• With the Ongoing Expansion of Global EV Battery Market, China’s Dominant Position Steadily Strengthens

In recent years, the rapid growth of EV and energy storage markets has driven robust demand for lithium-ion batteries (LiBs). Data shows that in 2023, the total shipment of LiBs exceeded 1 terawatt-hour (TWh) for the first time, with the market size growing more than tenfold compared to 2015, and EV battery shipment accounted for over 70% of the general battery shipment.

As the electric vehicle and energy storage markets continue to grow, the demand for LiBs will enjoy further expansion, with global LiBs shipment expected to outstrip 3,200 GWh by 2027.

Despite the fact that LiB was initially commercialized in Japan in the 1990s and long dominated by Japanese and South Korean manufacturers, over two decades later, China has leapfrogged the two nations. Currently, over 75% of the world’s LiBs are produced in China, marking China’s top position in manufacturing LiB.

Likewise, in the EV battery sector, which accounts for the largest demand in the LiB market, six out of the top ten manufacturers globally are headquartered in China, including CATL, BYD, CALB, Gotion High-Tech, EVE Energy, and Sunwoda, which are expected to hold increasingly higher market shares while the market shares of Japanese and South Korean companies is declining year by year.

For instance, Panasonic’s market share in the EV battery market has dropped to around 6%, and the combined market share of South Korean manufacturers to approximately 23%.

However, with the advancement and breakthroughs in next-generation automotive battery technology—all-solid-state battery (ASSB) technology—the position of traditional liquid-state battery is being challenged.

• Next-Generation Battery Technology Comes to the Fore

On January 3, 2024, PowerCo, a battery subsidiary of Volkswagen, announced that its partner, QuantumScape, had successfully passed its first endurance test on solid-state batteries, achieving over 1,000 charge-discharge cycles while maintaining a capacity of over 95%.

Additionally, in September 2023, another solid-state battery listed company based in the US, Solid Power, announced that its first batch of A-1 solid-state battery samples had been officially delivered to BMW for automotive verification testing. BMW aims to launch its first prototype vehicle based on Solid Power’s solid-state battery technology by 2025.

Last year, Toyota has repeatedly stated its intention to commercialize solid-state battery technology by 2027-2028.

• Does All-Solid-State Battery (ASSB) Technology Truly has the Potential to Overturn Liquid-State Battery Technology?

Traditional liquid-state LiB is primarily composed of cathode and anode electrodes, separator, and electrolyte. The cathode and anode electrode materials play the role of storing lithium, which affects the battery’s energy density, while the electrolyte mainly influences the motion rate of lithium ion during charging and discharging processes, typically using liquid (Organic solvents) as the electrolyte.

However, during the charge-discharge process of traditional liquid-state LiB, side reactions can easily occur on the electrode surface. For example, lithium dendrites formed on the surface of the anode electrode can easily penetrate the separator, causing a short circuit between the cathode and anode electrodes and leading to battery fires.

In addition, the liquid electrolyte is a flammable substance, making liquid-state batteries prone to ignition and explosion under high temperatures or when the battery experiences external impacts that result in a short circuit. Therefore, liquid-state battery faces significant challenges in terms of safety.

Compared to liquid-state LiB, the electrolyte in ASSB is solid, which is less volatile or prone to combustion. Meanwhile, solid-state electrolytes are temperature-stable and less prone to decomposition, rendering them highly safe.

Furthermore, solid-state electrolytes exhibit better stability and mechanical properties, providing superior suppression of lithium dendrites and thereby enhancing battery safety.

On the other hand, traditional liquid-state LiB is limited in their choice of materials due to their narrow electrochemical window and side reactions between the liquid electrolyte and the cathode and anode electrode materials. Solid-state electrolytes, however, offer a wider electrochemical window and fewer side reactions, allowing for a broader range of electrode materials to be used in solid-state battery.

