In the memory sector, the era beyond 10nm seems to be around the corner, as giants have revealed plans on the production of 1c DRAM. SK hynix, according to a report by The Elec, is said to develop a 4F2 (square) DRAM in order to reduce the high cost associated with the extreme ultraviolet (EUV) processes since the commercialization of 1c DRAM.

During an industry conference on Monday, Seo Jae Wook, a SK hynix researcher, questioned the profitability of producing DRAM with EUV technology. Instead, he said that SK hynix is exploring the possibility of manufacturing future DRAMs using vertical gate (VG) or 3D DRAM structure, according to the report.

Sources cited by the report indicate that Samsung and SK hynix are both targeting to apply 4F2 for DRAM at the 10nm node and beyond. According to Seo, by applying VG or the 3D DRAM structure, the cost of the EUV processes can be reduced by half.

SK hynix’s VG, or the so-called 4F2 by memory makers internally, is similar to the vertical channel transistor (VCT) of its South Korean competitor Samsung, The Elec explains.

In short, unlike the traditional 2D DRAM, which only uses the horizontal plane, 4F2, or 3D DRAM, is a cell array structure where transistors are stacked vertically. In the structure, various parts including the source, gate, drain, and capacitor are stacked from bottom to top. As the word line connects to the gate, the bit line connects to the source.

According to the report, arranging the cell array in this manner can reduce the die surface area by 30% compared to 6F2 DRAM.

However, according to a previous report by TweakTown, though the 4F2 design possesses the advantages of being compact and power-efficient, its complexity demands extreme precision in fabrication, higher-quality materials for production, and extensive research to make it scalable and suitable for mass production.

According to TweakTown, Samsung is anticipated to finalize the initial development of VCT DRAM by 2025, with 3D DRAM expected to enter the market by 2030.

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• [News] SK hynix Reportedly Develops NAND over 400 Layers, Eyeing Mass Production Ready by 2025
• [News] SK hynix CEO: Demand for Memory Chips to Remain Robust until 1H25, Driven by HBM

(Photo credit: SK hynix)

Per a report by the Vietnam News Agency, Vietnamese Prime Minister Phạm Minh Chính recently signed Government Decree No. 791/QĐ-TTg on the establishment of the National Steering Committee for Semiconductor Industry Development.

The main tasks and functions of the steering committee include assisting the Prime Minister and the government in researching, guiding, and coordinating the resolution of important and cross-departmental matters related to promoting the development of Vietnam’s semiconductor industry; researching, consulting, and advising on directions and solutions to promote the industry’s growth; and guiding the coordination among various departments, government agencies, relevant organizations, and entities to vigorously advance the development of Vietnam’s semiconductor industry.

Semiconductor industry is one of the strategically important global industries, and it undoubtedly represents a significant development opportunity for Vietnam.

It is reported that the semiconductor, as one of Vietnam’s nine national-level products, has been included in the country’s key development priorities for the next 30 to 50 years.

According to its National Semiconductor Industry Strategy, Vietnam aims to become a global center for semiconductor chip design, packaging, and testing by 2030.

To achieve this goal, the Vietnamese government has introduced a series of preferential policies and incentives to encourage foreign enterprises to invest in the country.

Moreover, the government has established the National Innovation Center (NIC) to create a high-tech ecosystem and beef up the training of professionals to meet the needs of developing semiconductor industry.

Currently, Vietnam has drawn in investment from foreign enterprises such as Intel, ASE Group, Samsung Electronics, Amkor, Qualcomm, ONSemi, Renesas, Texas Instruments, NXP, Marvell, Synopsys, Hana, and Anpei. In fact, with global capital investment, Vietnam’s semiconductor industry ecosystem is gradually taking shape in recent years.

Vietnam’s Minister of Planning and Investment Nguyễn Chí Dũng stated that Vietnam boasts some conditions and factors conducive to the development of semiconductor industry, involving a stable political system, a favorable geographical location, and attractive investment incentive policies.

The Vietnamese government has been committed to developing semiconductor industry and hopes to attract more and more large enterprises to invest in Vietnam.

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• [News] Nvidia CEO Visits Vietnam, Plans to Establish Chip R&D Base

(Photo credit: Intel)

According to industry sources cited in a report from TechNews, a temporary power outage occurred in certain areas in northern Taiwan (Linkou, Taishan, Xinzhuang) at 1:35 PM on August 13.

Addressing the matter, DRAM manufacturer Nanya Technology is currently assessing the damage, while Micron, on the other hand, has experienced voltage sag and reports no issues at this time. Still, some rumors have suggested that parts of Micron’s dry etching and wet process equipment has been affected.

