Micron Technology, the U.S. memory giant, has surpassed Wall Street expectations in its projected revenue for the current quarter (December-February). The main factor contributing to this success is the robust demand from data centers, offsetting the sluggish recovery in the PC and smartphone markets.

According to Micron’ released fiscal report for their first quarter (from August to November, 2023) on December 20th, Micron’s revenue rose from USD 4.01 billion in the same period last year to USD 4.73 billion.

Looking ahead to the current quarter (Q2), Micron anticipates revenue reaching USD 5.3 billion ± USD 200 million and diluted loss per share reaching USD 0.28 ± USD 0.07, which are better than market’s consensus.

Micron CEO Sanjay Mehrotra noted that strong execution and pricing strategies contributed to Q1 financial results surpassing expectations. He further stated that, ‘Demand for AI servers has been strong as data center infrastructure operators shift budgets from traditional servers to more content-rich AI servers.’

Mehrotra indicated that Micron is in the final stages of qualifying HBM3e to be used in NVIDIA’s next generation Grace Hopper GH200 and H200 platforms. 

Micron now predicts that PC sales are expected to grow by a low to mid-single-digit percentage in calendar 2024, after two years of double-digit percentage PC unit volume declines. There is also hope for smartphone unit shipments to grow modestly in 2024.

For the HBM market, TrendForce’s latest research indicates that NVIDIA plans to diversify its HBM suppliers for more robust and efficient supply chain management. Samsung’s HBM3 (24GB) is anticipated to complete verification with NVIDIA by December this year.

The progress of HBM3e, as outlined in the timeline below, shows that Micron provided its 8hi (24GB) samples to NVIDIA by the end of July, SK hynix in mid-August, and Samsung in early October.

Given the intricacy of the HBM verification process—estimated to take two quarters—TrendForce expects that some manufacturers might learn preliminary HBM3e results by the end of 2023. However, it’s generally anticipated that major manufacturers including Samsung, SK Hynix and Micron will have definite results by 1Q24. Notably, the outcomes will influence NVIDIA’s procurement decisions for 2024, as final evaluations are still underway.

Read more

• Manufacturers Anticipate Completion of NVIDIA’s HBM3e Verification by 1Q24; HBM4 Expected to Launch in 2026, Says TrendForce
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(Photo credit: Micron)

In response to export restrictions on AI chips by the U.S. Department of Commerce, NVIDIA has previously introduced a China-Exclusive version of its graphics card, featuring the AD102-250 GPU and named GeForce RTX 4090 D.

According to ICsmart’s report, industry insiders has revealed that NVIDIA is rumored to officially unveil GeForce RTX 4090 D on December 28 at 10:00 PM (GMT+8), with the suggested retail price remaining at CNY 12,999.

Due to the impact of the new U.S. export restrictions on semiconductor to China in October this year, NVIDIA’s high-end gaming graphics card, GeForce RTX 4090, faced restrictions in sales in China.

In order to address this issue, NVIDIA decided to develop the customized GeForce RTX 4090 D specifically for the Chinese market. By adjusting certain specifications to comply with U.S. export control requirements, they aim to continue sales in the Chinese market.

According to previous information, the RTX 4090D is still based on TSMC’s 4nm process, featuring the AD102 GPU. However, the core designation changes from AD102-300 to AD102-250, corresponding to a downgrade in specifications. The exact number of CUDA cores is not yet clear, but is expected to be fewer than the 16,384 cores in the RTX 4090.

Additionally, the core base clock will see a slight increase from 2235MHz to 2280MHz, while the boost clock remains at 2520MHz. It is possible that the card will retain 24 GB of GDDR6X memory capacity with over 1 TB/s of bandwidth. The total board power (TBP) is expected to see a slight reduction from 450W to 425W.

Read more

• [Insights] NVIDIA Maintains Confidence Despite Export Restrictions, Continues Unveiling New Products
• [News] NVIDIA Confirms Development of “Compliance Chips” for the Chinese Market

(Photo credit: NVIDIA)

According to the latest panel price data released by TrendForce in late December, due to subdued demand at the year-end, prices for panels in the TV, monitor, and notebook (NB) segments have all experienced declines. Details are as follows:

TV Panel:

As we approach the year-end, with less-than-ideal results from the Black Friday promotions, there’s only a modest demand rebound observed for channel-owned brands with better sales performance. Major first-tier brands continue to adjust their panel order demands.

However, panel manufacturers are actively controlling output and inventory levels through production cuts. They even announced a nearly two-week annual preventive maintenance during the Lunar New Year in the first quarter of the coming year to ease the pressure of falling prices, while creating an atmosphere conducive to a potential reversal in panel prices.

