Apple’s Vision Pro, which went on sale in the United States in February this year, is reportedly gearing up for sales outside the US to test the waters! China, Japan, South Korea, Germany, and France are among the nations expected to join this wave of availability.

According to reports from the CTEE and Bloomberg, Apple has flown retail employees from various countries to its headquarter in Cupertino, California for training. The training program, started last week, lasted four days and focused on teaching staff how to demonstrate Vision Pros to customers. Participants in the training came from Germany, France, Australia, Japan, South Korea, Singapore, and China.

Though Apple has not disclosed the actual debut date or the countries where the Vision Pro will be launched outside the US, in March, a report by MacRumors suggested that code within VisionOS might hint the potential sequence of international sales for the Vision Pro.

Apple has added 12 new languages to the Vision Pro’s virtual keyboard and auto-correction features, including English versions for five regions (Australia, Canada, Japan, Singapore, and the UK), French for two regions (France and Canada), German (Germany), as well as Japanese, Korean, Traditional Cantonese, and Simplified Chinese, which indicates that nine countries, including China, Japan, and Korea, may be among the first markets Vision Pro could potentially make its debut.

According to a January estimate by TrendForce, if initial sales are strong, Vision Pro shipments could reach between 500–600 thousand units in 2024. 

Apple’s Vision Pro features a Micro OLED display, currently exclusively supplied through a process that uses TSMC’s CMOS backplanes in combination with Sony’s deposition process.

(Photo credit: Apple)

As generative AI models like OpenAI sweep across the globe, the demand for high-performance GPU has been on the rise. For instance, NVIDIA’s GPU products are in tight supply and often reportedly out of stock. Industry analysis reveals that NVIDIA’s high-performance GPU is manufactured by TSMC and packaged using CoWoS technology. However, TSMC’s advanced CoWoS packaging capacity is insufficient to meet the AI demands. Later, TSMC actively expanded CoWoS production, and NVIDIA’s GPU shipments gradually stabilized as capacity increased.

Notably, new challenges present following the ease of GPU shortage problem.

Recently, Mark Zuckerberg, CEO of Meta, stated publicly that the GPU shortage in AI data centers is being alleviated, while the future bottleneck will be power supply.

As GPU supply become less tight, companies kick-start big investment in building data centers and other infrastructure facilities to be in tune with the AI development trends.

Zuckerberg believes that the next crux for AI development will be power supply. He noted that many new data centers could consume 50-100MW, and large data centers could reach up to 150MW. As the scale of data center power consumption continues to grow, AI industry may hit a power supply bottleneck.

The energy industry, unlike the AI sector, does not find building new power plants a simple task. Given factors such as regulations (Especially nuclear energy), power transmission planning, and construction, it could take several years from planning to the actual integration of new power into the grid. Therefore, capital investments fail to yield results in a short time, and the delivery of additional power supply lags far behind the construction of data centers.

To address the potential future power crisis, media reports indicate that Meta is currently collaborating with Silicon Ranch, a solar energy company in Georgia, to supply power to its data centers.

Likewise, Tesla CEO Elon Musk also issued a warning regarding AI development in April 2024, stating that the next shortage facing AI will be power, and there may not be enough electricity to run all the chips next year.

Besides, OpenAI CEO Sam Altman has also stated that AI will consume more power than expectation, and future AI development will require breakthroughs in clean energy.

Thanks to the surge in AI demand, Samsung and SK Hynix, the world’s leading memory chip manufacturers, anticipate the prices of DRAM and high-bandwidth memory (HBM) to remain strong this year due to increasing demand for high-performance chips. According to the Korea Economic Daily, Samsung and SK Hynix have converted over 20% of their DRAM production lines to produce HBM.

Last week, SK Hynix CEO Kwak Noh-jung announced at a press conference that their HBM chips have already been sold out for 2024 and are nearly sold out for 2025.

During an investor relations meeting hosted by Samsung Securities on May 9th and 10^th, a SK Hynix official stated that the company’s HBM chips are supplied through binding annual contracts, which detail supply volumes, payment methods, and deadlines.

The price drop in HBM3 will be offset by the price increase in HBM3e, so the gross profit margin is expected to remain stable in 2024, according to the Korea Economic Daily, citing the SK Hynix official. It is also reported that NVIDIA is the major customer of SK Hynix’s eight-layer HBM3e.