Industry sources cited by TechNews mentioned that Nanya Technology’s plant experienced a power outage lasting about 20 minutes but activated its Uninterruptible Power Supply (UPS) system. The photolithography and etching areas are expected to be minimally affected, but the non-UPS sites are still under assessment.

Currently, Nanya Technology is still confirming the extent of the damage.

According to an industry assessment cited by TechNews, the impact of this power outage on Nanya Technology is limited, with existing inventory, the production lines can continue to supply products.

Read more

• [News] HBM Supply Shortage Prompts Micron’s Expansion, Expected Schedule in Japan and Taiwan Revealed
• [News] Nanya Technology Chairman Names 10nm 1B Process as Key Expansion Focus for the Year

(Photo credit: Micron)

In August 2022, U.S. President Joe Biden signed the “Inflation Reduction Act” and the “CHIPS and Science Act,” providing over USD 400 billion in tax incentives, loans, and grants. However, according to a report from Financial Times, about 40% of the investment projects under these acts have been delayed or put on hold.

In the first year after these laws were implemented, companies announced investment projects totaling USD 220 billion. However, among these projects, around USD 84 billion of investment has now been delayed by anywhere from two months to several years, with some even being indefinitely postponed.

Notably, TSMC has delayed the mass production schedule for its second plant in Arizona by two years. The foundry giant’s local suppliers, such as Chang Chun Group, have also postponed a USD 300 million factory investment project by two years, while KPCT Advanced Chemicals has put its USD 200 million project on hold as well.

Other major investment projects that have been put on hold include LG Energy Solution’s USD 2.3 billion battery storage facility in Arizona, Italy’s Enel’s USD 1 billion solar panel plant in Oklahoma, and Albemarle’s USD 1.3 billion lithium refining plant in South Carolina.

Industry sources cited by the report reveal that the uncertainty of policies during the election year, coupled with deteriorating market conditions and slowing demand, has led the companies to alter their plans.

Specifically, the slow approval process for CHIPS Act funding and unclear rules for the Inflation Reduction Act have also hinted at delays in some investment projects.

Read more

• [News] GlobalWafers Receives USD 400 Million Subsidy from CHIPS Act to Establish New Plant in the US
• [News] TSMC Rumored to Appoint Higher-Level Executive to Accelerate Progress at U.S. Fab
  

(Photo credit: TSMC)

According to a report on the official website of the Shanghai Qingpu District’s Government on August 11th, the exterior construction and interior decoration of Huawei’s Xicen apartment project in Shanghai have been completed, and the project has entered its final stages.

The apartments are expected to be finished by the end of September this year. Once completed, the project will provide over 6,000 housing units for the influx of Huawei research talent moving to Qingpu (Shanghai). This further hints that Huawei’s largest global R&D center is getting closer to being fully operational.

The project, which started construction in December 2023, will provide ample accommodation for employees serving in the eight parks at Huawei’s Lianqiu Lake R&D Center. Once completed, it will house over 15,000 people.

Reportedly, the Huawei Lianqiu Lake R&D Center in Shanghai’s Qingpu District, was completed on July 9. It covers an area of 2,400 acres, with a total building area of 2.06 million square meters and an investment exceeding CNY 10 billion.

The center is mainly used for research, office space, and supporting facilities, including R&D offices, laboratories, conference halls, cafeterias, and data centers.

This research center, per a previous report from EE Times China, is designed with 40,000 offices and is expected to gradually attract about 35,000 Huawei R&D talents.

The focus will be on R&D, product design, and sales in areas such as 5G chips, wireless, and the Internet of Things (IoT). By the end of this year, it is anticipated that 10,000 personnel will have joined the new R&D center, primarily consisting of employees from other Huawei R&D centers and newly hired research and development talent.

Regarding Huawei’s substantial investment in building this research center, tech media outlet “Tom’s Hardware” highlighted on July 14th that amid the US-China semiconductor rivalry and various US sanctions against Huawei, the company must bolster its research and development efforts. Consolidating multiple research centers allows Huawei to streamline operations and facilitate easier collaboration among different departments.

The report states that this flagship project showcases Huawei’s investment commitment in future technologies. The new R&D Center is even said to be larger in scale than the combined size of Apple Park and Microsoft’s Redmond Campus headquarters in Seattle.

Read more

• [News] Huawei’s Largest Global R&D Center in Shanghai Unveiled, Invests Over USD 1.4 Billion
• [News] Patent War Begins – Huawei and MediaTek Go after Each Other for Patent Infringement

(Photo credit: Huawei)