Moses Lake) but also a packaging equipment company (Kulicke & Soffa), a measurement and inspection company (KLA), and a packaging services company (Azimuth).

Reportedly, US-JOINT will jointly establish a research center in the United States and plans to set up a base in California in the second half of this year. The construction of cleanrooms and the installation of equipment will begin, with the goal of starting operations next year.

As per industry sources cited by the China Flash Market, it is believed that the formation of this alliance primarily targets the US semiconductor market. The US is home to many world-class technology companies, such as NVIDIA, Qualcomm, and AMD, which are key customers in the high-tech packaging market.

Read more

• [News] TSMC Reportedly Secures Another AI Opportunity, Winning Order from SK Hynix
• [News] Booming Sales of Japanese Semiconductor Equipment Continue to Break Records, Reportedly Surpassing JPY 300 Billion

(Photo credit: Resonac)

According to a report from BusinessKorea, memory giant SK hynix is deepening its collaboration with TSMC and NVIDIA, and will announce a closer partnership at the Semicon Taiwan exhibition in September.

SK hynix has been collaborating with TSMC for many years. In 2022, TSMC announced the establishment of the OIP 3DFabric Alliance at its North America Technology Symposium, incorporating partners in memory and packaging.

At that time, Kangwook Lee, Senior Vice President and PKG Development Lead at SK hynix, revealed that the company has been closely working with TSMC on previous generations and current high-bandwidth memory (HBM) technologies, supporting compatibility with the CoWoS process and HBM interconnectivity.

After joining the 3DFabric Alliance, SK hynix reportedly plans to deepen its collaboration with TSMC to develop solutions for the next generation of HBM, looking to achieve innovations in system-level products.

SK hynix President, Justin Kim, is reportedly said to be delivering a keynote speech at the International Semiconductor Exhibition in Taipei in September, marking SK hynix’s first participation in such a keynote address. Following the speech, Kim will engage in discussions with senior executives from TSMC, possibly including NVIDIA CEO Jensen Huang, to discuss collaborative plans for the next generation of HBM. This move is expected to further solidify the trilateral alliance between SK hynix, TSMC, and NVIDIA.

Notably, the collaboration among the three giants was hinted in the first half of this year. On April 25th, SK Group Chairman Chey Tae-won traveled to Silicon Valley to meet with NVIDIA CEO Jensen Huang, potentially related to these strategies.

Reportedly, SK hynix will adopt TSMC’s logic process to manufacture the base die for HBM (High Bandwidth Memory). Reports indicate that SK hynix and TSMC have agreed to collaborate on the development and production of HBM4, scheduled for mass production in 2026.

HBM stacks core chips vertically on the base die, which are interconnected. While SK hynix currently produces HBM3e using its own process for the base die, it will switch to TSMC’s advanced logic process for HBM4. The same report further suggested that SK hynix will highlight achievements at forums, including achieving more than a 20% reduction in power consumption compared to initial targets for HBM4.

Read more

• [News] TSMC Reportedly Secures Another AI Opportunity, Winning Order from SK Hynix
• [News] Booming Sales of Japanese Semiconductor Equipment Continue to Break Records, Reportedly Surpassing JPY 300 Billion

(Photo credit: SK hynix)

This year, global semiconductor manufacturing equipment sales are expected to grow and set a new historical record. It is estimated that next year will see even more robust growth, with an anticipated increase of 17%.

According to the forecast report from the International Semiconductor Industry Association (SEMI) released on July 10th, it’s indicated that global chip equipment sales in 2024 are estimated to increase by 3.4% year-over-year to USD 109 billion, surpassing the USD 107.4 billion record set in 2022. Furthermore, 2025 is projected to show even stronger growth, with sales expected to surge to USD 128 billion, breaking the record set in 2024.

“The growth in total semiconductor manufacturing equipment sales already underway this year is forecast to be followed by a robust expansion of roughly 17% in 2025,” said Ajit Manocha, SEMI president and CEO. “The global semiconductor industry is demonstrating its strong fundamentals and growth potential supporting the diverse range of disruptive applications emerging from the Artificial Intelligence wave.”

SEMI noted that due to continued strong equipment investment in China and increased investment in DRAM and HBM driven by AI computing, global sales of wafer fab equipment (WFE) in 2024 are estimated to grow by 2.8% year-over-year to USD 98 billion.

