Intel has secured its supply of the new High-NA EUV (high-numerical aperture extreme ultraviolet) lithography equipment from ASML, which the semiconductor heavyweight will allegedly use on its 18A (1.8nm) and 14A (1.4nm) nodes, according to reports from TheElec and Wccftech. According to sources ...

Wafer foundries' mature process continues to suffer from oversupply, facing further price reduction pressure. According to a report from Economic Daily News, industry sources from IC design companies revealed that in this quarter, prices for certain mature processes have dropped by single-digit per...

Samsung Electronics and Synopsys jointly announced that the former has successfully taped out its first mobile system-on-chip (SoC) with its 3nm gate-all-around (GAA) process. According to Synopsys, Samsung used the Synopsys.ai EDA suite to help with the SoC’s layouts as well as design verificatio...

TSMC unveiled its angstrom-class A16 advanced process during the Company’s 2024 North America Technology Symposium on April 25, set to be mass-produced in 2026. Not only is this earlier than competitors like Intel's 14A and Samsung's SF14, both slated for 2027 production, but TSMC also emphasized ...

With the semiconductor market facing uncertainties and limited signs of industry recovery in the first half of 2024, foundries in China, Taiwan, and South Korea are all implementing price reductions to secure orders and solidify customer relationships. According to TechNews citing from supply cha...