Semiconductors


2024-09-13

[News] Altera CEO Denies Rumors for Sale, Claiming IPO Plan by 2026 Remains Unchanged

Ahead of Intel’s upcoming board meeting in mid-September, rumors have been circulating that the struggling giant may be mulling to selling its FPGA unit Altera, with AMD and Marvell being potential buyers. However, according to an interview with Altera’s CEO by CRN, Altera’s plan for an initia...

2024-09-13

[News] Intel Reportedly Sought Commerce Secretary Raimondo’s Help over U.S. Reliance on TSMC

In a last-ditch effort before the upcoming board meeting this week, Intel is said to be seeking assistance from the U.S. government. The latest report by CNBC notes that Intel CEO, Pat Gelsinger, turned to Commerce Secretary Gina Raimondo recently, expressing his disappointment with the heavy depend...

2024-09-13

[News] AI Server and Humanoid Robot, New Drivers for GaN Industry

In recent years, data center has been one of the key areas for GaN (Gallium Nitride) manufacturers to tap power electronics market, and GaN applications in the data center power supply market have taken a big step forward. Notably, the rise of AI technology has further fueled this market at present....

2024-09-12

[News] Loongson Zhongke Technology Claims Next-Generation Processor Performance “World Leading,” Set to Debut in 2H25

At its 2024 semi-annual results briefing, Loongson Zhongke Technology announced that the 3B6600 processor is expected to begin sampling in the first half of next year and be officially released in the second half. Per a report from IThome, Chairman and General Manager Hu Weiwu emphasized that thi...

2024-09-12

[News] ACM Research Launches Panel-Level Etching Tool, Expanding Its FOPLP Porfolio

ACM Research, Inc., a provider of wafer processing solutions for semiconductor and advanced wafer-level packaging applications in China, announced on September 3rd the release of its Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This new tool is de...

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