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With an Edge in Power Consumption and Color, Mini LEDs will Continue to See Higher Penetration Rates in High-End Display Markets, Says TrendForce
The latest Mini LED and HDR High-End Display Market Report by LEDinside, a division of TrendForce, reveals that Mini LED backlight displays all have a significant advantage in brightness, reliability and performance, as well as a chance to grab a slice of the high-end display market. It may even extend the lifetime of LCDs. It is predicted that Mini LED backlights in 2024 will enjoy penetration rates of 20%, 15% and 10% in the application markets of ITs, TVs and tablets, respectively.
TrendForce points out that, in comparing the features of OLED and Mini LED backlight displays, the local dimming feature of Mini LED backlight displays may rival OLEDs in their ability to contrast colors. Mini LEDs also have more competitive prices when compared to TV and monitor product applications, since Mini LED backlight displays exhibit display effects nearly equal to those of OLEDs, but the power consumption is much lower than OLED. This means that these products give a better value for money.
EPISTAR Develops Fast Transfer Technology to Enter Mini LED Backlight Market
With the rise of Mini LED backlight technology, the original industry chain changes. For example, panel manufacturers AUO and Innolux are both collaborating with their respective LED companies to develop Mini LED backlight modules: AUO has joined hands with Lextar, while Innolux is already working with companies such as AOT and Epileds, developing towards TV, IT, and small- and medium-sized automotive product applications and hoping to keep their competitive edge in LCD products. CSOT, BOE and others have partaken in Mini LED backlights and display businesses by leveraging their edge in product technology and equipment capex. Chip manufacturer EPISTAR has worked with subsidiary Yenrich to release Mini LED light source modules to enter the backlight applications of high-end display.
The key challenges of Mini LED backlight technology are cost, power consumption and die bonding efficiency. In terms of power consumption challenge, as current mounts and heat along with it, efficiency goes down. So far, EPISTAR has offered two different solutions to help customers meet their goal of reducing power consumption or cost. For power consumption, with the decrease of chip size and drive current, customers can improve full-screen power consumption with enhanced backlight dimming zone control. For cost, EPISTAR added innovative reflector with LED chips to increase the beam angle. So far, EPISTAR has been able to produce LED chips with special beam angle from 150 to 170 degrees to reduce the number of LED chips required as well as system production costs.
In addition, with the reduction of LED chip size and the increase in number, LED die bonding is becoming more and more difficult. EPISTAR and subsidiary Yenrich’s self-developed “Fast Transfer on X substrate” can precisely transfer Mini or Micro LED chips in large quantities on a variety of material substrates specified by customers.
TrendForce suggests that innovations in Mini LED backlight technology may bring advantages in display effect, but the new structure also places a heavier burden in costs, and striking a fine balance between the two has become a problem that suppliers along the whole supply chain must work together to solve. The fastest way to reduce costs would be to combine the strengths of relevant suppliers for backplanes, LED chips and driver ICs and module assembly companies and develop Mini LED products with better value. Mini LED chips will play an important role in that process. Chip suppliers turned market leaders and technological vanguards will hold an even greater advantage in the future.
