According to ChinaTimes’ report, Intel’s strides in European chip manufacturing are narrowing the gap with TSMC.

The Fab 34 in Ireland has taken a significant step in production using EUV for the first time, with Intel 4 technology equivalent to the original 7nm. The research firm IC Knowledge has once assessed that Intel 4 is ahead of TSMC’s 5nm process, emphasizing energy efficiency, which makes it more suitable for mobile devices.

Industry sources note that the upcoming Meteor Lake CPU will adopt the Intel 4 process, and Intel 3 is planned for release by the end of the year. With Intel’s Ireland facility entering mass production, it significantly reduces the gap with TSMC.

Meteor Lake is poised to become the first processor utilizing Intel 4 fabrication technology, marking a milestone as the inaugural process to support EUV lithography exposure.

While the Compute tile is manufactured using Intel 4, the Graphic tile, SoC tile, and IO tile are completed using TSMC’s 5/6nm process. Industry source suggests that TSMC still maintains superior yield rates and more advantageous production costs.

Intel is establishing an advanced semiconductor manufacturing value chain in Europe. Fab 34 in Leixlip, Ireland, is operational, and there are plans to build a fab in Magdeburg, Germany, and an assembly testing facility in Wroclaw, Poland. This positions Intel ahead of TSMC in global layout.

Intel aims to regain a leading position in process technology by 2025, and will receive the industry’s first set of High-NA EUV lithography exposure equipment by the end of the year. The “Intel 3” will kick off vigorously. As Moore’s Law reaches its limits, TSMC, as a frontrunner, will face a gradually narrowing gap with competitors.

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• [News] Intel’s Next Gen CPU to Produce at TSMC with 3nm in First Half of Next Year
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(Photo credit: Intel)

TrendForce has released its latest report, “Analysis of EEA Architecture and ADAS Domain Controllers in New Energy Vehicles,” providing a detailed analysis of the evolution of electronic and electrical architectures in new energy vehicles and the current status of ADAS domain controllers. Excerpts from the report are as follows.

TrendForce’s Insights:

1. BEV Platform: the Ideal Carrier for High Integration EEA Development

In recent years, various automakers have been investing resources to enhance the competitiveness of their new energy vehicles, particularly Battery Electric Vehicles (BEVs), by developing BEV platforms.

With the complete elimination of internal combustion engines, BEVs exhibit a higher degree of electrification compared to other powertrain modes, facilitating the design of high-computing power and highly integrated Electrical/Electronic Architecture (EEA).

Furthermore, startup automakers unburdened by traditional internal combustion engine constraints currently lead in the integration of EEA architectures compared to traditional automakers.

2. Domain Controllers are Parts of the Key Components for the Development of Highly Integrated EEA

Currently, domain controllers with varying computational power are widely distributed in the market.

However, electric vehicles equipped with high-performance domain controllers still have prices significantly higher than the average, and given the limited economic scale of new entrants, sustained cost reduction requires continuous investment from more manufacturers and improvement in usage environment.

3. The Economic Scale of BEVs Will be the Main Hurdle for EEA Development

While BEVs are considered the optimal platform for developing highly integrated EEAs, the challenges of range anxiety and high vehicle prices continue to be significant barriers affecting the sustained growth of the market.

This has led to a recent slowdown in BEV demand, prompting automakers to redirect some of their development resources to PHEV and even HEV models. These vehicle types may not necessarily require or be suitable for high-performance chips.

Therefore, if PHEVs and HEVs continue to grow, they could become key factors affecting the economies of scale and widespread adoption of high-performance chips.

Apple’s iPhone is gaining even more popularity in India, with Tata Group, India’s conglomerate, reportedly preparing to build a new iPhone assembly plant. According to Bloomberg, this move aligns with Apple’s broader manufacturing strategy expansion in India.

Previously reported by TrendForce, Apple’s decision to opt for India is primarily due to the fact that since 2015, India has become the fastest-growing regional market for smartphones globally. Earlier in October this year, Tata Group officially acquired Wistron’s subsidiary in Bengaluru, primarily responsible for assembling orders for the iPhone 14. 

According to sources from Bloomberg, Tata Group is not only recruiting new staff for this facility but also planning to build the largest iPhone assembly plant in the town of Hosur, Tamil Nadu, India.

The new facility is expected to establish 20 assembly lines, planning to employ approximately 50,000 workers within the next 2 years. It is slated to be operational within 12 to 18 months. However, the existing government-supported PLI (Production-Linked Incentive) fiscal incentives will expire around the time of operation. Therefore, Apple and Tata Group may seek new subsidies from the government for the production of the new iPhones.

Apple has been actively expanding in India, and the new iPhone assembly plant is a crucial strategy for both companies. For Apple, it serves to diversify the supply chain risk by gradually shifting the assembly of iPhones from China to India. Meanwhile, Tata Group aims to expand its traditional business scope.

Read more

• Tata Group to Become the Fourth iPhone Assembler as Production Relocation Accelerates
• [Insights] Tata’s Challenge in Securing Large iPhobe Orders After Officially Acquiring Wistron’s India Factory

(Photo credit: Apple)

In the pursuit of a larger screen-to-body ratio, smartphones adopting a “bezel-less” design have become a trend. According to a report from the Korean media outlet “The Elec,” rumors in the market suggest that Apple’s iPhone 17 Pro, expected to be released in 2025, will achieve a “100% bezel-less” look, with supplier LG Innotek reportedly developing an under-display camera. This innovation could potentially become a major selling point for the new iPhone series.

