AMD Chairman and CEO Lisa Su unveiled the company’s latest AI chip, MI325X, at the opening of Computex Taipei on June 3. She emphasized that the MI325X boasts 30% faster computing speed compared to NVIDIA’s H200. According to a report from CNA, Su also announced that AMD plans to release a new generation of AI chips each respective year, hinting at a strong competitive stance against NVIDIA.

Lisa Su announced that the MI300 series is AMD’s fastest progressing product. The tech giant’s next-generation AI chip, MI325X, features HBM3e and is built on the CDNA 3 architecture.

According to Su, AMD MI325X outperforms NVIDIA’s H200 in performance and bandwidth, more than twice than that of NVIDIA’s H200. On the other hand, MI325X delivers 30% faster computing speed compared to the H200.

Furthermore, Su also announced that AMD will release MI350 in 2025, which will be manufactured with 3nm process, while MI400 is expected to follow, launched in 2026.

On June 3, Lisa Su stated that AMD will continue its collaboration with TSMC, advancing process technology to the 3nm and even 2nm nodes. Yet, Su did not directly address the previous market rumors suggesting that AMD might switch to Samsung’s 3nm technology.

Previously, as per a report on May 29th from The Korea Economic Daily, it has speculated that AMD is likely to become a customer of Samsung Electronics’ 3nm GAA process. Reportedly, during AMD CEO Lisa Su’s appearance at the 2024 ITF World, which was hosted by the Belgian microelectronics research center imec, Su revealed that AMD plans to use the 3nm GAA process for mass-producing next-generation chips.

Per the same report, Lisa Su stated that 3nm GAA transistors can enhance efficiency and performance, with improvements in packaging and interconnect technology. This will make AMD products more cost-effective and power-efficient. The report further addressed that, as Samsung is currently the only chip manufacturer with commercialized 3nm GAA process technology, Su’s comments were interpreted as indicating that AMD will officially collaborate with Samsung for 3nm production.

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• [News] South Korean Media Suggests AMD Could Become Samsung’s 3nm GAA Process Customer
• [News] Samsung Reportedly Signs USD 3 Billion HBM3e Deal with AMD

(Photo credit: AMD)

According to a report from Chinese media outlet “Phoenix New Media,” Zhang Ping’an, Executive Director of Huawei and CEO of Huawei Cloud Computing Technologies, acknowledged that China is unlikely to achieve 3nm or 5nm processes and emphasized that solving issues relating to 7nm would be good enough.

Zhang pointed out that the semiconductor industry in China currently cannot directly compete with developed countries in cutting-edge processes, such as 3nm and 5nm. This is an indisputable fact, but it does not mean that China’s semiconductor industry has no prospects for development, the report noted.

Zhang believed that the semiconductor industry in China should be more focused on deepening efforts in relatively mature processes, such as 7nm, to enhance product performance and reliability, meeting the needs of the market and users.

Zhang further emphasized that the innovation direction of China’s semiconductor industry should not be limited to any single-point chip processes alone. Moreover, overemphasis on advanced processes may lead to the ignorance of optimization and innovation in system architecture, which potentially resulting to bottlenecks in overall performance.

He also stated that China’s semiconductor industry should pay more attention to innovation in system architecture. By optimizing the collaborative work between chips and systems, overall performance can be enhanced, thereby gaining greater competitive advantages in the global market.

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• [News] Huawei, OrangePi Introduced Kunpeng Pro, with Mystery AI Processor Packaged Inside
• [News] NVIDIA Reportedly Facing Price Cut Pressure of H20 Chip in China Amid Competition with Huawei

(Photo credit: Huawei)

During NVIDIA founder and CEO Jensen Huang’s keynote speech on June 2, he shared insights on how the AI era is driving the development of a new global industrial revolution.

According to a report from TechNews, he covered various technologies and application areas, including advancements in accelerated computing, microservices, industrial digitalization, and consumer devices, which are expected to become key focus areas in the evolving AI market.

• Accelerated Computing

1. Collaboration between the computer industry and NVIDIA to build AI factories and data centers: NVIDIA and leading computer manufacturers worldwide announced today the launch of a series of systems based on the NVIDIA Blackwell architecture. These systems feature Grace CPUs, NVIDIA networking technologies, and infrastructures to assist enterprises in establishing AI factories and data centers.

