The annual AI event, NVIDIA GTC (GPU Technology Conference), is set to take place on March 17th, as H200 and the next-generation B100 will reportedly be announced ahead of schedule to seize the market. According to Commercial Times’ report citing sources, H200 and the upcoming B100 will adopt TSMC’s 4-nanometer and 3-nanometer processes respectively. H200 is expected to be launched in the second quarter, while it’s rumored that orders for the B100 adopting Chiplet architecture have already been placed for production.

Sources cited by the report also indicate that NVIDIA’s orders are robust, pushing TSMC’s 3 and 4-nanometer production capacity to near full utilization, making the first quarter, traditionally a slow season, unexpectedly busy.

Regarding the matter of NVIDIA’s next-generation chip orders overwhelming TSMC’s advanced processes, TSMC stated that details regarding production capacity remain consistent with the previous earnings call and will not be elaborated further.

Still, Commercial Times further cited industry sources, revealing that TSMC, in response to anticipated capacity constraints by 2023, is accelerating its efforts. Particularly focusing on advanced packaging like CoWoS, they’ve not only relocated equipment from the Longtan facility but also swiftly activated the AP6 plant in Zhunan.

Another industry sources reportedly indicate that the planned construction of the Tongluo
facility, initially slated for the second half of this year, is now scheduled to commence in the second quarter. The aim is to ramp up 3D Fabric capacity to produce 110,000 12-inch wafers per month by the first half of 2027.

Meanwhile, TSMC’s advanced processes remain fully utilized, with capacity utilization exceeding 90% in February, driven by sustained AI demand.

NVIDIA, on the other hand, recently emphasized that computational-intensive tasks like Generative AI and large language models require multiple GPUs. From customer purchase to model deployment, it takes several quarters. Thus, this year’s inference applications stem from GPU purchases made last year. As model parameters grow, GPU demand is expected to expand.

In addition to increasing GPU quantities, NVIDIA’s GPU efficiency is poised for a significant boost this year. The Blackwell series, notably the B100, is hailed as NVIDIA’s next-generation GPU powerhouse by the market.

Not only is it the first to adopt TSMC’s 3-nanometer process, but it’s also the pioneer in Chiplet and CoWoS-L packaging among NVIDIA products. This tackles high power consumption and cooling issues, with projected single-card efficiency and transistor density expected to surpass AMD’s MI300 series set to debut in the first quarter.

Read more

• [News] NVIDIA Expands Advanced Packaging Supply Chain with Intel’s Inclusion, Diverting Orders from TSMC
• [News] NVIDIA CEO Jensen Huang Meets with TSMC Executives in Taiwan, Addressing the Significant AI Chip Shortage

(Photo credit: Kioxia)

South Korean memory giant SK Hynix is reportedly exploring a collaboration with Japanese NAND flash memory manufacturer Kioxia to produce High Bandwidth Memory (HBM) for AI applications, as per MoneyDJ citing Jiji Press.

According to Jiji Press’ report on March 1st, it is estimated that production will take place at the Japanese plant jointly operated by Kioxia and Western Digital (WD). Kioxia, on the other hand, will evaluate the proposed collaboration based on semiconductor market conditions and its relationship with WD.

The report highlights that HBM, a type of DRAM primarily used in AI servers, is experiencing a surge in demand worldwide, led by NVIDIA. Moreover, according to a previous TrendForce press release, the three major original HBM manufacturers held market shares as follows in 2023: SK Hynix and Samsung were both around 46-49%, while Micron stood at roughly 4-6%.

For SK Hynix, leveraging Kioxia’s existing plants in Kitakami, Iwate Prefecture, and Yokkaichi, Mie Prefecture, Japan, to produce HBM would enable the rapid establishment of an expanded production system.

Meanwhile, the joint-operated Japanese plants of Kioxia and WD currently only produce NAND Flash. If they were to produce the most advanced DRAM in the future, it would also contribute to Japan’s semiconductor industry revitalization plan.

The report further addresses that SK Hynix has indirectly invested approximately 15% in Kioxia through Bain Capital, a U.S.-based investment firm. Bain Capital is reportedly negotiating with SK Hynix behind the scenes, seeking to revive the Kioxia/WD merger. However, as per sources cited in Jiji Press’ report, “this collaboration and the merger are two separate discussion matters.”

According to a previous report from Asahi News on February 23, Kioxia and WD are expected to restart merger negotiations at the end of April. Although the merger negotiations between the two parties hit a roadblock last autumn, both are facing pressure to expand their scale for survival. However, whether the two parties can ultimately reach a merger agreement remains uncertain.