This enables the use of higher energy density active materials. For instance, solid-state battery based on lithium metal anodes can achieve energy densities of over 500 Wh/kg, while liquid-state LiBs can hardly reach this level, with a theoretical energy density limit of 350 Wh/kg. Currently, traditional liquid-state LiBs have approached their theoretical energy density limit, and there’s little room for further improvement.

On top of that, ASSB also boasts better temperature adaptability (-30 to 100°C) and high power characteristic, which can help improve the operating temperature range and fast-charging performance of EV battery.

Meanwhile, as there is no need for liquid electrolytes and separators, the weight of ASSB cells can be reduced. Additionally, processes such as electrolyte filling, degassing, molding, and aging can be removed during the cell assembly process, simplifying the cell manufacturing process. As a whole, given its outstanding performance, ASSB indeed holds the potential to revolutionize liquid-state LiB.

Currently, ASSB, in face of a series of technical challenges, has not yet achieved large-scale production. These challenges include the batch preparation of electrolyte materials, interface stability/side effects between solid materials, as well as the breakthrough of technical hurdles in cell preparation processes, production equipment, and other aspects.

Still, with significant attention and investment from countries worldwide, including Japan, South Korea, Europe, and the US, ASSB has made important progresses and is expected to achieve mass production within 3-5 years.

• Will China be Overtaken in the Market Competition of All-Solid-State Battery?

Currently, ASSB has emerged as the high ground in the competition for next-generation battery technology. The development of ASSB has been listed as a national development strategy by major countries and regions such as Japan, South Korea, the US, and the European Union, and global enterprises are actively making inroads in this field.

Based on different solid electrolyte technical routes, ASSB can be divided into four types: polymer, oxide, halide, and sulfide solid-state batteries. Each of these technology routes has its own advantages and disadvantages. Currently, Japan and South Korea mainly select sulfide as the primary technical route.

In light of the development progress of ASSB in major regions globally, Japan is an early starter in R&D, which takes a lead in the application of patents, and accumulates the most solid-state battery patented technologies worldwide. Japanese companies like Toyota and Nissan have stated their intention to achieve mass production of ASSB around 2028.

In South Korea, major battery manufacturers like Samsung SDI, SK Innovation, and LG Energy Solutions continue to invest in R&D. Samsung SDI completed the construction of a pilot production line (S-line) for ASSBs in 2023 and plans to achieve mass production in 2027.

In the United States, solid-state battery development is primarily led by startups with high innovation potential. Companies like QuantumScape and Solid Power have solid-state battery products in the A-sample stage, while SES’ lithium-metal solid-state batteries have entered the B-sample stage. Other US companies such as Ampcera, Factorial Energy, 24M Technologies, and Ionic Materials have channeled more efforts in solid-state battery technical innovation.

Overall, the period around 2028 is expected to be tipping point for the mass production of ASSB.

Although China is currently the world’s largest manufacturer of LiB, there is still a significant gap between Chinese companies and international ones in terms of patent layout for ASSB.

Additionally, China’s solid-state battery technical routes are diverse, with a focus mainly on semi-solid/state-liquid hybrids, with semi-solid-state battery achieving small-scale production and adoption in vehicles, but investment in ASSB remains insufficient in China, and resources are dispersed. This has led to a significant difference compared to international forerunners.

Therefore, in the future competition for ASSB, companies from Japan, South Korea, Europe, and the US have the opportunity to surpass China and reshape the competitive landscape of future EV battery industry.

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• [News] The US Administration Rumored to Announce USD 7 Billion Grant for Samsung to Boost Chip Capacity
• [News] TSMC Receives USD 6.6 Billion for Chipmaking from the US Government, Commits to Constructing Third Fab

(Photo credit: Pixabay)

The Taiwanese semiconductor foundry Powerchip Semiconductor Manufacturing Corporation (PSMC) has held its earnings call and released its Q1 financial report. According to a report from Liberty Times Net citing information, with increasing capacity utilization, idle capacity costs decreased, boosting gross margin to 15.4%, up 12.3 percentage points from the previous year’s Q4. The net loss narrowed to NTD 439 million after tax, translating to a loss of NTD 0.11 per share.

