Articles


2025-02-03

[News] TSMC Said to Plan 2nm Production in U.S., 1nm Fab in Tainan

Citing industry sources, Commercial Times reports that TSMC’s Arizona wafer fab, Fab 21 Phase 1, has officially entered mass production on its 4nm process in the first quarter of this year. Monthly capacity is expected to reach 30,000 wafers by mid-year. Meanwhile, construction for Fab 21’s P...

2025-02-03

[News] Investment of USD 345 million, RF Manufacturer Expands GaN Wafer Production Facilities

On January 14, U.S. RF manufacturer MACOM announced plans to invest USD 345 million (approximately 2.528 billion RMB) to comprehensively upgrade its semiconductor wafer manufacturing facilities in Massachusetts and North Carolina. Specifically, the company’s Massachusetts facility will expand i...

2025-01-31

[News] 13 Advanced Packaging Facilities to Expand Capacity Significantly by 2025

On January 16, Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding, officially inaugurated its new advanced packaging facility at the Tanzi Science Park. SPIL also announced that three additional advanced packaging facilities are set to expand production capacity by 2025....

2025-01-31

[News] Two Major Acquisitions in the Semiconductor Industry

Recently, two major acquisition announcements have made waves in the semiconductor industry: Onsemi has completed its acquisition of Qorvo's silicon carbide (SiC) JFET technology, and Lenovo has acquired the Israeli enterprise storage company Infinidat. Onsemi Completes Acquisition of Qorvo's SiC...

2025-01-30

[News] China Officially Launches National Subsidy for Smartphones: Will the Display Panel Industry Benefit?

In 2025, China has introduced a new round of “national subsidies,” further expanding the scope of its policy. In addition to continuing subsidies for televisions, PCs, and other electronics, products such as smartphones, tablets, and smartwatches have been included in the subsidy program as of J...

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