The U.S. Department of Commerce announced on June 24 the expansion of SelectTalentUSA, a joint initiative with the Departments of Labor and Education. The program, designed to provide technical assistance to foreign businesses in delivering recruitment and training programs for their U.S. workforce, will now include clients from Japan, South Korea, and Taiwan.

This move aims to better serve semiconductor and supply chain firms, along with other companies looking to establish or expand operations in the United States.

Launched in May 2023, SelectTalentUSA initially targeted Austria, Germany, Liechtenstein, and Switzerland, focusing on Registered Apprenticeships to foster cooperation and information exchange.

The initiative helps foreign investor companies form local and state partnerships, tailor their talent development strategies to the U.S. market, and leverage America’s diverse and skilled workforce.

The SelectUSA-led Interagency Investment Working Group (IIWG), comprising over 20 departments, supports SelectTalentUSA by increasing coordination and providing guidance on issues affecting business investment decisions. The IIWG connects foreign investors with resources and experts to establish quality training, education, and development programs.

During its pilot year, SelectUSA, along with the Departments of Labor and Education, conducted outreach to companies focusing on Registered Apprenticeships (RA). This effort has led to several companies signing, or nearing agreements to sign, RA standards with the Department of Labor to launch new U.S. training programs.

SelectTalentUSA promotes foreign direct investment that creates well-paying jobs in America, aligning with the Biden-Harris Administration’s goal of building an equitable economy and revitalizing overlooked communities. The program’s expansion allows more foreign investors to access the American workforce, build a skilled talent pipeline, and create quality job opportunities.

Additionally, it supports the goals of the CHIPS for America program, which aims to strengthen and revitalize the U.S. semiconductor research, development, and manufacturing sectors.

(Photo credit: TSMC)

Orders for thermal compression (TC) bonders from South Korean semiconductor equipment manufacturers are experiencing a surge, fueled by Samsung Electronics and SK Hynix ramping up their high-bandwidth memory (HBM) production. TC bonders play a pivotal role in HBM production by employing thermal compression to bond and stack chips on processed wafers, thereby significantly influencing HBM yield.

According to industry sources cited by The Chosun Daily, Samsung Electronics’ subsidiary SEMES has delivered nearly 100 TC bonders over the past year. Meanwhile, SK Hynix has inked a approximately $107.98 million contract with HANMI Semiconductor, which commands a 65% share of the TC bonder market.

Samsung Electronics and SK Hynix have developed distinct supply chains for thermal compression (TC) bonders. Samsung sources its equipment from Japan’s Toray and Sinkawa, as well as its subsidiary SEMES. In contrast, SK Hynix relies on Singapore’s ASMPT, HANMI Semiconductor, and Hanhwa Precision Machinery. Since last year, both companies have intensified localization efforts to decrease reliance on foreign equipment.

According to the Chosun Daily, HANMI Semiconductor, which co-developed TC bonders with SK Hynix in 2017, provides equipment for SK Hynix’s MR-MUF process, using an adhesive-like material for bonding DRAM chips. While HANMI’s TC bonders are compatible with both TC-NCF and MR-MUF processes, they are currently supplied only to SK Hynix and Micron.

On the other hand, SEMES, a specialist in TC bonders for the TC-NCF process used in high-bandwidth memory (HBM) stacking, supplies its equipment to Samsung. SEMES aims to exceed 250 billion won in TC bonder sales this year, up from around 100 billion won last year.

Regarding the HBM market, TrendForce notes that HBM3e may become the market mainstream for 2024, which is expected to account for 35% of advanced process wafer input by the end of 2024.

(Photo credit: SK hynix)

On June 21, ASE Group announced that ASE Semiconductor will collaborate with Hung Ching Construction to build a K28 plant in Kaohsiung. The project is expected to be completed in the fourth quarter of 2026 and will focus on end testing of advanced packaging processes, and high-performance computing for artificial intelligence (AI) chip.

ASE’s CFO Dong Hongsi introduced that for the K28 plant construction project, ASE Semiconductor will provide the land it held in Kaohsiung while Hung Ching Construction will provide fund support. The plant will have one basement level and seven above-ground floors. As to the rights and value distribution between the two parties, ASE Semiconductor and Hung Ching Construction will respectively hold a share of 22.24% and 77.76%. Upon completion, ASE Semiconductor or its subsidiaries will have the first purchase rights for Hung Ching Construction’s property ownership.

It was reported previously that as an important part of the company’s operational plans, ASE’s Kaohsiung plant had purchased land in Tashe for phased development in a bid to  address the demands for end testing of advanced packaging processes, AI chip high-performance computing, and heat dissipation needs. Phase one, the K27 plant, was completed in 2023, primarily setting up Flip Chip and IC testing production lines.

At a financial result briefing in February this year, ASE stated that to expand advanced packaging capacity, this year’s overall capital expenditure will increase by 40% to 50%, reaching a historical high. Of this, 65% will be allocated to packaging, especially advanced packaging projects, with over 60% used for packaging testing and 30% for electronic manufacturing services.

Moreover, ASE is optimistic about the potential of AI technology and expects AI revenue contributions to double to USD 500 million by the end of 2024 compared to 2023. AI-related revenue is expected to account for a single-digit percentage of the total ATM (Packaging and test) business this year, surpassing last year’s low single digit. And the industry anticipates that next year’s proportion could reach a high single-digit percentage.

