Global semiconductor giants are concentrating their R&D efforts on advanced packaging technologies to drive performance enhancements. According to a report from Commercial Times, as packaging technology progresses from 2.5D to 3D, chip stacking technologies have become a showcase for the competitive prowess of major companies.

“Hybrid Bonding” is seen as the key technology for future chip connections. In addition to international companies like Applied Materials and Besi actively positioning themselves, Taiwanese companies led by TSMC, including Gallant Micro, MPI Corporation, E&R Engineering Corporation, C SUN, Saultech, and Grand Process Technology, are also developing and seizing opportunities in Hybrid Bonding.

The report also cited industry sources, pointing out that Grand Process Technology has been supplying TSMC since the inception of InFO (Integrated Fan-Out Packaging). It is revealed that Grand Process Technology is also actively participating in future SoIC (System on Integrated Chips) advanced packaging, focusing on wafer cleaning and photoresist removal in etching processes.

It is indicated by the report that Grand Process Technology’s capacity will be operating at full speed until the first quarter of next year, with lead times extended to nine months. Last year’s orders are currently being installed gradually, with most concentrated on advanced packaging.

Semiconductor equipment manufacturer C SUN and its investment company Gallant Micro are currently investing in Hybrid Bonding-related equipment. C SUN primarily focuses on developing the best solutions for permanent bonding to enhance yield rates. Meanwhile, Gallant Micro leverages its relative advantage in chip sorting machines within its product line.

MPI Corporation, a testing interface vendor, has also entered the initial stages of inspection and analysis for Hybrid Bonding processes. Development of related products is nearing completion.

E&R Engineering Corporation also emphasizes that its top-tier plasma cleaning equipment is currently aimed at achieving high cleanliness of bonding surfaces to enhance adhesion.

Saultech Technology holds a positive outlook on the future market trends of Hybrid Bonding as well. The company has introduced equipment that corresponds to both Hybrid Bonding and Fan-Out technologies. Saultech has independently developed key technologies including bonding and die cleaning processes.

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• [News] Samsung and SK hynix to Implement Hybrid Bonding with 3D DRAM
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(Photo credit: Applied Materials)

Chul Joo Hwang, Chairman of South Korean semiconductor equipment company Jusung Engineering, recently stated that future semiconductors will stack transistors together, as the expansion of DRAM and logic chips has reached its limit. Stacking transistors like NAND is necessary to overcome these challenges.

According to a report from South Korean media outlet The Elec, Hwang believes this means developing more atomic layer deposition (ALD) technology to reduce the use of extreme ultraviolet (EUV) lithography steps in the production process of advanced chips.

ALD technology is a thin film process that allows materials to grow layer by layer, offering high uniformity, precise thickness control, and excellent step coverage, overcoming challenges faced by traditional process technologies.

Reportedly, stacking transistors can reduce the need for further scaling of transistors. As evidence, deep ultraviolet (DUV) equipment is expected to be used in 3D DRAM production.

Hwang believes that as stacking becomes increasingly important, the demand for ALD equipment will also rise. Additionally, the production of III-V semiconductors and IGZO semiconductors requires ALD equipment.

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• [News] Robust Demand in AI Drives South Korea’s Chip Exports in June to Record High
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(Photo credit: Jusung Engineering)

X-Epic, a prominent Chinese electronic design automation (EDA) start-up, is said to be reducing its workforce by up to 50%, according to a report by South China Morning Post. As chip design is an indispensable part to semiconductor manufacturing, the incident raises concerns about China’s push for technological self-reliance.

X-Epic, founded in 2020 by Wang Libin, a former engineer at US EDA leader Cadence Design Systems, has been established with the goal of creating indigenous EDA tools to challenge the dominance of US rivals. The field is traditionally governed by US giants including Cadence, Synopsys, and Mentor Graphics (now owned by Siemens).

Based on the definition by Cadence, EDA encompasses software, hardware, and essential services used in the design of chips and semiconductor devices. Historically, hardware architects sketched chip designs by hand and used isolated tools. However, alongside the rapid growth of AI, EDA has become indispensable as chip designs get complicated. The tool provides a simulated environment where circuits and designs are conceived and analyzed before being realized in the physical world.

According to the report, as of March, 2023, X-Epic employed approximately 400 people across offices in Nanjing, Beijing, Shanghai, Chengdu, and Shenzhen. However, the company began laying off up to half its employees recently across various departments, including its key research and development division.

