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2024-12-13

[News] Samsung Reportedly Unable to Supply HBM3E to NVIDIA in 2024 as Gap with SK hynix Widens

Korean memory giant Samsung has been working hard to prepare for supplying HBM3E to NVIDIA, but now it appears almost impossible to supply to NVIDIA in 2024. According to Wccftech's report, Samsung failed to secure a position in NVIDIA's supply chain because it couldn't meet NVIDIA's qualification t...

2024-12-12

[News] Marvell Develops Custom HBM with Micron, Samsung, and SK hynix

Marvell announces new custom HBM compute architecture that enables XPUs to achieve greater compute and memory density. According to its press release, this new AI accelerator (XPU) architecture enables up to 25% more compute, 33% greater memory while improving power efficiency. Notably, the new c...

2024-12-12

[News] U.S. to Double Tariffs on Chinese Solar Wafers and Polysilicon

According to a report from Central News Agency, the Office of the U.S. Trade Representative (USTR) announced today (11th) that the Biden administration will impose Section 301 tariffs on solar wafers, polycrystalline silicon and certain tungsten products imported from China. Citing a report from ...

2024-12-12

[News] China’s Chip Design Industry to Grow 12% in 2024, Though High Product Concentration Remains an Issue

Against the backdrop of the gradual recovery of the global semiconductor industry, China's chip design industry is expected to deliver double-digit growth this year, reaching total sales of RMB 646 billion (roughly USD 90.99 billion) in 2024, according to the Integrated Circuit Branch of the China S...

2024-12-12

[News] Apple Reportedly Teams Up with Broadcom to Develop AI Chip Using TSMC’s N3P Process

Commercial Times, citing a report from The Information, indicated that Apple is currently collaborating with Broadcom to develop its first server chip specifically designed for artificial intelligence (AI) computing, hoping to reduce its reliance on Nvidia. Reportedly, the chip will use TSMC's N3P p...

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