According to the report, a Samsung IR executive also stated that the company’s HBM production has been sold out. Based on the current supply and demand situation, Samsung has predicted that HBM will not be in oversupply in 2025.

Samsung noted that the gap between its eight-layer stacked HBM3e and SK Hynix’s is closing, claiming it has taken the lead with 12-layer HBM3e.

In late March, South Korean media Alphabiz reported that Samsung may exclusively supply 12-layer HBM3e to NVIDIA, indicating NVIDIA is set to commence large-scale purchases of Samsung’s 12-layer HBM3e as early as September.

In terms of the price outlook for traditional DRAM and solid-state drives (SSDs), both SK Hynix and Samsung remain positive.

According to the latest forecast by Trendforce, the HBM market is poised for robust growth, driven by significant pricing premiums and increased capacity needs for AI chips. HBM prices are expected to Increase by 5–10% in 2025.

In terms of market value, HBM is projected to account for more than 20% of the total DRAM market value starting in 2024, potentially exceeding 30% by 2025.

(Photo credit: SK Hynix)

Samsung’s planned launch of its budget model version for the upcoming Galaxy Z Fold 6 foldable phone may be cancelled, according to information obtained by South Korea’s media outlet TheElec.

According to sources cited by TheElec, component suppliers to Samsung, which were gearing up for mass production of parts for these foldable devices, indicated that they have not received orders for the budget model Fold 6.

Initially, the South Korean tech giant had planned to unveil three foldable phones this summer: the Galaxy Z Fold 6, the Galaxy Z Flip 6, and an affordable version of the Fold 6.

The Fold 6 features a digitizer layer on the screen to support the S-Pen stylus, but the budget model was intended to be thinner and omit this feature.

It is reported that Samsung, after conducting a durability test of 200,000 folds for the budget model, with water and dust resistance functions added, has founded out that the product turned out not to be thinner than its Chinese rival Huawei’s equivalent, thus lacking significant differentiating points from these rival products.

Huawei’s Mate X3 and X5, launched last year, were both around 11.08mm thick, according to information obtained on Huawei’s website. Samsung’s Galaxy Z Fold 5 was 13.4mm thick, while Xiaomi’s Mix Fold 3 was 10.9mm thick.

According to analysis from TrendForce, global shipments of foldable phones reached 15.9 million units in 2023, marking a 25% YoY increase and accounting for approximately 1.4% of the overall smartphone market. In 2024, shipments are expected to rise to about 17.7 million units, growing by 11% and slightly increasing the market share to 1.5%. However, this growth rate remains below market expectations, with the segment’s share predicted to exceed 2% only by 2025.

Trendforce points out that the slowdown in the growth of foldable phones could be attributed to two main factors: Firstly, consumer retention is low due to frequent maintenance issues faced by first-time foldable phone users, leading to a lack of confidence in the product. As a result, users may opt for high-end flagship smartphones when considering replacements. Secondly, the current price points of foldable phones have yet to reach the sweet spot for consumers, making it challenging to meet sales targets based solely on pricing.

(Photo credit: Samsung)

SK Hynix has updated its latest timeline regarding HBM4E, the company’s 7th generation high bandwidth memory, on Monday. According to reports from Wccftech and TheElec, the memory heavyweight’s generation changes of two-year gap has been shortened to one, and is now on track to launch HBM4E by 2026.

The news was revealed by Kim Gwi-wook, head of SK Hynix’s HBM advanced technology, during the International Memory Week 2024 held in Seoul yesterday. Earlier in February, Chun-hwan Kim, Vice President of SK Hynix, stated that the company plans to commence large-scale production of HBM4, their sixth generation of the HBM family, in 2026, as well.

According to TheElec, HBM4E will be the first chip from SK Hynix to be made through its 10-nanometer (nm) class Gen 6 (1c) DRAM. It is reportedly to be made of 32Gb DRAM and use 1c DRAM as the core die.

According to Wccftech, HBM4E’s feature bandwidth is said to be 1.4 times higher than that of its predecessor, HBM4. This indicates a significant enhancement in power efficiency, providing a preview of the advancements we can anticipate in next-gen AI accelerators.

Earlier in April, SK Hynix announced it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology. The company plans to proceed with the development of HBM4, or the sixth generation of the HBM family, slated to be mass produced from 2026, through this initiative.

Samsung, SK Hynix’s major competitor on memory, also schedules to start mass production of HBM4 in 2026.

(Photo credit: SK Hynix)