As the chip war heats up, the U.S. BIS unveiled an updated semiconductor whitelist on February 4, per its website. Commercial Times reports that the list, split into IC design (IW) and packaging & foundry (PW) categories, is likely to spark a shift in chip orders from China—a boost for Taiwan�...

The rapid development of AI, HPC, and other technologies is driving higher demands for semiconductor performance and energy efficiency. Traditional packaging technologies struggle to meet the needs of the AI era, creating an opportunity for advanced semiconductor packaging technologies to shine. ...

According to a report in Commercial Times, the leading Chinese semiconductor foundry, SMIC (Semiconductor Manufacturing International Corporation), released its financial report for the third quarter on the evening of November 7. Due to robust growth in wafer production capacity and sales, SMIC's re...

Driven by the massive demand for AI chips, advanced packaging is in short supply, and the development of three major advanced packaging technologies CoWoS, SoIC, and FOPLP is booming. In addition, two major billion-dollar projects in China have made recent progress, further advancing the region's ad...

In mid-August, TSMC had signed a contract with panel manufacturer Innolux to purchase its plant and facilities located in southern Taiwan, eyeing to further expand its advanced packaging capacity. According to a report by China Times, the fab, designated as the AP8 facility, is expected to start pro...