According to TrendForce’s latest memory spot price trend report, neither did the DRAM nor NAND spot prices sees much momentum. DDR5 products are relatively stable, while the spot prices of DDR4 products continue to fall gradually due to high inventory levels. As for NAND flash, the spot market saw no apparent changes from last week at a restricted level of transactions also due to sufficient inventory. Details are as follows:

DRAM Spot Price:

The market has not shown notable changes in terms of momentum, and spot prices of DDR5 products are relatively stable. As for DDR4 products, spot prices continue to fall gradually due to high inventory levels. Overall, spot trading is quite limited in terms of volume due to the constraint imposed by weak consumer demand. The average spot price of the mainstream chips (i.e., DDR4 1Gx8 2666MT/s) dropped by 0.10% from US$1.991 last week to US$1.989 this week.

NAND Flash Spot Price:

The spot market saw no apparent changes from last week at a restricted level of transactions also due to sufficient inventory. Spot prices of 512Gb TLC wafers have risen by 1.17% this week, arriving at US$3.291.

According to a report from Reuters citing industry sources, Samsung Electronics’ fifth-generation high-bandwidth memory (HBM3e) have passed tests by NVIDIA and could be used in NVIDIA’s AI processors.

The report further indicates that while no supply contract has been signed yet, one is expected soon, with potential deliveries starting in the fourth quarter of this year. The news also notes that the tested HBM3e chips are 8-layer, while Samsung’s 12-layer HBM3e have yet passed test.

However, in response to the matter, Samsung Electronics stated in a report from BusinessKorea on August 7 that they could not confirm stories related to their customers and that the report was not true.

The Samsung Electronics official cited by BusinessKorea also mentioned that, as previously stated during a conference call last month, the quality testing is still ongoing and there have been no updates since then.

Samsung had been working since last year to become a supplier of NVIDIA’s HBM3 and HBM3e. In late July, it is said that Samsung’s HBM3 has passed NVIDIA’s qualification, and would be used in the AI giant’s H20, which has been developed for the Chinese market in compliance with U.S. export controls.

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• [News] Samsung’s HBM3e Rumored to be Certified by NVIDIA, Boosting DDR5 Price Increases in Q3
• [News] Samsung’s HBM3e Reportedly Passed NVIDIA’s Certification Though It Denies the Rumor

(Photo credit: Samsung)

While surrounded by concerns raised by the USD 1.6 billion net loss in Q2 and the large-scale layoff plan, Intel has finally shared some good news. It announced on August 6^th that its next-gen 18A process has achieved a major milestone, and will start production in 2025.

The semiconductor giant states that the milestone has been achieved less than two quarters after tape-out, and confirms that two of its next-gen products, Panther Lake (AI PC client processor) and Clearwater Forest (server processor), will be fabricated with the node. The first external customer is expected to tape out on Intel 18A in the first half of next year, according to its press release.

The company also gives an advance notice on the progress of the aforementioned two processors. According to Intel, Clearwater Forest will mark the industry’s first mass-produced, high-performance solution combining RibbonFET, PowerVia, and Foveros Direct 3D for higher density and power handling. In addition, Panther Lake DDR memory performance is already running at target frequency.

Earlier in July, Intel released the 18A Process Design Kit (PDK) 1.0, design tools that enable foundry customers to harness the capabilities of RibbonFET gate-all-around transistor architecture and PowerVia backside power delivery in their designs on Intel 18A.

It is worth noting that Intel’s 18A is the company’s second fabrication technology, following 20A, to employ RibbonFET and PowerVia. A report by Tom’s Hardware notes that compared to Intel’s 2nm-class node, 18A offers an optimized RibbonFET design and additional enhancements, resulting in a 10% increase in performance per watt, which makes it especially fitted for data center-class products that require significant power.

The report also notes that Intel 18A is a process that Intel Foundry’s potential customers are very interested in, as some believed it to be more competitive than TSMC’s 3nm and 2nm-class offerings, which are expected to be available between 2024 and 2025.

On the other hand, TSMC, the global foundry leader, said earlier in the earnings call that it’s 2nm (N2) node is progressing well, and will begin mass production in 2025. The company is also on track to launch the N2P and A16 processes in the second half of 2026.