2. Foxconn utilizes NVIDIA artificial intelligence and Omniverse technology to train robots and streamline assembly operations: Foxconn operates over 170 plants worldwide, with its latest being a virtual plant driving the latest developments in industrial automation technology.

The latest of Foxconn’s plant is a digital twin model of a new factory in Guadalajara, Mexico, a hub for the electronics industry. Engineers at Foxconn define processes and train robots in this virtual environment to enable physical factories to efficiently produce the next generation of accelerated computing engines, the NVIDIA Blackwell HGX system.

3. NVIDIA significantly strengthens Ethernet networks for generative artificial intelligence: NVIDIA announced widespread adoption of the NVIDIA Spectrum-X Ethernet platform and will accelerate the release of new products. CoreWeave, GMO Internet Group, Lambda, Scaleway, STPX Global, and Yotta are the first batch of AI cloud service providers to adopt NVIDIA Spectrum-X, bringing ultimate network performance to their AI infrastructure.

Additionally, NVIDIA’s partners have also released products utilizing the Spectrum platform, including ASRock Rack, ASUS, GIGABYTE Technology, Ingrasys Inc., Inventec, Quanta Cloud Technology, Wistron and Wiwynn. Moreover, Dell Technologies, Hewlett Packard Enterprise, Lenovo, and Super Micro Computer have collaborated with NVIDIA to incorporate the Spectrum platform into their respective products.

• Microservices

NVIDIA NIM has revolutionized deployment model: NVIDIA has announced that its inference microservice, NVIDIA NIM, optimized in container form, is now available for download by 28 million developers worldwide.

This allows deployment to cloud, data centers, or workstations, enabling developers to effortlessly build generative artificial intelligence applications for assisting partners, such as copilots and chatbots, within minutes, a process that previously took several weeks.

• Industrial Digitalization

1. Electronics manufacturers adopt NVIDIA AI and Omniverse to drive robotic factories and accelerate industrial digitization: NVIDIA announced that major Taiwanese electronics manufacturers, including Delta Electronics, Foxconn, Pegatron Corporation, and Wistron Corporation, are using NVIDIA’s technology to transform their factories into more autonomous production facilities through new reference workflows.

This workflow combines NVIDIA Metropolis visual artificial intelligence (AI) technology, NVIDIA Omniverse’ physically accurate rendering and simulation technology, and NVIDIA Isaac’s AI robot development and deployment technology.

2. Industry leaders adopt NVIDIA’s robotic technology to develop tens of millions of AI-supported autonomous machines, including BYD Electronics, Siemens, Teradyne Robotics, and Alphabet’s Intrinsic, among more than ten global leading companies in the robotics industry.

These companies integrate NVIDIA Isaac acceleration libraries, physically principled simulation content, and AI models into their software frameworks and robot models to enhance efficiency in factories, warehouses, and distribution centers. This enables human colleagues to work in safer environments and serves as intelligent assistants in executing repetitive or ultra-precise tasks.

3. NVIDIA introduces NVIDIA IGX with Holoscan support, enabling enterprise software to run medical, industrial, and scientific artificial intelligence applications in real-time at the edge: To meet the growing demand for real-time artificial intelligence computing technology at the industrial edge, NVIDIA announces the comprehensive launch of NVIDIA AI Enterprise-IGX software with Holoscan on the NVIDIA IGX platform.

• Consumer Devices

1. NVIDIA utilizes GeForce RTX AI PC to deliver the real AI assistant experience: NVIDIA announces the launch of the new NVIDIA RTX technology, designed to support AI assistants and digital human platforms running on new GeForce RTX AI laptops.

2. NVIDIA introduces Digital Human Microservices to lay the foundation for future generative AI digital avatars: NVIDIA announces the comprehensive rollout of NVIDIA ACE generative artificial intelligence microservices to accelerate the development of the next wave of digital humans and numerous breakthroughs in generative AI soon to be introduced on the platform.

Companies in customer service, gaming, and healthcare sectors are among the first to adopt ACE technology, making it easier to create, personalize, and interact with realistic digital humans. These microservices have broad applications in customer service, telehealth, gaming, and entertainment.

