On January 16, Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding, officially inaugurated its new advanced packaging facility at the Tanzi Science Park. SPIL also announced that three additional advanced packaging facilities are set to expand production capacity by 2025....

Recently, two major acquisition announcements have made waves in the semiconductor industry: Onsemi has completed its acquisition of Qorvo's silicon carbide (SiC) JFET technology, and Lenovo has acquired the Israeli enterprise storage company Infinidat. Onsemi Completes Acquisition of Qorvo's SiC...

In 2025, China has introduced a new round of “national subsidies,” further expanding the scope of its policy. In addition to continuing subsidies for televisions, PCs, and other electronics, products such as smartphones, tablets, and smartwatches have been included in the subsidy program as of J...

Recently, leading foundries GlobalFoundries and TSMC have both ramped up efforts in advanced packaging, while the U.S. Department of Commerce has increased subsidies for advanced packaging technologies. GlobalFoundries Invests $575 million in Advanced Packaging and Photonics Center On January ...

In the era of big data, artificial intelligence (AI), and cloud computing, Compute Express Link (CXL) technology has emerged as a next-generation high-speed interconnect standard. Designed to link CPUs/GPUs, memory, and other components in high-performance computing systems, CXL supports large-scale...