Looking at next-generation networks, a range of emerging technologies are playing pivotal roles. From ground-based B5G (Beyond 5G)/6G, Wi-Fi 7, and fixed wireless access (FWA), to non-terrestrial networks (NTNs) like low-orbit satellites, Taiwan-based companies are actively involved in shaping these...

DRAM Spot Market: In the spot market, the demand momentum has not been strong enough to push up prices further since the end of the Lunar New Year holiday. Hence, the overall transaction volume remains low. Demand is tepid for modules as buyers are relatively passive during the slow season. As fo...

The shortage of advanced packaging production capacity is anticipated to end earlier than expected. Industry suggests that Samsung’s inclusion in providing HBM3 production capacity has led to an increased supply of memory essential for advanced packaging. Coupled with TSMC's strategy of enhancing ...

According to Economic Daily News' report, after a prolonged period of economy downturn, the market has gradually become optimistic about memories. The effective production reduction by the top five memory manufacturers has led to an increase in memory prices. This, in turn, has prompted downstre...

As per a report from Taiwan's TechNews," TSMC, Samsung, and Intel have been actively deploying Backside Power Delivery Network (BSPDN) strategies recently, and have announced plans to incorporate BSPDN into their logic chip development roadmap. For instance, Samsung intends to implement BSPDN techno...