China is actively investing in chips with a mature process of 20nm and above. According to Chosun Ilbo, some insiders signal a potential shift of over 50% of global mature-node chips production to China within the next 2 to 3 years. As semiconductors focusing on mature process account for 75% of overall chip demand, China’s growing influence in this sector raises significant security concerns.

During the APEC SME Technology Conference and Fair in Qingdao on the 9th of this month, Wei Li, former Vice President of SMIC, emphasized the necessity for China to prioritize the localization of semiconductors with a 20nm process and above. This category includes semiconductors focusing on mature process, where Li acknowledged China’s technology lags behind international counterparts by more than 5 years.

Despite China’s efforts for independent development, the semiconductor industry faces comprehensive restrictions from the United States, heavily relying on imports for materials, equipment, and design software, with only about 10% being domestically produced. China, holding over 1/3 of the global chip market, struggles with a self-sufficiency rate below 15%, hindering its industrial progress, especially with foreign countries imposing export controls on advanced process and equipment.

According to South Korean media reports, concerns have arisen within the industry about the potential impact on the global semiconductor supply chain as China expands its mature processes. Despite the recent surge in demand for advanced chips like AI chips and servers, semiconductors focusing on mature process still constitute 75% of overall demand. These chips are crucial not only in autonomous vehicles, automobiles, and home appliances but also in military applications. If China monopolizes this market, it could lead to a severe security crisis.

China is rapidly increasing its market share in the mature-node chips sector, with the government offering up to a 10-year corporate tax exemption for new domestic semiconductor plants. Last year, SMIC invested USD 8.9 billion in Shanghai to build a 28nm plant.

Data from TrendForce indicates that China plans to construct 32 semiconductor plants by 2024, surpassing Taiwan’s 19 and the United States’ 12.

China’s Wafer Fabs Hits 44 with Future Expansion 32, Mainly Targeting on The Mature Process

China’s Expansion into the mature process market poses big challenges for Korean enterprises. Chinese companies are gaining ground in various sectors, including the image sensor market, encompassing DDI semiconductors used in OLED panels. Beyond manufacturing capabilities, China has achieved noteworthy levels of design expertise in semiconductor technologies.

On the other hand, in previous press release, TrendForce predicted China’s mature process capacity to grow from 29% this year to 33% by 2027. Leading the charge are giants like SMIC, Hua Hong Group, and Nexchip, while Taiwan’s share is estimated to consolidate from 49% down to 42%.

TSMC, UMC, and Samsung are the frontrunners in this technology currently. Yet, Chinese players like SMIC and Nexchip are hot on their heels, swiftly closing the gap. SMIC’s 28HV and Nexchip’s 40HV are gearing up for mass production in 4Q23 and 1H24, respectively—narrowing their technological gap with other foundries.

China’s Share in Mature Process Capacity Predicted to Hit 29% in 2023, Climbing to 33% by 2027, Says TrendForce

As China enhances its influence over mature-node chips, both the U.S. and the EU are contemplating countermeasures. Despite months of discussions, there are still no concrete results regarding these potential measures.
(Image: SMIC)

Foxconn has announced plans to invest over USD 1.5 billion in expanding its facilities in India. This substantial investment, a rarity in recent years, has sparked speculation that Foxconn is preparing for the introduction of new iPhone products in India.

Due to reports suggesting that in the second half of 2024, Apple will initiate the design, development, and trial production process for the iPhone 17 in India, if true, this would mark the first time in iPhone history that a New Product Introduction (NPI) is conducted outside of China, solidifying India as a potential global iPhone production hub.

Foxconn’s subsidiary, Foxconn Hon Hai Technology India Mega Development Private Limited, disclosed the plan to build the factory locally, with an expected investment of INR 128.209 billion (approximately USD 1.537 billion). This move is seen as a strategic effort to enhance iPhone production capacity in India.