The report further analyzes that in In August 2022, Washington first restricted China’s access to the EDA technology by prohibiting the export of gate all-around (GAA) capable EDA software, which creates challenges for Chinese chipmakers in adopting advanced processes such as the 3nm node and in developing high-performance computing or AI chips.

Citing data from the China Semiconductor Industry Association, the report notes that the value of China’s EDA market is projected to reach 18.5 billion yuan (USD 2.55 billion) next year, up from 9.3 billion yuan in 2020. As the market seems to be booming, X-Epic’s reported layoff highlights the challenges China’s EDA companies are facing.

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• New US EDA Software Ban May Affect China’s Advanced IC Design, Says TrendForce

(Photo credit: X-Epic)

The Japanese Ministry of Economy, Trade, and Industry’s 2024 White Paper on International Economy and Trade reveals that in its examination of imported goods sources, over half of the import value for 1,406 product categories (accounting for over 30% of the total) comes from China. This figure is 1.5 times higher than that of the United States, which relies on China for only 567 product categories. Thus, Japanese media Nikkei’s report has highlighted that this data underscores Japan’s significant dependence on China within its supply chain.

According to Nikkei, Japan’s trade statistics for 2022 covered approximately 4,300 types of goods. The report indicates that nearly 40% of these products are highly dependent on a single import source, with China being the predominant supplier.

Specific data further hints that Japan’s highly dependent imports from China include laptops, air conditioners, organic chemicals, and rare-earth metals. Additionally, over 90% of Japan’s imported household appliances originate from China. Moreover, China serves as Japan’s primary supplier of phosphorus, a key raw material for fertilizer production.

The data also indicates that Japan imports 252 and 151 types of goods that are “highly dependent” on the United States and South Korea, respectively, ranking these countries second and third in terms of Japan’s import dependency. In contrast, other G7 members exhibit lower levels of dependency on single import sources compared to Japan.

Per Nikkei’s report, essential minerals, semiconductors, and fertilizers have been designated as critical goods by the Japanese government. The data in the latest White Paper indicates that Japan’s supply chain is significantly dependent on China, highlighting the importance of diversifying procurement sources and conducting risk assessments. Japan has already started implementing measures to reduce reliance on China in cooperation with the United States and Europe.

Read more

• [News] Semiconductor Equipment Sales Soared in Chinese and Japanese Markets
• [News] New Regulations Reportedly Introduced by Japan Regarding Semiconductor Exports

(Photo credit: Lenovo)

According to a report from Commercial Times, Apple is said to have informed its suppliers and partners that it is confident in boosting sales of the upcoming iPhone 16, set to be released in the second half of this year, through the addition of AI features. Reportedly, the goal is to increase iPhone 16 shipments by approximately 10% compared to the iPhone 15, reaching 90 million units in the second half of this year.

Apple showcased its advancements in AI at the annual Worldwide Developers Conference (WWDC) in June, including the introduction of the generative AI large model Apple Intelligence, AI upgrades for Siri, and collaboration with OpenAI. Apple is expected to launch Apple Intelligence in the U.S. market this fall, with full functionality projected to be available in the spring of next year.

Per sources cited by Bloomberg, Apple did not perform well in the second half of last year, particularly facing challenges in its third-largest market, China. Huawei’s Mate 60 Pro, equipped with a domestically manufactured 7nm processor, has gained favor among local consumers.

The same report from Bloomberg indicated that after a turbulent 2023, Apple is relying on AI services to boost demand for its new products. Data cited by Bloomberg shows that in the second half of last year, iPhone 15 shipments were approximately 81 million units.

Furthermore, for the first quarter this year, TrendForce reported that Apple also faced a decline in sales in the Chinese market, resulting in a drop in annual production to 47.9 million units. This decline prompted several adjustments within the component supply chain, although production plans for processor chips remained unchanged. TrendForce posits that the second quarter falls within a product iteration gap for Apple, and production is expected to decrease by approximately 10%. 

Read more

• Q1 Smartphone Production Increases Due to Low Base Last Year, Expected to Decline 5–10% in Q2, Says TrendForce
• [News] Apple’s AI Push on iPhone 16 in China Faces Obstacles in Finding Local Partners

(Photo credit: Apple)