Recently, Samsung Electro-Mechanics announced that by 2026, the sales share of its high-end Flip Chip Ball Grid Array (FCBGA) substrates for server and artificial intelligence will exceed 50%. FCBGA is an integrated circuit (IC) packaging technology，which involves flipping the chip and connecti...

Intel and Japan's National Institute of Advanced Industrial Science and Technology (AIST), under the Ministry of Economy, Trade and Industry, are reportedly planning to set up an R&D hub in Japan. As per a report from Tom's Hardware, the new facility is expected to be built within the next 3-...

According to a report from Reuters, on September 3, Supermicro denied the short-selling report from Hindenburg Research released the previous week, characterizing it as containing false or inaccurate statements about the company. Supermicro stated that the report included misleading statements ...

According to TrendForce's latest memory spot price trend report, regarding DRAM spot prices, since inventory levels are not excessively high, the selling pressure remains manageable. DDR4 products, though, have been suffering from the downward pressure more than DDR5. As for NAND flash, the spot mar...

Amid the escalating tech war between China and the US, along with rising geopolitical tensions, China has accelerated its import of chip manufacturing equipment since the middle of last year to counter potential US chip sanctions, with Dutch company ASML and Japanese company Tokyo Electron (TEL) be...