LG Innotek, a major South Korean smartphone camera module manufacturer, is actively working on developing an Under-Panel Camera (UPC) in response to the specific requirements of its important customer, Apple.

The concept involves completely hiding the camera components beneath the screen, eliminating the need for a camera notch. This approach aims to offer a seamless, all-screen experience, and it is anticipated that iPhones featuring under-display cameras could be introduced within the next few years.

However, the report further indicated from its sources that, currently, Apple is more likely to adopt specifications for under-display Face ID rather than UPC.

The reason behind this lies in the fact that under-display cameras come with certain drawbacks. Since the camera is under the display panel, the light transmission of the cover glass can affect the entry of light into the image sensor. Poor resolution and the inability to support high-speed continuous shooting are common fatal flaws associated with under-display cameras.

Nevertheless, according to “The Elec”, in an attempt to overcome these drawbacks, LG Innotek is working on incorporating a free-curve prism under the display for UPC. This hardware enhancement aims to improve the light transmission of the camera under the screen, addressing the issues of low transparency and poor imaging quality.

However, an industry source has pointed out that it is currently uncertain when Apple will actually use the under-display cameras produced by LG Innotek. Reportedly, according to insiders, Apple is not entirely satisfied with the samples provided by LG Innotek.

As early as 2021, Apple’s competitor Samsung had already introduced the Z Fold 3 with an under-display camera design, but the image quality of the camera was significantly inferior to that of traditional punch-hole cameras.

(Photo credit: LG Innotek)

The labor dispute sparked by TSMC’s venture into the United States is poised to come to a close. TSMC’s Arizona plant and the local labor union, Arizona Building and Construction Trades Council (AZBTC), announced an agreement yesterday. TSMC will collaborate with the local union to establish a workforce training program and maintain transparency on public safety issues.

However, TSMC also retains some flexibility, aiming to recruit local employees while seeking the option to hire foreign workers with “specialized experience” if deemed necessary.

It is anticipated that this agreement aligns with TSMC’s prior request for the dispatch of 500 professional equipment engineers from Taiwan to the United States. This move, with the successful acquisition of technical construction permits, is expected to facilitate the expedited installation of equipment, ensuring smooth operational processes in the future.

While TSMC’s move to set up a factory in the United States was fueled by favorable policies, it faced challenges as contractors were unfamiliar with U.S. regulations, causing delays in mechanical and electrical integration and cleanroom construction.

To expedite the installation of advanced process equipment for the groundbreaking four-nanometer fabrication process in the U.S., TSMC had to mobilize nearly 500 personnel from Taiwan for intensive installation work before system integration.

This decision sparked a strong backlash from the AZBTC, criticizing TSMC for disrespecting local technicians’ expertise and raising concerns about TSMC’s potential intention to introduce cheaper labor, impacting local job rights.

Although TSMC consistently emphasized maintaining good interactions with various unions in Arizona, some union representatives were displeased with TSMC’s practice of dispatching personnel through suppliers. Reportedly, they called on the state and federal governments to pressure TSMC, leading to unexpected delays in the installation of new equipment.

After months of negotiation between TSMC and AZBTC, an agreement was reached, listing agreed-upon priority areas, including union training, communication channels, and on-site personnel allocation. However, TSMC, considering global talent distribution, retained the flexibility to hire foreign construction personnel with specific expertise in certain circumstances.

According to the Greater Phoenix Economic Council(GPEC), the specific terms of the agreement reached between the two parties are as follows:

1. Enhanced Workforce Training and Development

A highly skilled, diverse, and inclusive construction workforce is necessary to meet the timelines of the two fabs. The AZBTC intends to recruit a sufficient number of skilled workers to fulfill manpower requirements of TSMC Arizona’s contractors for the Project. TSMC Arizona will partner with AZBTC on the development of union workforce training programs and curricula. The goal will be to build a construction workforce that can support TSMC Arizona in the near and long term with employment opportunities.。

2. Shared Commitment to Site Safety

TSMC Arizona is deeply committed to workplace safety in the operation of all its facilities. To enhance the partnership, TSMC Arizona will maintain transparency with AZBTC with regards to safety assessments, audits, incident records and improvement plans.

3. Industry Leading, Global Workforce

TSMC Arizona is focused on hiring workers locally in the United States. The AZBTC workforce is highly skilled in constructing microchip manufacturing plants. Circumstances may require TSMC Arizona or its vendors to employ foreign workers with specialized experience.

4. Open and Regular Communication

To ensure TSMC Arizona and AZBTC are fulfilling the spirit of the agreement outlined, and accountable to commitments made, ongoing communication and review via regular forums will be critical. A committee will be formed, consisting of members designated by the affiliated AZBTC unions and members designated by TSMC Arizona and the contractors. These meetings will be held quarterly, one of which will be an annual forecast meeting to project future workforce requirements.

The report notes that TSMC also mentioned in a joint statement that its construction of a fab in Arizona represents the largest single foreign direct investment in the state’s history. This wafer fab is set to be the most advanced semiconductor manufacturing base in the United States, creating thousands of stable and high-paying job opportunities locally.

The ongoing construction of the wafer fab’s two-phase project has already generated thousands of jobs in accordance with the prevailing industry wage standards for members of the AZBTC.

(Photo credit: TSMC)

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• [News] Apple Expands Amkor Partnership at Arizona Fab with Amkor’s $2B Investment in Advanced Packaging