According to a report by Taiwan’s Economic Daily, the latest GH200 module released by NVIDIA has seen its assembly orders exclusively undertaken by Foxconn, while the assembly orders for L40S are also entirely managed by Foxconn.

Foxconn has traditionally refrained from commenting on individual business and order dynamics. It is believed that AI chip modules constitute the highest-margin product within the entire server supply chain.

Foxconn has been a longstanding partner of NVIDIA, providing an end-to-end solution across chip modules, baseboards, motherboards, servers, and chassis. Foxconn’s capabilities have facilitated the creation of a comprehensive solution for NVIDIA’s AI server supply chain.

Previously, Foxconn had an exclusive assembly partnership with NVIDIA for the “H100” and “H800” modules, not only retaining the existing orders but also securing a substantial portion of the HGX module orders. Now, reports indicate that Foxconn will exclusively supply even NVIDIA’s newly unveiled GH 200, and the L40S.

Industry sources indicate that due to severe constraints on TSMC’s advanced CoWoS packaging capacity, the scaling up of NVIDIA’s AI chip production has been hindered. However, with new CoWoS production capacity set to gradually open up in the late third quarter to the fourth quarter, shipments of Foxconn’s AI chip modules are anticipated to rapidly increase.

Industry sources reveal that in business negotiations, NVIDIA is known for demanding from its suppliers, but it is also generous in its offerings. As long as suppliers provide products that meet or even exceed expectations, NVIDIA is willing to offer reasonable prices, fostering mutually beneficial relationships with its partners.

(Photo credit: NVIDIA)

According to a report by TechNews, it’s widely known that Apple has been quietly working on a not-so-secretive project known as “Project Titan,” which is centered around the development of the Apple Car. As per Autoevolution, the Apple Car might become the first vehicle to feature a Micro LED display. At the same time, TrendForce’s latest research indicates that Micro LED displays are set to become widely adopted in the automotive industry during the latter half of this century.

However, the exact unveiling date of the Apple Car remains unconfirmed. The most recent speculation suggests that this electric vehicle model could be launched in 2025 or 2026.

Apple has long aimed to incorporate Micro LED technology into its products. Initially, it was thought that the Apple Watch would be the first Apple product to adopt a Micro LED display. However, due to supply chain adjustments, the transition of the Apple Watch from OLED to Micro LED might be delayed until 2026, while Apple initially planned to introduce Micro LED technology to its watches by 2025.

Although the timeline for Micro LED introduction in the Apple Watch has been pushed to 2026, that year might witness widespread Micro LED adoption across various Apple products, including headsets, smartphones, and automotive applications.

Once Micro LED technology finds its way into the Apple Car, it’s expected to trigger emulation within the automotive industry, leading to the widespread integration of Micro LED technology in future vehicle models. TrendForce suggests that car manufacturers in Europe, America, and Japan show considerable enthusiasm for adopting Micro LED.

But what benefits does Micro LED bring to automotive applications? It’s understood that Micro LED can reduce power consumption, enhance brightness, and offer reliability. Considering the significant performance improvements and the push toward electric vehicles, once Micro LED’s benefits are demonstrated in automotive contexts, car manufacturers are expected to embrace it on a large scale.

However, the exact launch date of the Apple Car remains uncertain. While there were earlier speculations of a possible 2025 release, insiders now suggest Apple has pushed the launch to 2026. Though Apple initially had ambitious goals for Project Titan, the first Apple Car might adopt a more traditional design than initially envisioned, including features like a steering wheel and pedals.

Rumors suggest Apple’s ultimate goal for the Apple Car is to transform the cabin into a living room-like environment, with the aim of removing the steering wheel and pedals to achieve full self-driving capabilities. However, the initial Apple Car might showcase limited autonomous driving features and share design similarities with existing Tesla models.

(Photo credit: AUO)

According to sources familiar with the matter within Xiaomi, as cited by Chinese media outlet Jiemian News, the Xiaomi electric vehicle that has been spotted multiple times on the roads has finalized its battery supplier list. Both selected suppliers are Chinese companies. The primary battery supplier is set to be CALB, while the secondary supplier is the well-known CATL.

Reports indicate that Xiaomi initially planned to have CATL as the primary supplier, but there was a change of plan. This change could be attributed to the conclusion of patent disputes between CATL and CALB regarding lithium-ion batteries, cathode electrode sheets, and battery-related patents. The National Intellectual Property Administration invalidated the two aforementioned patents held by CATL, allowing CALB to re-enter the market with competitive pricing against CATL.

The report mentions that Xiaomi’s initial electric vehicle production volume is relatively low, which limits its bargaining power. The cost per battery pack starts at 80,000 RMB, accounting for approximately half of the overall cost. The proportion of supplies from the primary and secondary suppliers will reportedly be adjusted based on Xiaomi electric vehicle’s actual sales after its launch. The report also highlights the possibility of Xiaomi introducing additional battery suppliers like BYD through an open bidding process to lower battery costs and enhance bargaining capabilities in the future.

