To continue advancing Moore's Law, TSMC Chairman and President C.C. Wei personally confirmed that FOPLP (Fan-Out Panel-Level Packaging) is in full swing. According to a report from Commercial Times, TSMC has established an R&D team and production line, currently still in the initial stages. ...

Recently, China’s National Integrated Circuit Industry Investment Fund Phase II (referred to as the "“Big Fund” Phase II") has made frequent investment, successively acquiring stakes in the wafer manufacturing company Chongqing Xinlian Microelectronics Co., Ltd. (referred to as "XLMEC") and th...

In the Q2 earnings call today (July 18th), TSMC Chairman and CEO C.C. Wei introduced the concept of “Foundry 2.0,” redefining the foundry industry to further include sectors like packaging, testing, mask making, and others, the latest report by Technews noted. C.C. Wei pointed out that under ...

TSMC held its earnings call earlier today. Looking ahead to the third quarter, the company estimates that, based on an exchange rate of USD 1 to TWD 32.5, revenue will fall between USD 22.4 billion and USD 23.2 billion, representing at least a 7.5% increase quarter-over-quarter. Additionally, TSMC...

Moments before TSMC’s earnings call, TSMC has released its financial results for the second quarter of 2024. Reportedly, TSMC announced consolidated revenue of NTD 673.51 billion, net income of NTD 247.85 billion, and diluted earnings per share of NTD 9.56 (USD 1.48 per ADR unit) for the quarter...