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• [News] NVIDIA CEO Jensen Huang Announces the Latest Rubin Architecture – Rubin Ultra GPU to Feature 12 HBM4
• [News] Dell Leak Reveals NVIDIA’s Potential B200 Launch Next Year

(Photo credit: NVIDIA)

NVIDIA CEO Jensen Huang delivered a keynote speech at the NTU (National Taiwan University) Sports Center on June 2. As per a report from TechNews, during the speech, he unveiled the new generation Rubin architecture, showcasing NVIDIA’s accelerated rollout of new architectures, which became the highlight of the evening.

While discussing NVIDIA’s next-generation architecture, Huang mentioned the Blackwell Ultra GPU and indicated that it may continue to be upgraded. He then revealed that the next-generation architecture following Blackwell will be the Rubin architecture.

The Rubin GPU will feature 8 HBM4, while the Rubin Ultra GPU will come with 12 HBM4 chips, he noted.

The new architecture has been named after American astronomer Vera Rubin, who made significant contributions to our understanding of dark matter in the universe and conducted pioneering work on galaxy rotation rates.

Notably, despite the fact that NVIDIA has just launched the new Blackwell platform, it appears that NVIDIA keeps accelerating its roadmap. According to the latest information announced by Jensen Huang, the Rubin GPU will become part of the R series products and is expected to go into mass production in the fourth quarter of 2025. The Rubin GPU and its corresponding platform are anticipated to be released in 2026, followed by the Ultra version in 2027. NVIDIA also confirmed that the Rubin GPU will use HBM4.

Per a report from global media outlet Wccftech, NVIDIA’s Rubin GPU is expected to adopt a 4x reticle design and utilize TSMC’s CoWoS-L packaging technology, along with the N3 process. Moreover, NVIDIA will use next-generation HBM4 DRAM to power its Rubin GPU.

According to Wccftech, currently, NVIDIA employs the fastest HBM3e in its B100 GPU, and it plans to update these chips with the HBM4 version when HBM4 solutions are produced in large quantities by the end of 2025.

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• [News] Dell Leak Reveals NVIDIA’s Potential B200 Launch Next Year
• [News] TSMC’s Advanced Packaging Capacity Fully Booked by NVIDIA and AMD Through Next Year

(Photo credit: NVIDIA)

Following its success in the LCD panel market, China’s BOE Technology Group has now been actively narrowing the technology gap with Korean giants in the organic light-emitting diode (OLED) panel domain. Citing industry experts, Business Korea reported that BOE has reduced the technological gap with Korea regarding the high-growth mid-sized OLED sector to one to one and a half years.

The Chinese display industry is rapidly expanding its presence in the OLED market, driven by robust governmental support as well as competitive pricing, while high domestic consumption also fuels sales growth.

BOE, top Chinese display maker, has gradually become a crucial part of the global supply chain for tech giants. In late 2023, Apple finally approved BOE as an iPhone 15 AMOLED supplier. Though the delivery time was delayed due to quality issues, making it falling behind Samsung and LG, BOE is said to supply 2 million panels to Apple, about 3% of its total OLED supply in 2023.

However, BOE has introduced a series of latest OLED panels at SID2024 in mid-May to showcase its progress. According to Business Korea, it disclosed a 31.6-inch slidable OLED panel, which can extend sideways when needed, concealing the screen while not in use. It is also noteworthy that BOE showcased 15-inch and 17-inch foldable panels, targeting the automotive OLED market.

According to an earlier report from Japanese media outlet Nikkei News, BOE plans to boost its OLED panel production capacity by more than 50% compared to the current level within the next three years, demonstrating its ambition in the field.

Reportedly, BOE’s new OLED panel plant “B16” in Chengdu, Sichuan Province, began construction in late March. The goal is to complete the plant building by 2024, install manufacturing equipment by September 2025, and start mass production in 2026, producing 8.6-generation OLED panels. BOE’s competitor, Samsung Electronics, is also said to be looking for mass production of 8.6-generation OLED panels in 2026 by upgrading its existing plants.

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• [News] BOE Looking to Become OLED Panel Leader, Rumored to Have a 50% Capacity Expansion

(Photo credit: BOE)