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Less than 12 hours after Apple's fall product launch, Huawei held its own event on the other side of the Pacific. As expected, they unveiled the world's first tri-fold phone, the Mate XT. Its release date is also set to coincide with Apple's, launching on September 20. As per a report from CNBC, a...
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With the advent of the AI era, customer demand for high-performance NAND solutions such as SSDs for data centers, as well as ultra-fast DRAM chips including high bandwidth memory (HBM), is growing. In line with this trend, SK hynix has introduced a new product, PEB110 E1.S (PEB110), with improved da...
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Recently, China has set two records in semiconductor chip sector: first, it mass-produced the world's first 28nm embedded RRAM image quality adjustment chip; second, it developed the world's first 16-bit quantum bit semiconductor microprocessor chip. Mass Production of the World's First 28nm Em...
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As silicon photonics has become a key technology in the AI era, semiconductor giants, including Intel and TSMC, have joined the battlefield. Now another tech giant has engaged in the war, while U.S. chip giant AMD is reportedly seeking silicon photonics partners in Taiwan, according to local media U...
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According to a report from tom’s Hardware, Jack Huynh, AMD's senior vice president and general manager of its Computing and Graphics Business Group, announced at IFA 2024 in Berlin that AMD will unify its consumer microarchitecture "RDNA" and data center microarchitecture "CDNA" under a single nam...