As per TrendForce’s  data for 3Q23, Samsung maintained its position as the top global NAND flash memory manufacturer, commanding a significant market share of 31.4%. Following closely, SK Group secured the second position with a 20.2% market share. Western Digital occupied the third position with a market share of 16.9%, while Japan’s Kioxia held a 14.5% market share.

Asahi News further indicates that if Kioxia and WD, the 2 companies which all manufacture NAND Flash products are to merge, their scale will rival that of the global market leader, Samsung Electronics.

The Japanese government reportedly views the Kioxia/WD merger as a “symbol” of Japan-US semiconductor cooperation and has provided support. However, the merger negotiations hit an impasse last fall, reportedly due to opposition from SK Hynix, indirectly invested in Kioxia.

Read more

• [News] NAND Flash Manufacturers Kioxia and WD Reportedly Set to Resume Merger Talks in Late April
• [News] Kioxia and Western Digital Resume Merger Negotiations? Rumors of Bain Negotiating with SK Hynix Surface

(Photo credit: Kioxia)

Intel’s foundry has extended its public roadmap, incorporating the Intel 14A process into the advanced process schedule and adding specific nodes. However, recent modifications to the roadmap have moved Intel 14A forward to 2026 and introduced a new process in 2027, namely 1 nanometer (Intel 10A).

According to TechNews citing reports from global media outlets tom’s Hardware and Extremetech, this marks Intel’s first announcement of the commencement of the 1-nanometer process. Although Intel had introduced Intel 10A at its exhibition, the news was restricted until now and has just been disclosed.

Intel 10A is set to enter the production/development (non-mass production) phase in 2027, while Intel 14A (1.4 nanometers) is scheduled for early production in 2026. Additionally, Intel is committed to constructing a fully autonomous AI-driven fab.

Keyvan Esfarjani, Intel’s Executive Vice President and General Manager of Manufacturing and Supply Chain, introduced the latest developments and showcased the technical roadmap. Intel plans to commence development of the 10A node by late 2027 to address gaps in EUV technology.

Assuming that Intel successfully launches its 1.8-nanometer process next year, follows with a 1.4-nanometer process in 2026, and then advances to 1-nanometer in 2027, Extremetech’s report claims that Intel is likely to be ahead of its competitor TSMC. TSMC estimates to begin its 2-nanometer process around 2025 or 2026, followed by a 1.4-nanometer process thereafter.

However, Intel has not disclosed any details regarding the 10A node, but it promises at least double-digit improvements in power consumption and performance. Intel CEO Pat Gelsinger has previously stated that new processes typically improve critical dimensions by approximately 14% to 15%. Therefore, it is plausible that the 10A and 14A nodes will also experience similar improvements.

Source: Intel

As per Intel’s roadmap, Intel 14A is also optimized in 2027, so it seems that 10A falls between 14A and 14A-E.

It is worth noting that according to Intel’s presentation notes, the final scale, speed, and process depend on commercial conditions and incentives, implying that funding from the U.S. Chip Act will affect expansion capacity.

Current Technological Developments at Intel

Intel’s 20A integrates two new technologies: backside power (PowerVIA) and GAA transistors (RibbonFET). Additionally, there is a proactive effort to enhance production capacity for advanced packaging technologies such as Foveros, EMIB, SiP (Silicon Photonics), and HBI (Hybrid Bond Interconnect).

Recently, Intel concluded all internal packaging for standard packaging, redirecting focus entirely towards high-end packaging, with standard packaging tasks now handled by OSATs (outsourced assembly and test companies).

While Intel’s 18A production base is located in Arizona, the location for manufacturing the 10A node has not been disclosed.

Read more

• [News] Intel Promotes 1.8-Nanometer Process in South Korea, Reportedly Pledges Various Benefits to Startups
• [News] Samsung Secures 2-Nanometer Order from Japanese AI Startup Preferred Networks

(Photo credit: Intel)

On February 28th, as per the ams OSRAM’s press release, it has announced the unexpected cancellation of its Micro LED key project. The company will reevaluate its related strategies and provide initial estimates of the impact on its mid-term operations.

As ams OSRAM announced the unexpected cancellation of its key Micro LED project, it has prompted the company to reevaluate its Micro LED development strategy, as per TechNews’ report, speculation has arisen regarding the collaboration with Apple to introduce Micro LED technology into the Apple Watch Ultra 3. The cancellation may signify the end of this collaboration.

The first Apple Watch featuring a Micro LED display was originally scheduled for release in 2026, with rumors suggesting a potential delay to 2027 or later due to high costs. However, ams Osram’s recent announcement to cancel the Micro LED project undoubtedly sends shockwaves through the industry, casting a shadow over the integration of Micro LED technology into watches or other devices.

