Valeo, a leading automotive technology company, and ams OSRAM, a global leader in intelligent sensors and emitters, announced a cooperation with the innovative Open System Protocol (OSP) technology, designed to transform the lighting inside the passenger compartment. Together with the groundbreaking...

Marvell announces new custom HBM compute architecture that enables XPUs to achieve greater compute and memory density. According to its press release, this new AI accelerator (XPU) architecture enables up to 25% more compute, 33% greater memory while improving power efficiency. Notably, the new c...

According to a report from Central News Agency, the Office of the U.S. Trade Representative (USTR) announced today (11th) that the Biden administration will impose Section 301 tariffs on solar wafers, polycrystalline silicon and certain tungsten products imported from China. Citing a report from ...

Against the backdrop of the gradual recovery of the global semiconductor industry, China's chip design industry is expected to deliver double-digit growth this year, reaching total sales of RMB 646 billion (roughly USD 90.99 billion) in 2024, according to the Integrated Circuit Branch of the China S...

Commercial Times, citing a report from The Information, indicated that Apple is currently collaborating with Broadcom to develop its first server chip specifically designed for artificial intelligence (AI) computing, hoping to reduce its reliance on Nvidia. Reportedly, the chip will use TSMC's N3P p...