Ahead of Western Digital’s upcoming spin-off, a major personnel shake-up has already taken place, as the memory giant's Executive Vice President and General Manager, Robert Soderbery, who leads the NAND and SSD business unit, will step down on January 2, according to a report from Blocks and Files...

United Microelectronics Corporation (UMC) is making significant strides in the advanced packaging sector, breaking new ground in a market traditionally dominated by TSMC. According to a report by Economic Daily News, UMC has secured a major advanced packaging order from Qualcomm for high-performance...

NVIDIA might face the risk of losing key customers as delays plague its next-gen smart driving chip, Thor. According to a report from 36Kr, China’s electric vehicle giant Xpeng is considering shelving its plans to integrate the chip, as the US chip giant is said to postpone Thor’s mass productio...

Samsung’s new head of its foundry business, Han Jin-man, stated last week that the semiconductor giant will work on a "two-track strategy" aimed at closing the technology gap with TSMC and countering competition from followers, such as China's SMIC. Now, to further secure its leadership on legacy ...

According to a report from Chosun Biz, SK hynix is expanding its HBM production capacity at the Cheongju M15X fab to address ongoing market supply shortages, with AI demand expected to continue outpacing HBM supply in 2025. To support this expansion, the company plans to transfer some of its DRAM wo...