According to the industry sources cited in a report from Economic Daily News, TSMC is gearing up to start production of NVIDIA’s latest Blackwell platform architecture graphics processors (GPU) on the 4nm process. In response to the strong customer demand, NVIDIA has reportedly increased its orders to TSMC by 25%.

This surge not only underscores the unprecedented boom in the AI market but also provides substantial momentum for TSMC’s performance in the second half of the year, setting the stage for an optimistic annual outlook adjustment, the report notes.

TSMC is set to hold an earnings conference call on July 18, in which it is expected to release the financial results of the second quarter as well as the guidance for the third quarter.

As TSMC will reportedly commence the production of NVIDIA’s Blackwell platform architecture GPU, which may be regarded as one of the most powerful AI chips, it is anticipated to be a focal point of discussion at TSMC’s upcoming earnings call.

Packed with 208 billion transistors, NVIDIA’s Blackwell-architecture GPUs are manufactured using a custom-built 4NP TSMC process with two-reticle limit GPU dies connected by 10 TB/second chip-to-chip link into a single, unified GPU.

The report further cited sources, revealing that international giants such as Amazon, Dell, Google, Meta, and Microsoft will adopt the NVIDIA Blackwell architecture GPU for AI servers. As demand exceeds expectations,NVIDIA is prompted to increase its orders with TSMC by approximately 25%.

As NVIDIA ramps up production of its Blackwell architecture GPUs, shipments of terminal server cabinets, including the GB200 NVL72 and GB200 NVL36 models, have seen a simultaneous significant increase. Initially expected to ship a combined total of 40,000 units, this figure has surged to 60,000 units, marking a 50% increase. Among them, the GB200 NVL36 accounts for the majority with 50,000 units.

The report estimates suggest that the average selling price of the GB200 NVL36 server cabinet is USD 1.8 million, while the GB200 NVL72 server cabinet commands an even higher price of USD 3 million. The GB200 NVL36 features 36 GB200 super chips, 18 Grace CPUs, and 36 enhanced B200 GPUs, whereas the GB200 NVL72 boasts 72 GB200 super chips, 36 Grace CPUs, and 72 B200 GPUs, which all contribute to TSMC’s momentum.

TSMC former Chairman Mark Liu, before handing over the reins in June, had already predicted that the demand for AI applications looks more optimistic compared to a year ago. Current Chairman C.C. Wei has also indicated that AI applications are just beginning, and he is optimistic like everyone else.

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• [News] End of an Era under Mark Liu’s Leadership, TSMC Discusses Future Development Plans
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(Photo credit: TSMC)

Global semiconductor giants are concentrating their R&D efforts on advanced packaging technologies to drive performance enhancements. According to a report from Commercial Times, as packaging technology progresses from 2.5D to 3D, chip stacking technologies have become a showcase for the competitive prowess of major companies.

“Hybrid Bonding” is seen as the key technology for future chip connections. In addition to international companies like Applied Materials and Besi actively positioning themselves, Taiwanese companies led by TSMC, including Gallant Micro, MPI Corporation, E&R Engineering Corporation, C SUN, Saultech, and Grand Process Technology, are also developing and seizing opportunities in Hybrid Bonding.

The report also cited industry sources, pointing out that Grand Process Technology has been supplying TSMC since the inception of InFO (Integrated Fan-Out Packaging). It is revealed that Grand Process Technology is also actively participating in future SoIC (System on Integrated Chips) advanced packaging, focusing on wafer cleaning and photoresist removal in etching processes.

It is indicated by the report that Grand Process Technology’s capacity will be operating at full speed until the first quarter of next year, with lead times extended to nine months. Last year’s orders are currently being installed gradually, with most concentrated on advanced packaging.

Semiconductor equipment manufacturer C SUN and its investment company Gallant Micro are currently investing in Hybrid Bonding-related equipment. C SUN primarily focuses on developing the best solutions for permanent bonding to enhance yield rates. Meanwhile, Gallant Micro leverages its relative advantage in chip sorting machines within its product line.

MPI Corporation, a testing interface vendor, has also entered the initial stages of inspection and analysis for Hybrid Bonding processes. Development of related products is nearing completion.

E&R Engineering Corporation also emphasizes that its top-tier plasma cleaning equipment is currently aimed at achieving high cleanliness of bonding surfaces to enhance adhesion.

Saultech Technology holds a positive outlook on the future market trends of Hybrid Bonding as well. The company has introduced equipment that corresponds to both Hybrid Bonding and Fan-Out technologies. Saultech has independently developed key technologies including bonding and die cleaning processes.

