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[News] SK hynix Reported to Deliver HBM4 Samples to NVIDIA in June, with Mass Production by Q3 2025


2025-01-16 Semiconductors editor

According to a report from ZDNet, SK hynix is reportedly planning to ship HBM4 samples to NVIDIA as early as June 2025, with full-scale product supply expected to begin around the end of the third quarter.

The report notes that NVIDIA initially planned to equip its next-generation high-performance GPU series, Rubin, with 12-layer stacked HBM4 by 2026. However, the schedule has been expedited, and NVIDIA is now targeting a launch in the second half of 2025.

In response, SK hynix is accelerating its HBM4 development efforts. The company has formed a dedicated development team to supply HBM4 to NVIDIA and completed the tape-out process for HBM4 in the fourth quarter of 2024, as the report highlights.

Following this, SK hynix has advanced its schedule to deliver HBM4 samples from the originally planned timeline in the second half of 2025 to June. These samples, referred to as customer samples, are provided to clients for certification before the start of mass production. As the report highlights, this step represents the final phase before HBM4 transitions to mass production.

Samsung Electronics

Meanwhile, according to South Korean media outlet New Daily, Samsung is also accelerating the development of HBM4, targeting completion of the Production Readiness Approval (PRA) process within the first half of 2025.

Samsung Electronics plans to equip its HBM4 with 1c DRAM (6th-generation 10nm-class DRAM), as the report from ZDNet notes. Unlike competitors SK hynix and Micron, which are utilizing 1b DRAM, Samsung’s strategy is to differentiate itself by employing a more advanced generation of DRAM.

Micron

As for Micron, the company announced during its fiscal Q1 2025 earnings call (covering September to November 2024) that it plans to significantly ramp up mass production of HBM4 starting in 2026, as highlighted by the report from ZDNet.

According to a report from ETNews on January 15th, Micron is currently conducting final equipment tests for the HBM3E 16-layer production, with volume manufacturing just around the corner.

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(Photo credit: SK hynix)

Please note that this article cites information from ZDNet, New Daily, Korea JoongAng Daily, and ETNews.

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