2019 Mini LED and HDR High-End Display Market Report
Release Date: 30 April 2019
Format: PDF
Language: Traditional Chinese / English
Page: 100~112
Quarterly Update: Micro / Mini LED Market Prospective Analysis-Player Movement, New Technology Introduction, and Display Week / Touch Taiwan Exhibit Show Report (April, July, October 2019; 10-15 Pages / Quarterly)
Chapter 1 Mini LED Market Scale Analysis
2018-2023 Mini LED Output Value Analysis and Forecast
2018-2023 Mini LED Output Analysis and Forecast
2018-2023 Mini LED Backlight Display Penetration Rate Forecast
Chapter 2 Mini LED Definition and Application Advantages
Display Development Trend
The Origin of Miniaturized LED
Miniaturized LED Size Definition
LED Light Source for Display
Mini LED Backlight Product Highlights
Mini LED Backlight Product Highlight – Cost
Mini LED Backlight Product Highlight – Brightness
Mini LED Backlight Product Highlight – Contrast
Mini LED Backlight Product Highlight – Reliability
Mini LED Backlight Product Highlight – Slim
Comparison on Competitiveness of Various Displays
Chapter 3 Mini LED Backlight Product Application and Trend
Mini LED Backlight Module Display Processing Cost Structure
Mini LED – Chip Processing Cost Analysis
Mini LED – Die Bonding Processing Cost Analysis
Mini LED – PCB Processing Cost Analysis
Mini LED – Drive IC Processing Cost Analysis
Mini LED Backlight Display Application Product Overview
Mini LED Product Application Specification Overview
Cellphone Application Market Development Trend
Cellphone Application Market Cost Trend
Tablet Application Market Development Trend
Tablet Application Market Cost Trend
NB Application Market Development Trend
NB Application Market Cost Trend
Automotive Display Application Market Development Trend
Automotive Display Application Market Cost Trend
MNT Application Market Development Trend
MNT Application Market Cost Trend
TV Application Market Development Trend
TV Application Market Cost Trend
Chapter 4 Mini LED Technology and Challenge
Mini LED Technology and Challenge
Chip-Mini LED Chip Characteristics
Chip-Mini LED Flip Chip Structure
Chip-Mini LED Chip Light Shape Characteristics
Chip-Mini LED Chip Challenge Stepper Image
Probing and Sorting- Face Challenge Due to the Growth of Usage Volume
Probing and Sorting- Mini LED Chip Binning Challenge
Package-LED Package Technology Development Trend
Package-CSP Classification and Technology Challenge
Package-Mini LED Classification and Technology Challenge
Package-Comparison of Difference between Mini LED and CSP
SMT-Mini LED SMT Overview
SMT-SMD vs Mini LED Size Comparison
SMT-Mini LED SMT Problem Analysis
SMT-Pick and Place Problem Analysis
SMT-Mini LED Welding Technology Classification
SMT-Surface Mount Technology-Solder Paste Process
SMT-Solder Paste Processing Problem Analysis
SMT-Surface Mount Technology-Metal Eutectic Process
Color Conversion-Wide Color Gamut Display Solution Trend
Color Conversion-Wide Color Gamut Display Solution Specifications
Color Conversion- QD Backlight Display Technology Structure
Color Conversion-QD Backlight Technology Development Trend
Backplane-Display Backplane Structure
Light Source Backplane- Material and Drive Mode Classification
Light Source Backplane-Glass Substrate and Switch Component Characteristics
Light Source Backplane- Comparison of Difference of PCB Substrates
Light Source Backplane- Comparison of Backplane Technology Differences
Drive-Mini LED Active and Passive Drive Analysis
Drive-Mini LED Passive Drive Classification
Drive-Mini LED Passive Drive Light Source Module-Scan Mode
Drive-Mini LED Passive Drive Partition Drive IC Volume Evaluation
Drive-Mini LED Active Drive Light Source Module
Light Processing- Challenge in Uniformity of Mini LED Backlight
Light Processing- Calibration of Mini LED Backlight Display Disuniformity
Light Processing- Differential Analysis in Mini LED Image Splicing
Thinning- Evolution of Mini LED Backlight Display Light Source
Thinning- Mini LED Backlight Display Development Trend
Thinning- Trends in the Thinning of Mini LED Backlight Displays
Thinning- Challenge of Mini LED Backlight Display Thinning
Chapter 5 Mini LED Key Manufacturer News Analysis
Mini LED Backlight Supply Chain Analysis
Mini LED Sorting and Binning Equipment Manufacturer-SAULTECH
Mini LED Die Bonding Equipment Manufacturer- ASM Equipment and Inspection Solution
Mini LED Die Bonding Equipment Manufacturer- ASM in Industry 40
Mini LED Die Bonder Equipment Manufacturer-K&S
Mini LED Die Bonder Equipment Manufacturer-Rohinni
Mini LED Light Source Backplane Manufacturer-UNIFLEX
Mini LED Drive IC Manufacturer-Macroblock
Chapter 6 Mini LED Supply Chain and Manufacturer News Analysis
Mini LED Backlight Application Products Overview
Global Major Mini LED Backlight Manufacturers’ Supply Chain Analysis
Regional Manufacturer News Analysis-Taiwan Companies
Regional Manufacturer News Analysis – Mainland Chinese Companies
Further information, please contact:
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Global Contact: |
Taipei: |
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Shenzhen: |
|
Grace Li |
Eric Chang |
Paula Peng |
Perry Wang |
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+886-2-8978-6488 ext.916 |
+886-2-8978-6488 ext.822 |
+886-2-8978-6488 ext.820 |
+86-755-8283-8931 ext.6800 |