According to TrendForce’s estimate, the proportion of iPhones produced in India is still below 10% in 2023, expected to reach 25-30% by 2025, and projected to achieve 35-40% by 2028. TrendForce believes that with the stable production base of Foxconn in India, it can indeed expand the output.

Analyst Ming-Chi Kuo from TF International Securities disclosed that Apple is placing a growing emphasis on the Indian market. The company intends to kick off the NPI process for the standard edition of the iPhone 17, slated for release in the second half of 2025, in India during the latter part of 2024.

Kuo further highlighted that this development signifies the first instance of a new iPhone model being developed outside of China. Choosing the standard version of the iPhone for development lowers the design complexity, reducing risks. This year, 75-80% of iPhones produced in India are manufactured by Foxconn.

According to a previous report by Indian media Economic Times, Foxconn’s factory in Tamil Nadu, India, has been producing the iPhone 15 Plus in the fourth quarter of this year and has already started production of the standard version of the iPhone 15.

Before the iPhone 14, only a small portion of Apple’s phones were assembled in India, with shipments lagging six to nine months behind those in mainland China. However, this year, India has officially entered the supply chain for the initial batch of new iPhones.

Foxconn’s India representative, V Lee, previously stated that the company was “aiming for another doubling of employment, FDI (foreign direct investment), and business size in India” by next year. However, no further details were provided.

In other product areas, there have been recent reports that three subsidiaries of the Foxconn Group will be among the first approved list of incentives for information technology (IT) production in India. Foxconn Group is also accelerating its layout for manufacturing and components in India.

(Photo credit: Apple)

The semiconductor industry in China is gradually recovering in response to shifts in downstream demand in the end of November. This positive trend is reflected in the industry’s dynamics of investment and financing.

There have been nearly 40 financing events in the semiconductor industry. Sectors such as storage chips, MEMS, automotive-grade chips, third-generation semiconductors, and semiconductor materials/equipment are particularly attracting capital. Companies in the spotlight include SCY, Sinopack, YT Micro, Oritek, Analogysemi, Konsemi, and UniSiC.

SCY: Advancing Core Storage Technology 

Shenzhen-based SCY has successfully concluded Series B strategic financing, led by Xiaomi Industry Fund and joined by several upstream and downstream companies. The funds raised will be dedicated to enhancing core storage technology, research and development, furthering global strategies. SCY aims to establish its own storage brands, SCY and WeIC, in the terminal market. The company has achieved a breakthrough in the second-generation Flip Chip advanced packaging technology, with the full-scale production of its self-developed 512GB UFS3.1 storage chip. The expectation is to achieve mass production of 1TB capacity UFS3.1 next year.

Sinopack: Advancements in Ceramic Packaging 

Sinopack has completed Series B strategic financing, earmarking the capital for production line construction and research and development to stimulate the company’s second growth curve. Established in 2009, Sinopack focuses on ceramic packaging applied in optical communication, wireless communication, and other fields. The company has successfully developed precision ceramic components with core materials such as aluminum oxide and aluminum nitride. Sales revenue in the first half of 2023 has already surpassed the entire year of 2022.

YT Micro: Driving Automotive-grade Chip Innovation

Jiangsu-based YT Micro has successfully secured Series B1 round financing. The company specializes in automotive-grade chips design. With deep collaborations with numerous automotive OEMs  and automotive component companies, YT Micro has executed 300+ specified projects, resulting in millions of shipments. Future plans include increased investment in the research and development and mass production of high-performance automotive processor chips, expanding industrial ecological cooperation, and strengthening strategic business collaborations with OEMs and Tier1.

Oritek: Pioneering Intelligent Automotive Solutions

Oritek stands as China’s first provider focusing on the third generation of intelligent automotive E/E architecture. The company’s Longquan series chips cater to smart automotive terminal-side intelligent components, smart local processing unit, and integrated central computing units for parking and charging in 2023. The Longquan 560 chip was unveiled in 2023.