Looking ahead to a potential turnaround this year, PSMC’s General Manager, Brian Shieh, highlighted that while large-size panel driver ICs are performing relatively well, Chinese foundries are exerting significant pricing pressure on mature processes, impacting average selling prices unfavorably. This remains a key variable affecting profitability.

In response to inflation-driven equipment cost adjustments and market demands, PSMC is revising its product portfolio. They also announced an increased capital expenditure of NTD 32 billion for 2024, which represents a 30% increase from the previously disclosed amount of NTD 24 billion. Powerchip’s Tainan fab has initiated trial production, with future investments focusing on power management IC, memory, and copper processes in the interposer.

Brian Shieh mentioned that PSMC’s capacity utilization rate was around 65% in the fourth quarter of last year. In the first quarter of this year, the utilization rate for logic products improved slightly, while memory product utilization reached 95% to 98%.

He expects memory product utilization to remain at first-quarter levels in the second quarter, with logic product utilization around 65% to 70%. Overall gross margin is anticipated to remain stable or improve compared to the first quarter.

According to TrendForce’s previous report on the fourth quarter of 2023, global semiconductor foundry revenue rankings showed that Intel Foundry Services (IFS), which ranked ninth globally in the third quarter of 2023, was pushed out of the top ten by PSMC and Nexchip due to factors such as the transition between old and new CPU generations and lackluster inventory momentum. At the same time, the top three semiconductor foundries globally were TSMC, Samsung, and GlobalFoundries.

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• [News] PSMC’s Frank Huang Explores Global Expansion through Fab IP, Diverging from TSMC’s Path
• [News] TSMC and PSMC Face Dilemma as Overseas Foundry Costs Skyrocket 2.5 to 4 Times

(Photo credit: PSMC)

The US government announced on April 15th that it will provide up to USD 6.4 billion in subsidies to South Korean semiconductor giant Samsung Electronics for expanding advanced chip production capacity at its Texas plant.

The US government previously approved subsidies of up to USD 8.5 billion for US chip giant Intel and USD 6.6 billion for TSMC to alleviate future semiconductor supply constraints. Semiconductors are currently considered the lifeblood of the global economy.

The Department of Commerce stated in a release, “…the U.S. Department of Commerce and Samsung Electronics (Samsung) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $6.4 billion in direct funding under the CHIPS and Science Act.”

The statement also mentioned that Samsung Electronics is expected to “invest more than $40 billion dollars in the region in the coming years, and the proposed investment would support the creation of over 20,000 jobs.”

US officials told reporters that this subsidy from the “Chips and Science Act” would assist Samsung Electronics in expanding chip production for use in aerospace, defense, and automotive industries, enhancing US national security.

Lael Brainard, the Director of the White House National Economic Council, emphasized that the resurgence of advanced chip manufacturing in the United States signifies a significant milestone for the domestic semiconductor industry.

US Commerce Secretary Gina Raimondo indicated that this subsidy would support two chip production facilities, one R&D fab, and one advanced packaging facility. She mentioned that this subsidy would also help Samsung expand its semiconductor facility in Austin, Texas.

Raimondo further stated, “…this proposed funding advances America’s leadership in semiconductor manufacturing on the world stage.”

Previously, the U.S. government announced that Intel would receive USD 8.5 billion in federal subsidies and USD 11 billion in loans. Intel is planning to invest USD 100 billion across four states in the U.S. for building and expanding fabs, and is also seeking an additional USD 25 billion in tax credits.

On the other hand, US administration is set to provide USD 6.6 billion in aid to TSMC, which plans to build a third chip plant in Arizona with a total investment of USD 65 billion.