This is a significant upward revision from the previous estimate of USD 93 billion made in December and surpasses the USD 96 billion recorded in 2023, setting a new historical high. With the increased demand for advanced logic and memory applications, global WFE sales in 2025 are projected to increase by 14.7% year-over-year to USD 113 billion.

SEMI further stated that until 2025, China, Taiwan, and South Korea are expected to remain the top three countries in chip equipment investment. Due to continued growth in China’s equipment procurement, China is expected to maintain its leading position throughout the forecast period (up to 2025). Equipment shipments to the Chinese market in 2024 are estimated to exceed USD 35 billion, setting a new historical high, solidifying China’s unshakable lead. However, due to large-scale investments in China over the three-year period ending in 2024, it is anticipated that investments will decrease in 2025.

Chip equipment giant Tokyo Electron (TEL) announced in a press release on May 10 that starting in the second half of this year, the demand for DDR5 and HBM will increase, driving a projected recovery in investments in the most advanced DRAM.

As a result, the global market size for front-end chip manufacturing equipment in 2024 is projected to grow by 5% year-on-year to approximately 100 billion USD, matching the current historical high recorded in 2022 (around USD 100 billion). Additionally, with continued growth in AI servers and a recovery in demand for PCs and smartphones, the WFE market is anticipated to see a double-digit increase (over 10%) in 2025 compared to 2024.

In a financial report press release on May 9, semiconductor equipment company Screen Holdings stated that due to investments in mature processes in China and investments in the most advanced processes in Taiwan, the WFE market is expected to grow in 2024, with an estimated annual increase of about 5%.

Per a report by Nikkei on July 5th, SEAJ’s forecast report indicates that for the 2024 fiscal year (April 2024 to March 2025), the sales of Japanese-made chip equipment (including sales by Japanese companies both domestically and overseas) have been increased to JPY 4.2522 trillion, marking a significant increase of 15.0% compared to the 2023 fiscal year.

This will be the first time annual sales break the 4 trillion yen mark, setting a new historical record. The main drivers are the widespread adoption of AI, leading to extremely strong demand for GPUs used in AI servers, and the continued surge in demand for HBM used in conjunction with these GPUs.

According to a report from Economic Daily News, Foxconn Group is advancing into the field of advanced packaging with a strategic alliance between Taiwan and Japan, focusing on the trending panel-level fan-out packaging (FOPLP). Following Innolux’s related developments in Taiwan, another of Foxconn’s invested companies, Sharp, has announced its entry into panel-level fan-out packaging in Japan, with production capacity expected in 2026.

Foxconn Group already possesses a comprehensive capability in the AI sector, and with the key advanced packaging technology now in place, they are fully mobilized. On the other hand, Sharp is undergoing a major transformation, which also benefits Foxconn— as its subsidiary Foxconn Technology is a major shareholder in Sharp, and Pan International is a partner with Sharp, both of which stand to gain from this transformation and provide support for it.

Pan International has previously collaborated with Sharp in areas such as wire harnesses, PCBs, and optical components, and has also acted as a distributor for Sharp’s panels and optoelectronic components. With Foxconn Chairman Young Liu concurrently serving as Sharp’s chairman, along with Sharp scaling down its panel business and expanding its semiconductor operations, there is significant interest in whether there will be new collaborations between the two companies.

Earlier, Sharp announced that it is partnering with Japanese electronic component manufacturer Aoi Electronics to advance into the field of advanced packaging. Reportedly, an agreement has been signed between Aoi, Sharp, and Sharp Display Technology, under which Aoi will utilize Sharp’s panel facilities to build a semiconductor back-end process production line. In 2024, Aoi will establish an advanced semiconductor panel packaging production line at Sharp’s Mie Plant, aiming for full-scale production by 2026 with a monthly capacity of 20,000 wafers.

Nikkei previously reported that Sharp continues to downsize its panel plants while expanding semiconductor production. Sharp noted that the advanced packaging production line will be used to produce Aoi’s FOLP. According to the agreement, the three companies are considering cooperation in the semiconductor back-end process to expedite the establishment of production lines and achieve full-scale production.

Read more

• [News] Foxconn’s Young Liu Newly Elected as Sharp’s Chairman to Assist Transformation
• Sharp Announces Closure of Sakai Gen 10 Line, Supply Cut of 5 Million TV Panels Expected in 2025, Says TrendForce

(Photo credit: Foxconn)