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• [News] NVIDIA’s Backup Plan? Intel Reportedly Secures Packaging Orders from the AI Giant
• [News] Intel’s Earnings Fall Short, Cutting Over 15% of Workforce

(Photo credit: Intel)

Super Micro Computer, Inc. (Supermicro), a provider of servers and storage solutions, released its financial results for the fourth quarter of the fiscal year 2024 (ending June 30, 2024) on August 6. The revenue increased by 143.6% year-over-year (37.9% quarter-over-quarter) to USD 5.31 billion. The Non-GAAP diluted earnings per share (EPS) rose by 78.1% year-over-year (decreased by 6% quarter-over-quarter) to $6.25.

Supermicro forecasts that for the first quarter of the fiscal year 2025 (ending September 30, 2024), revenue will be between USD 6 billion and 7 billion (midpoint of USD 6.5 billion), and the Non-GAAP diluted EPS is expected to be between $6.69 and $8.27 (midpoint of $7.48).

Additionally, for the fiscal year 2025 (ending June 30, 2025), revenue is projected to be between USD 26 billion and 30 billion (midpoint of USD 28 billion). A report from MoneyDJ further cite sources, indicating that Supermicro’s fiscal year 2025 revenue is expected to reach USD 23.4 billion.

According to the Q4 financial report for the fiscal year 2024 released by Supermicro, the gross margin decreased from 17.0% in the same period last year to 11.2%, the lowest since the company started reporting quarterly results in May 2007 , and below the 15.5% reported in the third quarter of the fiscal year 2024.

Per wccftech’s report, the Super Micro earnings call marked the first opportunity to engage with a company integrated into NVIDIA’s AI ecosystem. Consequently, the company’s management faced numerous questions about potential GPU delays impacting its financial performance.

In response, Charles Liang, Supermicro’s Chief Executive Officer and Chairman of the Board, acknowledged that his company had heard about potential delays from NVIDIA.

However, he emphasized that Supermicro considers such delays as a normal possibility, noting that technology companies often experience slight advancements or postponements in their schedules.

In this instance, it seemed to Liang that NVIDIA had pushed out its timeline slightly, which he stated would not impact Supermicro’s ability to offer its customers new solutions like the H200 cooling system, given their extensive customer base. He concluded by saying that the overall impact of this delay on Supermicro should be minimal.

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• [News] Foxconn Remains Unfazed Despite NVIDIA’s GB200 Delay, with Customers Aim to Secure Their Orders
• [News] Supermicro President Charles Liang Bullish on Direct Liquid Cooling, Targeting a 15% Market Share within Next Year

(Photo credit: Supermicro)

SK hynix, the current High Bandwidth Memory (HBM) market leader, announced on August 6^th that it has signed a non-binding preliminary memorandum of terms with the U.S. Department of Commerce to receive up to USD 450 million in proposed direct funding and access to proposed loans of USD 500 million as part of the CHIPS and Science Act. The funding, according to its press release, will be used to build a production base for semiconductor packaging in Indiana.

Earlier in April, the other two memory giants, Samsung and Micron, have secured funds under the CHIPS and Science Act as well, receiving USD 6.4 billion and USD 6.1 billion, respectively.

SK hynix also noted in its press release that it plans to seek from the U.S. Department of the Treasury a tax benefit equivalent of up to 25% of the qualified capital expenditures through the Investment Tax Credit program.

The South Korean memory chip maker also said that it will proceed with the construction of the Indiana production base as planned to provide AI memory products. Through this, it looks forward to contributing to build a more resilient supply chain of the global semiconductor industry.

The signing follows SK hynix’s announcement in April that it plans to invest USD 3.87 billion to build a production base for advanced packaging in Indiana in a move expected to create around 1,000 jobs. According to a previous report by The Wall Street Journal, the advanced packaging fab it is expected to commence operations by 2028.

As the major HBM supplier of AI giant NVIDIA, SK hynix has good reason to accelerate the pace of capacity expansion. The recent NVIDIA Blackwell B200, with each GPU utilizing 8 HBM3e chips, has also underscored SK hynix’s role in the critical components supply chain for the AI industry.

On the other hand, a week earlier, semiconductor equipment leader Applied Materials was said to be rejected for funding under the CHIPS act for a R&D center in Silicon Valley, which targets to develop next-generation chipmaking tools. It has tried to gain U.S. funding for a USD 4 billion facility in Sunnyvale, California, which was slated to be completed in 2026.

Read more

• [News] SK Hynix Reportedly Plans to Invest USD 4 Billion in Advanced Packaging Fab in Indiana
• [News] Samsung Receives USD 6.4 Billion Subsidy from US Government, Less than Intel and TSMC

(Photo credit: SK hynix)