DRAM Spot Market: In the spot market, the demand momentum has not been strong enough to push up prices further since the end of the Lunar New Year holiday. Hence, the overall transaction volume remains low. Demand is tepid for modules as buyers are relatively passive during the slow season. As fo...

The shortage of advanced packaging production capacity is anticipated to end earlier than expected. Industry suggests that Samsung’s inclusion in providing HBM3 production capacity has led to an increased supply of memory essential for advanced packaging. Coupled with TSMC's strategy of enhancing ...

According to Economic Daily News' report, after a prolonged period of economy downturn, the market has gradually become optimistic about memories. The effective production reduction by the top five memory manufacturers has led to an increase in memory prices. This, in turn, has prompted downstre...

As per a report from Taiwan's TechNews," TSMC, Samsung, and Intel have been actively deploying Backside Power Delivery Network (BSPDN) strategies recently, and have announced plans to incorporate BSPDN into their logic chip development roadmap. For instance, Samsung intends to implement BSPDN techno...

With the advancements in AIGC models such as ChatGPT and Midjourney, we are witnessing the rise of more super-sized language models, opening up new possibilities for High-Performance Computing (HPC) platforms. According to TrendForce, by 2025, the global demand for computational resources in the ...