Advanced packaging industry has been in high gear in recent years, and ASE has made significant investment in this area over the past two years. In February this year, Infineon and ASE announced that ASE would invest approximately TWD 2.1 billion to acquire Infineon’s two backend assembly and test plants in Philippines and South Korea. This acquisition aims to expand ASE’s  power chip module packaging & test and lead frame packaging for automotive and industrial automation applications, with the transaction expected to be completed by the end of 2Q24.

On January 19, ASE announced that its Malaysian subsidiary would invest MYR 69.696 million to acquire land use right in the Gardenia Tech Park in Penang, Malaysia to meet operational needs. Industry analysts believed this investment was primarily for expanding advanced packaging capacity. It was reported that ASE Semiconductor has been actively expanding its packaging and test capacity in Malaysia. In November 2022, its new factories 4 and 5 in Penang broke ground, with construction expected to be completed by 2025.

Additionally, in late December 2023, ASE Semiconductor announced that it had leased the 7th floors of both K21 and K22 buildings from ASE TEST in Kaohsiung’s Nanzi district to expand its packaging capacity. The industry believed that the intention was to increase its advanced packaging capacity for AI chip.

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• [News] ASE Sets Up New Facility in Kaohsiung for Advanced Packaging, Targeting Completion in 2026
• [News] ASE Expands Production at Kaohsiung Plant, Focusing on Advanced Packaging for AI Chips

According to a report from Reuters, it’s rumored that ByteDance, the parent company of TikTok, is collaborating with American chip designer Broadcom to develop an advanced AI processor, which could provide ByteDance with a steady supply of high-end chips.

On June 24th, Reuters’ report cited sources, stating that the 5nm Application-Specific Integrated Circuit (ASIC) being developed by the two companies will comply with U.S. export control regulations and will be manufactured by TSMC.

Since the introduction of advanced chip export controls by Washington in 2022, no public announcements have been made regarding the development of 5nm or more advanced chips in collaboration between Chinese and American companies.

The sources cited by the same report indicate that ByteDance’s collaboration with existing partner Broadcom can help reduce procurement costs and ensure a stable supply of high-end chips. However, TSMC will not start manufacturing this new chip this year. According to Reuters citing other sources, although the two companies have already begun the design process, they have yet reached the tape-out stage, which signifies the completion of the design phase and readiness for manufacturing.

Securing a reliable source of AI chips is crucial for ByteDance’s algorithms. In addition to TikTok, the company operates numerous popular apps, including “Doubao,” an AI chatbot service similar to ChatGPT. The report further suggests that ByteDance stockpiled a significant number of NVIDIA chips, including A100, H100, A800, and H800, ahead of the initial round of U.S. sanctions. In 2023, ByteDance allocated USD 2 billion for purchasing NVIDIA chips.

Per another previous report from Reuters, it indicated that in response to U.S. sanctions, some Chinese AI chip manufacturers decided to downgrade their self-designed processors to avoid being cut off from TSMC’s foundry services. Reportedly, MetaX and Enflame entrusted downgraded chip design schematics to TSMC late last year to comply with U.S. regulations. These two leading Chinese AI chipmakers had previously claimed that their chips could rival NVIDIA’s GPUs in performance.

The downgraded AI chips designed by NVIDIA specifically for the Chinese market, including the most advanced model “H20,” reportedly received a lackluster initial market response. Due to abundant supply and forced price reductions, currently, the H20 is reportedly cheaper than competing chips from Huawei. The chip is reportedly to be sold at approximately 100,000 yuan per unit, while Huawei 910B sold at over 120,000 yuan per unit.

A previous report by The Information also indicated that major tech companies such as Alibaba, Baidu, ByteDance, and Tencent have been instructed to reduce their spending on foreign-made chips like NVIDIA’s.

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• [News] NVIDIA Reportedly Facing Price Cut Pressure of H20 Chip in China Amid Competition with Huawei

(Photo credit: Broadcom)

According to a report by Korean media outlet Business Korea, SK Hynix recently shared its latest breakthrough on its 3D DRAM at VLSI 2024 last week, announcing that the manufacturing yield of its 5-layer stacked 3D DRAM has reached 56.1%.

This means that out of roughly 1,000 3D DRAM units manufactured on a single test wafer, about 561 functional devices were successfully manufactured, the report further explains. The experimental 3D DRAM exhibits characteristics similar to the currently used 2D DRAM, marking the first time SK Hynix has disclosed specific numbers and characteristics of its 3D DRAM development.

However, SK Hynix also noted that while 3D DRAM holds great potential, a significant amount of development is still required before it can be commercialized. The memory giant also reportedly pointed out that unlike the stable operation of 2D DRAM, 3D DRAM exhibits unstable performance characteristics, and stacking 32 to 192 layers of memory cells is necessary for widespread use.

3D DRAM is also a key development area for other major memory manufacturers like Samsung Electronics and Micron. Samsung Electronics has successfully stacked 3D DRAM up to 16 layers and plans to mass-produce 3D DRAM around 2030. Micron currently holds 30 patents related to 3D DRAM, and if there are breakthroughs in 3D DRAM technology, it could produce better DRAM products than existing ones without the need for EUV equipment.

The DRAM market remains highly concentrated, currently dominated by key players such as Samsung Electronics, SK Hynix, and Micron Technology, collectively holding over 96% of the entire market share.

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• [News] Samsung and SK hynix to Implement Hybrid Bonding with 3D DRAM
• [News] The Quiet Beginning of the 3D DRAM Market Share Battle

(Photo credit: SK Hynix)