Analogysemi: Advancing Analog and Mixed-signal Chips

Founded in 2018, Analogysemi concentrates on analog and mixed-signal chips, applied across various markets like industrial, communication, medical, and automotive. The company has successfully entered the automotive electronics field, achieving mass production of products such as automotive-grade DC brushed motor drivers, widely used in automotive electronic components.

Konsemi: Elevating Embedded Storage Solutions

Established in November 2018, Konsemi focuses on the research and development of embedded storage controller chips and modules. It stands among the few Chinese manufacturers independently designing a complete range of embedded storage chips. With applications spanning smart TVs, set-top boxes, mobile devices, smart wearables, communication devices, drones, industrial robots, and new energy vehicles, Konsemi’s self-developed eMMC product has received certifications from mainstream manufacturers and is integrated into the supply chain of renowned brands, with sales reaching millions.

UniSiC: Leading in Power Semiconductor Device Testing

UniSiC has successfully concluded a billion-yuan strategic financing, earmarked for forward-looking product research and development and global expansion. Established in 2020, the company focuses on power semiconductor device testing and high-frequency power electronic applications. With successful developments in silicon carbide technology and securing multiple orders, UniSiC’s SiC ATE product has commenced overseas installations.

On October 26, 2023, Stellantis announced a EUR 1.5 billion investment to acquire approximately 20% of Leapmotor, securing two seats on its board. Additionally, Stellantis and Leapmotor will establish a joint venture named “Leapmotor International” with ownership stakes of 51% and 49%, respectively. The CEO of the joint venture will be appointed by the Stellantis group.

TrendForce’s Insights:

1. Leapmotor’s High Self-Reliance in EV Technology (Electric Motor, Battery, Electronic Control) with Completed Four-Domain Integration in EEA Architecture

Before Stellantis took over Leapmotor, European automakers like Volkswagen and Audi had previously collaborated with Chinese counterparts such as XPENG and SAIC in the electric vehicle sector and technological development. The primary aim was to exchange different resources, including funding or access to the European market, for China’s EV technology.

Leapmotor, in addition to independently developing battery packs and an 800V silicon carbide electric drive system, has based its control system on the self-developed “Four-Leaf Clover” Electronical/Electric Architecture (EEA).

This architecture achieves cross-domain integration across four domains—power, body, ADAS, and cabin—utilizing a central computing platform to significantly reduce the use of Electronic Control Units (ECUs) and related wiring. This integration enhances the overall intelligence and range of the vehicle.

Stellantis had previously expressed a “light asset” strategy for the Chinese market, aiming to reduce fixed costs. Collaborating with Leapmotor enables cost savings in independent research and development.

On a global strategic level, Stellantis has its own electric platform, “STLA.” Therefore, cooperation with Leapmotor provides immediate support for Stellantis in the platform of EV technology and market development, both in China and globally.

2. Leapmotor Need to Seize the Opportunity to Accelerate Overseas Expansion

While Stellantis’ current focus is not on the Chinese market, its integration of resources from the merger of FCA (Fiat Chrysler) and PSA (Peugeot Citroën) provides a significant market foundation in Europe and the Americas. According to Stellantis’ disclosed data for the first half of 2023, it achieved a net revenue of EUR 98.4 billion, a 12% growth, and a net profit of EUR 10.9 billion, a 37% growth.

The sales volume of new energy vehicles also grew by 24% during the same period. The “Leapmotor International” joint venture between Stellantis and Leapmotor is not only responsible for the Greater China region but plays a crucial role in global sales and holds exclusive manufacturing rights for Leapmotor’s vehicle models.

Although Leapmotor holds a technological edge in three key components over European and American automakers, it faces fierce competition in the Chinese market from startups like NIO, XPeng, Li Auto, and traditional manufacturers like SAIC and Great Wall Motor. In the third-quarter financial report of 2023, Leapmotor achieved a gross profit margin of 1.2%, marking its first positive gross profit.