Due to the signs of an expanding production cut, the current observed decline in TV panel prices in December is comparable to November, with a $2 decline for 32″ and 43″, a $3 decline for 50″, a $2 decline for 55″, and a $3 decline for 65″ and 75″.

Monitor Panel:

For monitor panels, demand has remained weak throughout the fourth quarter. Panel manufacturers had only made slight concessions in prices for high-end models in the past few months. However, entering December, the pressure of price declines has extended to mainstream panel specifications. To maintain shipping momentum, some panel manufacturers have noticeably softened their pricing stance. The observed decline in December is expected to be $0.2 for 23.8″ Open Cell panels and $0.1 for 21.5″, 23.8″, and 27″ panels.

NB Panel:

In terms of notebook panels, demand has significantly weakened in the fourth quarter. Faced with the pressure to maintain shipping momentum, panel manufacturers are experiencing changes in the previously stable panel prices over the past few months. As a result, buyers are beginning to have more negotiating power.

Observing panel prices in December, apart from 11.6″ and 14″/15.6″ TN models maintaining stability due to lower prices and limited supply, prices for 14″/15.6″ IPS models are expected to see a slight decline of $0.1.

Amid a gradual recovery in the memory market, South Korean memory giants Samsung and SK Hynix are reportedly set to expand their equipment investments significantly next year.

Samsung aims for a 25% increase in investment, while SK Hynix plans to more than double its investment compared to this year, concurrently increasing production capacity, sparking industry attention.

According to South Korean media outlet ETNEWS, both Samsung and SK Hynix are planning to boost semiconductor equipment investments in 2024. Samsung’s investment is estimated at around KRW 27 trillion (approximately USD 20.78 billion), representing a 25% growth, while SK Hynix plans an investment of around KRW 5.3 trillion (approximately USD 4.07 billion), signaling a 100% increase from this year’s investment.

As ETNEWS’ report revealed, in addition to increasing equipment investment, Samsung and SK Hynix have also raised their production capacity targets for 2024. Samsung plans to expand both DRAM and NAND Flash production by approximately 24%, while SK Hynix aims to elevate DRAM output to levels seen by the end of 2022.

Looking at market share, according to TrendForce’s released data, in terms of third-quarter revenue figures, Samsung holds approximately 38.9% market share in DRAM, while SK Hynix stands at 34.3%.

In the NAND segment, Samsung holds approximately 31.4% market share, while SK Hynix stands at 20.2%.

Market concerns arise as the memory industry, which has recently seen relief from the long-standing oversupply pressure due to major manufacturers reducing production, faces the possibility of disruption once again. Amid the rebound in prices, the significant investments planned by the two major South Korean companies are causing apprehension that the memory industry may face new challenges.

Memory industry sources believe that despite Samsung and SK Hynix’s plans to increase semiconductor equipment investment and boost production capacity in 2024, the tool-in still take time. Improving production capacity utilization is not an instantaneous process.

Furthermore, there is a general consensus in the industry that several AI-related applications in the future will require large-capacity memory support. For instance, the expected 3% growth in global smartphone shipments (based on TrendForce’s report) next year is anticipated to contribute to the expansion of demand in the high-value memory market.

TrendForce also pointed out that recent news about memory manufacturers expanding investment and increasing production capacity is primarily driven by the growing demand in the HBM market, rather than capacity expansion for all products.

Read more

• NAND Flash Industry Revenue Grows 2.9% in 3Q23, Expected to Surge Over 20% in Q4, Says TrendForce
• Contract Prices Bottom Out in Q3, Reigniting Buyer Momentum and Boosting DRAM Revenue by Nearly 20%, Says TrendForce

(Photo credit: Samsung)

Affected by the year-end and relatively sluggish demand, spot prices of DRAM and NAND Flash have shown a hovering trend this week. Details are as follows:

DRAM Spot Market:

With the year ending, some DRAM suppliers have released more their existing stocks into the spot market in order to lower their inventories further. As a result, spot prices of DRAM chips on the whole have fallen slightly. Currently, spot prices are still mostly hovering because buyers have yet to increase procurement quantities despite the rally of contract prices. The average spot price of the mainstream chips (i.e., DDR4 1Gx8 2666MT/s) rose by 0.11% from US$1.745 last week to US$1.747 this week.

NAND Flash Spot Market:

The spot market, bearing resemblances to that of DRAM, lacks drivers for a continuous increase in prices due to buyers’ stagnated purchase sentiment at the end of the year. Fortunately, the market is currently at a price correction phase as provision remains exceedingly restricted among suppliers due to their unchanged reluctance in sales. 512Gb TLC wafer spots have risen by 1.62% this week, arriving at US$3.075.