As per a report from Korea Economic Daily citing unnamed sources on July 15th, Samsung Electronics is preparing to mass-produce the logic die for HBM4 using its advanced 4nm process. The logic die, situated at the bottom of the chip stack, is a core component of HBM. Memory manufacturers are alr...

According to a report from Commercial Times, with expectations that tensions between the U.S. and China remain unresolved for the time being, and China's continued production in mature process semiconductor foundries and communication equipment, the trend of decoupling from China is likely to expand...

The heightened tensions between China and the U.S. are expected to escalate further. According to a report from Commercial Times, this has been reflected in the past quarter's increased demand for AI servers among Chinese Cloud Service Providers (CSPs) and enterprises. Following NVIDIA's recent r...

According to a report from Economic Daily News, benefiting from the upcoming peak season for smartphones, a recovery in the PC market, and a more than 30% surge in silver prices this year, global giants such as Murata and TDK are planning to raise product prices. Targeted products include multilayer...

Though Samsung has denied the rumor that its HBM3e passed NVIDIA’s qualification tests, multiple Taiwanese companies in the supply chain reportedly learned that the product is expected to receive certification soon, and will start shipping in Q3. As memory manufacturers are said to shift at least ...