However, the net profit continues to incur losses. Stellantis’ financial injection serves to alleviate Leapmotor’s financial pressures, allowing it to capitalize on opportunities for global expansion.

In addition, amidst the escalating competition among Chinese automakers to enhance their export capabilities, Leapmotor can leverage Stellantis’ mature sales channels and resources to gain a strategic advantage in the international arena. The operational control of Leapmotor International remains in the hands of Stellantis, not only acquiring Leapmotor’s technology but also eliminating a potential competitor.

This transaction is built on the mutual benefits each party seeks, potentially establishing a collaborative model for future technology and market-sharing partnerships between Chinese and European automotive manufacturers.

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TSMC’s Chairman, Mark Liu, recently addressed the challenges posed by global fragmentation and emerging national security concerns, which may potentially lead to a slowdown in global innovation. Despite these concerns, Liu emphasized Taiwan’s ability to respond calmly. TSMC remains committed to advancing its manufacturing processes and collaborates closely with clients to establish an open innovation platform.

On November 22th, Liu spoke at a lecture organized by Chinese National Association of Industry and Commerce, Taiwan (CNAIC), focusing on “TSMC in the AI Era,” as reported by the Central News Agency (CNA). During the lecture, Liu highlighted that Taiwan’s semiconductor industry, serving as a cornerstone, plays a vital role in driving advancements in AI applications.

However, he also acknowledged that the ongoing US-China chip war has brought global fragmentation and raised national security concerns, potentially slow down the pace of global innovation. Despite these challenges, Liu expressed confidence in Taiwan’s ability to handle them effectively.

In terms of  latest updates on TSMC’s global fabs, Liu mentioned positive communication with local unions in the US, showcasing TSMC’s ability to adapt and learn from new experiences. He also commended the high-quality and dedicated personality of Japanese engineers during his visit to Japan.

TSMC’s fab in Arizona, employing nearly 1,100 local staff, continues to recruit talents with plans for mass production to commence in 2025. The Kumamoto fab in Japan is expected to initiate production of 12nm, 16nm, 22nm, and 28nm processes by the end of the next year.

Regarding TSMC’s upcoming fab in Germany, the company aims to establish a specialized wafer fab focusing on automotive and industrial applications. This fab will produce 12nm, 16nm, 22nm, and 28nm processes, with construction set to begin in the second half of the next year and production slated for the end of 2027.

[News] TSMC’s Fab in Germany Progress Reports Potential Setback in Manager Selection?

Rise of Nvidia and other fabless companies, anticipating 10% growth in the next five years

Looking forward to the future tech landscape, Liu also anticipated Nvidia’s emergence as the world’s largest semiconductor company in 2023. From recent financial reports, Nvidia’s Q3 revenue reached USD 18.12 billion, surpassing TSMC’s USD 17.27 billion for the same quarter, as well as Intel’s USD 14.16 billion and Samsung Semiconductor’s USD 12.52 billion.

The rapid progress of Fabless companies also caught Liu’s eye. Fabless companies are expected to grow by around 10%, and IDMs by only 4% in the next five years. Additionally, he emphasized that semiconductor technology advances threefold every two years, projecting a 242-fold improvement over a decade.

What is “Fabless”?

Companies exclusively engaged in semiconductor design are referred to as “Fabless.” This term originates from the fact that these companies do not have their own fabrication. They are also known as “fabless semiconductor companies” due to their specialty of not owning production fab. Further categorization within fabless companies includes IC design and IP design.

Industry note that Nvidia’s growth as a fabless company is attributed to the surging demand for AI, including an optimized product portfolio. While Nvidia’s financial report mentioned geopolitical limitations and potential delays in H20’s launch, the company remains a global leader in AI computing. As for TSMC, it stands out as the most advanced pure-play foundry with its 3nm process, gradually increasing production in the second half of the year to alleviate inventory adjustment pressures within the rest of the 7nm family.
(Image: TSMC)