According to Reuters citing sources, Intel, facing a critical survival crisis, has temporarily halted its new chip packaging and testing project in Penang. Malaysian media outlet The Star, citing informed sources, reported that Intel will temporarily halt its new chip packaging and testing projec...

The U.S. non-farm payroll data for August is set to be released on September 6. Ahead of that, the ADP employment report, often referred to as the "mini-NFP," was published on September 5. The report revealed that private-sector employment in the US rose by 99,000 jobs in August, significantly lo...

Amid the rising of emerging applications in the AI market, the booming demands for high-performance computing (HPC), high-bandwidth memory (HBM), CoWoS advanced packaging, and high-performance storage, have energized the wafer foundry industry. Given the broader applicability of 12-inch wafer in ...

At the SEMICON Taiwan 2024, Samsung's Head of Memory Business, Jung Bae Lee, stated that as the industry enters the HBM4 era, collaboration between memory makers, foundries, and customers is becoming increasingly crucial. Reportedly, Samsung is prepared with turnkey solutions while maintaining fl...

Jun He, Vice President of Advanced Packaging Technology and Service at TSMC, stated that 3D IC is a crucial method for integrating AI chip memory with logic chips. According to a report from TechNews, regarding the development of 2.5D CoWoS advanced packaging, which integrates eight chiplets, T...