As South Korean memory giant SK hynix claimed that its HBM development speed has surpassed NVIDIA’s request, U.S.-headquartered Micron is also working on the next-gen HBM product at full throttle. According to a report from ETNews, Micron is currently conducting final equipment tests for the HBM3E...

According to a report from ijiwei, citing Nikkei, sources indicate that China is intensifying export inspections on Apple and other U.S. tech companies, hindering these American companies' expansion efforts in Southeast Asia and India. The enhanced customs checks are reportedly related to dual-us...

Ahead of TSMC’s earnings call on January 16th, market rumors have been circulating that the foundry giant’s largest clients are slashing their CoWoS-S orders. According to Commercial Times, AMD and Broadcom are reportedly releasing the CoWoS-S capacity they previously booked due to slowing deman...

Recently, U.S.-based memory giant Micron Technology announced the groundbreaking of a new HBM (High Bandwidth Memory) advanced packaging facility in Singapore. This facility will be the first of its kind in Singapore and is scheduled to begin operations in 2026. Starting in 2027, Micron’s advan...

According to a report from ijiwei, citing Bloomberg, previously in 2022 STMicroelectronics and GlobalFoundries announced a EUR 5.7 billion investment plan to construct a wafer fabrication plant in France. However, this joint venture project has since stalled. Meanwhile, ijiwei notes that while cons...