(Photo credit: Xiaomi FB)

According to the Korea Economic Daily. Samsung Electronics’ HBM3 and packaging services have passed AMD’s quality tests. The upcoming Instinct MI300 series AI chips from AMD are planned to incorporate Samsung’s HBM3 and packaging services. These chips, which combine central processing units (CPUs), graphics processing units (GPUs), and HBM3, are expected to be released in the fourth quarter of this year.

Samsung is noted as the sole provider capable of offering advanced packaging solutions and HBM products simultaneously. Originally considering TSMC’s advanced packaging services, AMD had to alter its plans due to capacity constraints.

The surge in demand for high-performance GPUs within the AI landscape benefits not only GPU manufacturers like NVIDIA and AMD, but also propels the development of HBM and advanced packaging.

In the backdrop of the AI trend, AIGC model training and inference require the deployment of AI servers. These servers typically require mid-to-high-end GPUs, with HBM penetration nearing 100% among these GPUs.

Presently, Samsung, SK Hynix, and Micron are the primary HBM manufacturers. According to the latest research by TrendForce, driven by the expansion efforts of these original manufacturers, the estimated annual growth rate of HBM supply in 2024 is projected to reach 105%.

In terms of competitive dynamics, SK Hynix leads with its HBM3 products, serving as the primary supplier for NVIDIA’s Server GPUs. Samsung, on the other hand, focuses on fulfilling orders from other cloud service providers. With added orders from customers, the gap in market share between Samsung and SK Hynix is expected to narrow significantly this year. The estimated HBM market share for both companies is about 95% for 2023 to 2024. However, variations in customer composition might lead to sequential variations in bit shipments.

In the realm of advanced packaging capacity, TSMC’s CoWoS packaging technology dominates as the main choice for AI server chip suppliers. Amidst strong demand for high-end AI chips and HBM, TrendForce estimates that TSMC’s CoWoS monthly capacity could reach 12K by the end of 2023.

With strong demand driven by NVIDIA’s A100 and H100 AI Server requirements, demand for CoWoS capacity is expected to rise by nearly 50% compared to the beginning of the year. Coupled with the growth in high-end AI chip demand from companies like AMD and Google, the latter half of the year could experience tighter CoWoS capacity. This robust demand is expected to continue into 2024, potentially leading to a 30-40% increase in advanced packaging capacity, contingent on equipment readiness.

(Photo credit: Samsung)

US-based CSPs have been establishing SMT production lines in Southeast Asia since late 2022 to mitigate geopolitical risks and supply chain disruptions. TrendForce reports that Taiwan-based server ODMs, including Quanta, Foxconn, Wistron (including Wiwynn), and Inventec, have set up production bases in countries like Thailand, Vietnam, and Malaysia. It’s projected that by 2023, the production capacity from these regions will account for 23%, and by 2026, it will approach 50%.

TrendForce reveals that Quanta, due to its geographical ties, has established several production lines in its Thai facilities centered around Google and Celestica, aiming for optimal positioning to foster customer loyalty. Meanwhile, Foxconn has renovated its existing facilities in Hanoi, Vietnam, and uses its Wisconsin plant to accommodate customer needs. Both Wistron and Wiwynn are progressively establishing assembly plants and SMT production lines in Malaysia. Inventec’s current strategy mirrors that of Quanta, with plans to build SMT production lines in Thailand by 2024 and commence server production in late 2024.

CSPs aim to control the core supply chain, AI server supply chain trends toward decentralization

TrendForce suggests that changes in the supply chain aren’t just about circumventing geopolitical risks—equally vital is increased control over key high-cost components, including CPUs, GPUs, and other critical materials. With rising demand for next-generation AI and Large Language Models, supply chain stockpiling grows each quarter. Accompanied by a surge in demand in 1H23, CSPs will become especially cautious in their supply chain management.

Google, with its in-house developed TPU machines, possesses both the core R&D and supply chain leadership. Moreover, its production stronghold primarily revolves around its own manufacturing sites in Thailand. However, Google still relies on cooperative ODMs for human resource allocation and production scheduling, while managing other materials internally. To avoid disruptions in the supply chain, companies like Microsoft, Meta, and AWS are not only aiming for flexibility in supply chain management but are also integrating system integrators into ODM production. This approach allows for more dispersed and meticulous coordination and execution of projects.

Initially, Meta heavily relied on direct purchases of complete server systems, with Intel’s Habana system being one of the first to be integrated into Meta’s infrastructure. This made sense since the CPU for their web-type servers were often semi-custom versions from Intel. Based on system optimization levels, Meta found Habana to be the most direct and seamless solution. Notably, it was only last year that Meta began to delegate parts of its Metaverse project to ODMs. This year, as part of its push into generative AI, Meta has also started adopting NVIDIA’s solutions extensively.