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• [News] The US Administration Rumored to Announce USD 7 Billion Grant for Samsung to Boost Chip Capacity
• [News] TSMC Receives USD 6.6 Billion for Chipmaking from the US Government, Commits to Constructing Third Fab

The US Department of Commerce has added leading Chinese solution provider Sitonholy, who primarily sells processors from Intel and NVIDIA, to its Entity List. This inclusion on the Entity List undoubtedly impacts Sitonholy but also has significant implications for American companies like Intel and NVIDIA.

According to reports from the South China Morning Post and Reuters, Sitonholy sells hardware based on Intel and NVIDIA technologies and also provides cloud services. As a result, US companies engaging in business with Sitonholy require export licenses from the Department of Commerce, but these license applications are presumed to be denied during the review process.

This development is a significant blow to Sitonholy and American companies alike. Kevin Kurland, a US export enforcement official, stated during a hearing of the US Senate subcommittee that the US government has placed four Chinese companies on an export blacklist for assisting the Chinese military in obtaining AI chips. The four Chinese companies are Linkzol Technology, Xi’an Like Innovative Information Technology, Beijing Anwise Technology, and Sitonholy.

A Chinese Foreign Ministry spokesperson criticized the United States for unfairly targeting Chinese companies through export controls and demanded that the US stop politicizing trade and technology issues.

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• [News] US Government Considers Adding ChangXin Memory Technologies to Entity List, Imposing Further Sanctions on Chinese Firms
• [News] Bypassing U.S. Restrictions? CXMT Showcases GAA Technology for 3nm Chips
• DRAM Industry Sees Nearly 30% Revenue Growth in 4Q23 Due to Rising Prices and Volume, Says TrendForce

(Photo credit: iStock)

AI and big data are driving a massive demand for memory data, which also imposes higher requirements on memory technologies. Against this backdrop, the technology competition among memory giants is heating up.

In terms of NAND Flash, major companies are focusing on breakthroughs in the number of layers. Recently, The Korean Economic Daily reported that Samsung Electronics is expected to mass-produce the ninth-generation NAND Flash (V-NAND) later this month.

The company had already produced the 236-layer eighth-generation V-NAND Flash memory at scale in 2022. The upcoming ninth-generation V-NAND Flash memory will continue to use the structure of double NAND Flash stacks, with the number of layers reaching 290. According to industry predictions, Samsung’s future tenth-generation V-NAND is expected to reach 430 layers, and Samsung will switch to a three-stack structure at that time.

Looking further into the future, both Samsung and Kioxia have revealed plans to develop 1000-layer NAND Flash. Samsung aims to develop 1000-layer NAND Flash by 2030, while Kioxia plans to mass-produce 3D NAND Flash chips with more than 1000 layers by 2031.

In terms of DRAM, memory giants are zeroing in on advanced process nodes and 3D DRAM.

In March 2024, Micron disclosed in its financial result that the majority of DRAM chips are currently at the 1α and 1β advanced nodes, and the next generation 1γ DRAM will introduce EUV lithography machine, which has already undergone trial production.

Samsung’s DRAM chip technique is at the 1b nm level, and recent reports suggest that Samsung plans to start large-scale production of 1c nm DRAM within this year, using EUV technology. Samsung will also step into the era of 3D DRAM in 2025. The company has already demonstrated two 3D DRAM technologies: vertical channel transistors and stacked DRAM.

SK Hynix is also developing 3D DRAM. Last year, BusinessKorea reported that SK Hynix proposed using IGZO as the new generation channel material for 3D DRAM. According to industry sources, IGZO is a metal oxide material composed of indium, gallium, and zinc oxide. Its biggest advantage is its low standby power consumption, making it suitable for DRAM transistors requiring long lifespan. This characteristic is easily achievable by adjusting the composition ratio of In, Ga, and ZnO.

(Photo credit: Samsung)