Read more

• [News] Samsung and SK hynix to Implement Hybrid Bonding with 3D DRAM
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(Photo credit: Applied Materials)

Chul Joo Hwang, Chairman of South Korean semiconductor equipment company Jusung Engineering, recently stated that future semiconductors will stack transistors together, as the expansion of DRAM and logic chips has reached its limit. Stacking transistors like NAND is necessary to overcome these challenges.

According to a report from South Korean media outlet The Elec, Hwang believes this means developing more atomic layer deposition (ALD) technology to reduce the use of extreme ultraviolet (EUV) lithography steps in the production process of advanced chips.

ALD technology is a thin film process that allows materials to grow layer by layer, offering high uniformity, precise thickness control, and excellent step coverage, overcoming challenges faced by traditional process technologies.

Reportedly, stacking transistors can reduce the need for further scaling of transistors. As evidence, deep ultraviolet (DUV) equipment is expected to be used in 3D DRAM production.

Hwang believes that as stacking becomes increasingly important, the demand for ALD equipment will also rise. Additionally, the production of III-V semiconductors and IGZO semiconductors requires ALD equipment.

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• [News] Robust Demand in AI Drives South Korea’s Chip Exports in June to Record High
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(Photo credit: Jusung Engineering)

X-Epic, a prominent Chinese electronic design automation (EDA) start-up, is said to be reducing its workforce by up to 50%, according to a report by South China Morning Post. As chip design is an indispensable part to semiconductor manufacturing, the incident raises concerns about China’s push for technological self-reliance.

X-Epic, founded in 2020 by Wang Libin, a former engineer at US EDA leader Cadence Design Systems, has been established with the goal of creating indigenous EDA tools to challenge the dominance of US rivals. The field is traditionally governed by US giants including Cadence, Synopsys, and Mentor Graphics (now owned by Siemens).

Based on the definition by Cadence, EDA encompasses software, hardware, and essential services used in the design of chips and semiconductor devices. Historically, hardware architects sketched chip designs by hand and used isolated tools. However, alongside the rapid growth of AI, EDA has become indispensable as chip designs get complicated. The tool provides a simulated environment where circuits and designs are conceived and analyzed before being realized in the physical world.

According to the report, as of March, 2023, X-Epic employed approximately 400 people across offices in Nanjing, Beijing, Shanghai, Chengdu, and Shenzhen. However, the company began laying off up to half its employees recently across various departments, including its key research and development division.

The report further analyzes that in In August 2022, Washington first restricted China’s access to the EDA technology by prohibiting the export of gate all-around (GAA) capable EDA software, which creates challenges for Chinese chipmakers in adopting advanced processes such as the 3nm node and in developing high-performance computing or AI chips.

Citing data from the China Semiconductor Industry Association, the report notes that the value of China’s EDA market is projected to reach 18.5 billion yuan (USD 2.55 billion) next year, up from 9.3 billion yuan in 2020. As the market seems to be booming, X-Epic’s reported layoff highlights the challenges China’s EDA companies are facing.

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• New US EDA Software Ban May Affect China’s Advanced IC Design, Says TrendForce

(Photo credit: X-Epic)

The Japanese Ministry of Economy, Trade, and Industry’s 2024 White Paper on International Economy and Trade reveals that in its examination of imported goods sources, over half of the import value for 1,406 product categories (accounting for over 30% of the total) comes from China. This figure is 1.5 times higher than that of the United States, which relies on China for only 567 product categories. Thus, Japanese media Nikkei’s report has highlighted that this data underscores Japan’s significant dependence on China within its supply chain.

According to Nikkei, Japan’s trade statistics for 2022 covered approximately 4,300 types of goods. The report indicates that nearly 40% of these products are highly dependent on a single import source, with China being the predominant supplier.

Specific data further hints that Japan’s highly dependent imports from China include laptops, air conditioners, organic chemicals, and rare-earth metals. Additionally, over 90% of Japan’s imported household appliances originate from China. Moreover, China serves as Japan’s primary supplier of phosphorus, a key raw material for fertilizer production.

The data also indicates that Japan imports 252 and 151 types of goods that are “highly dependent” on the United States and South Korea, respectively, ranking these countries second and third in terms of Japan’s import dependency. In contrast, other G7 members exhibit lower levels of dependency on single import sources compared to Japan.

Per Nikkei’s report, essential minerals, semiconductors, and fertilizers have been designated as critical goods by the Japanese government. The data in the latest White Paper indicates that Japan’s supply chain is significantly dependent on China, highlighting the importance of diversifying procurement sources and conducting risk assessments. Japan has already started implementing measures to reduce reliance on China in cooperation with the United States and Europe.

Read more

• [News] Semiconductor Equipment Sales Soared in Chinese and Japanese Markets
• [News] New Regulations Reportedly Introduced by Japan Regarding Semiconductor Exports

(Photo credit: Lenovo)