Unexpected Cancellation of the Micro LED Project

The ams OSRAM’s press release indicates that the management board of ams OSRAM has been informed of the unexpected cancellation of its Micro LED key project. Consequently, it has decided to re-assess its Micro LED development strategy, especially concerning the 8-inch LED fab in Kulim, Malaysia.

Upon preliminary estimation, ams OSRAM anticipates recording non-cash impairment losses of EUR 600 to 900 million related to Micro LED assets and goodwill in the first quarter of 2024. Currently, ams OSRAM is engaged in discussions with relevant clients.

This implies the changes to the capitalization of ams OSRAM’s investment into Micro LED R&D and the reduced subsidies from public funding schemes. These changes will impact ams OSRAM’s operational profitability (adjusted EBIT) for the fiscal year 2024, with estimated effects ranging from EUR 30 to 50 million.

In the information disclosed, ams OSRAM did not provide detailed specifics about the Micro LED project. Further information will be closely monitored by the industry. From the perspective of the Micro LED industry, there are still technological bottlenecks to overcome, such as chip efficiency, yield rates in mass transfer, achieving full colorization, and the immaturity of supporting industries. Cost reduction has yet to be effectively achieved, which may be one of the reasons for the project’s cancellation.

Micro LED Watch Project Not Necessarily Cancelled, Opportunities for Taiwanese and Korean Manufacturers?

Nevertheless, Apple has not abandoned discussions with other chip manufacturers, implying that the Micro LED watch project may continue. Taiwan and South Korea still maintain corresponding supply chains to support this, with downstream operations involving LG Display (LGD) in backplane and module production.

TrendForce points out that Ennostar has past experience collaborating with Apple, and PlayNitride is also a leading global Micro LED manufacturer. Furthermore, PlayNitride is part of the AU Optronics Group and can provide Micro LED watch chips and backplane transfer technology.

However, for now, the termination of the collaboration between Apple and ams Osram may also prompt other manufacturers to consider the risks of engaging in new partnerships with Apple. Apart from the initial substantial investment required, once the collaboration begins, Apple will actively seek out second suppliers, which are all aspects that need careful consideration.

From the current Micro LED supply chain outlook, TrendForce indicates that Micro LED has four main applications: large displays, wearables, automotive, and near-eye displays.

Samsung leads in large displays, and there is significant market anticipation for Micro LED smartwatches. AU Optronics continues to focus on Micro LED watches, but with a lack of synchronous brand influence, overall interest and development willingness from manufacturers may decrease compared to other brands.

Read more

• [New] The Reality of Micro LED Unveiled – Infinite Opportunities, Yet Initial Capacity Demand Remains Low

(Photo credit: ams OSRAM)

The semiconductor supply chain is accelerating its globalization strategy. On February 29th, PSMC announced its collaboration with Tata Electronics in India to construct the country’s first 12-inch fab in Dholera, Gujarat. The construction of the fab is expected to commence within this year.

According to Tata’s press release, following the approval from the Indian government for Tata Group and PSMC to establish India’s first fab in Dholera, Gujarat, the investment for the fab is estimated at INR 91,000 crores (roughly USD 11 billion) and will generate over 20,000 direct and indirect skilled jobs in the region . The preliminary plan outlines a monthly production capacity of 50,000 wafers.

Cited from PSMC’s press release, Frank Huang, Chairman of PSMC, pointed out that Tata Sons Group is India’s largest and internationally-renowned company. India not only has the world’s largest population, it also has a huge domestic market. At this critical moment of the global restructuring of high-tech supply chain, the cooperation between PSMC and Tata Sons Group is indeed timely.

Randhir Thakur, CEO of Tata Electronics, stated as follows, “We will be able to serve our global customers’ requirements for supply chain resilience and meet the growing domestic demand.”

As per PSMC’s press release, Tata Electronics plans to produce power management IC, display driver IC as well as microcontrollers and high-performance computing logic at the Dholera 12-inch fab, in order to enter the automotive, computing and data storage, wireless communications, artificial intelligence and other application end markets.

As key countries worldwide continue actively building their own semiconductor supply chains, TSMC has taken the lead in initiating globalization efforts. UMC, through its collaboration with Intel to develop a 12-nanometer process platform, not only advances in process technology but also expands its presence into the United States.

On the other hand, after entering the Japanese market last year, PSMC further declared yesterday its partnership with Tata to establish India’s first 12-inch fab. This marks the first time a Taiwanese semiconductor foundry has entered the Indian semiconductor supply chain.

Read more

• [News] Tata Group Rumored to Invite Taiwanese Businesses to Establish Fabs in India, Possibly Partnering with UMC or PSMC
• [News] Tata Reportedly Partners with Pegatron for iPhone Assembly in India

(Photo credit: PSMC)