Market reports suggest Nvidia's new product release cycle has shortened from two to a year, sparking intense competition among major memory companies in the realm of next-gen High Bandwidth Memory (HBM) technology. Samsung, SK Hynix, and Micron are fervently competing, with SK Hynix currently holdin...

The investment momentum of China's Big Fund Phase II shows no signs of slowing down, with its latest investment directed at Shanghai Huali Microelectronics Co., Ltd. (HLMC), a subsidiary of Huahong Group. According to Sina Finance's report, this substantial investment of up to USD 1 billion will ...

AMD announced the Ryzen 8040 series processor at the AMD Advance AI event. With TSMC's advanced 4nm process, this new processor boasts up to a 1.6x improvement in AI processing performance compared to its predecessor. From AMD's press release, the Ryzen 8040 series introduces the Ryzen AI Network...

Memory prices continue to rise, with the world's top five memory chip manufacturers, including Western Digital (WDC), notifying their distributors and consumer customers on December 5th that they will shorten the quoting period for their two major products – HDD and NAND Flash memory. Instead, the...

Samsung, the Korean tech giant, has unveiled SAINT technology to counter TSMC's advanced CoWoS packaging, aiming to benefit from the surging AI market. Market reports reveal that Samsung is strategically procuring a substantial amount of 2.5D packaging equipment, indicating a keen awareness of the s...