TSMC unveiled the largest foreign investment in U.S. history, adding $100 billion for three new fabs, two advanced packaging plants, and a major R&D center. However, the deal raises key concerns. Here are six big questions from Taiwan’s Economic Daily News, along with an analysis of each. H...

According to a Reuters report, sources reveal that NVIDIA and Broadcom are conducting manufacturing tests with Intel's 18A process, signaling initial confidence in Intel's advanced fabrication technology. The report further states that AMD is reportedly also assessing Intel's 18A manufacturing proce...

Amid rumors of acquiring Intel’s fabs, TSMC is ramping up U.S. investment to counter rising chip tariffs. According to Reuters and TSMC’s press release, the company will invest an additional $100 billion to build five more semiconductor plants in the coming years. CEO C.C. Wei announced the p...

The U.S.-China AI competition is expanding to the humanoid robot sector. According to Commercial Times, citing Voice of America, industry sources note that while the U.S. holds advantages in the core technology for humanoid robots, China is making advances in hardware manufacturing capabilities. How...

As CoWoS capacity tightens amid soaring AI-driven demand, semiconductor giants are turning to fan-out panel-level packaging (FOPLP), as square substrates allow for significantly more chips per panel. According to the Economic Daily News, Taiwanese panel maker Innolux aims to begin FOPLP mass product...