Undaunted by deadlocked US-Sino relations, the great pandemic of 2020, and the US Department of Commerce’s ban on Huawei’s use of software and equipment produced by US manufacturers in the same year, China’s packaging and testing industry has, instead, used these factors as stimulus get back on track. Faced with these three major challenges, the Chinese government has responded with policies such as domestically producing both equipment and semiconductors, allowing China’s packaging and testing industry to buck the trends set in 2020. According to TrendForce statistics, industry revenue in 2020 reached US$7.02 billion and approximately US$9.53 billion in 2021.

A brief summary of China’s packaging and testing industry in recent years is as follows: the US-Sino trade war has been raging since 2018 and, due to tariff issues and the gradual rise in personnel salaries, terminal manufacturers whom had already established plants or subsidiaries in China were forced to gradually relocate relevant factories to SE Asia and India in order to avoid growing overhead costs, moreover impacting the revenue performance of China’s packaging and testing industry. As of June 2019, the tariff issue remained unresolved due to dubious US.-Sino relations but this issue could no longer impede the revenue recovery momentum of China’s packaging and testing industry.

Packaging and testing and localized equipment skirts bans and a moderate threshold for technology research and development attracts overseas manufacturers

After the U.S. Department of Commerce imposed export control bans on Huawei, HiSilicon, and SMIC, the market mostly predicted that China’s packaging and testing industry would be hit next but this did not happen. According to TrendForce, the primary reason for this is that the nature of current back-end packaging and testing technology is relatively crude compared to front-end wafer manufacturing and, considering Chinese government’s recent policy of localizing equipment and the degree of substitutability of non-US equipment manufacturers, even if the U.S. Department of Commerce proposes further bans against the industry, its effects will be limited.

In response to the US-Sino trade conflict, the Chinese government has proposed relevant measures such as semiconductor autonomy which has driven a gradual mainstreaming of domestic equipment production plans. In addition, national funds have been continuously injected into semiconductor equipment manufacturers, even though the level of technological development at this stage remains inferior to major manufacturers in Europe, the United States, and Japan. However, for those with modest requirements for back-end process conditions, testing, and testing equipment, China’s domestic packaging and testing equipment does have a certain proportion and scale.

For example, relevant companies such as Hangzhou Changchuan and Shanghai Raintree have invested in the automatic optical inspection instruments (AOI) and testing equipment that are required in the latter stage of packaging and testing. On the other hand, due to the relatively low threshold for research and development of back-end packaging and testing equipment, many international companies such as Japan’s Advantest and Singapore’s Besi have also set up shops in China. Chinese packaging and testing and their equipment manufacturers are essentially unaffected by relevant export bans, so the industry can still anticipate technological and revenue performance in the next few years.

（Image credit: Pixabay）

The Bureau of Industry and Security (BIS) of the U.S. Department of Commerce recently issued the latest Unverified List (UVL) which includes ChuZhou HKC Optoelectronics Technology Co., Ltd., according to TrendForce’s investigations. The announcement states that if U.S. suppliers wish to ship products to companies on the UVL, they can still submit documentation to obtain a shipping license. According to TrendForce’s understanding, the primary reason ChuZhou HKC is included on the UVL is that it plans to import panel-related analytical instruments from the United States in the near future, and actions taken by BIS are not indicative of the Chinese panel industry as a whole. Currently, ChuZhou HKC is in the process submitting proposals and negotiating with its U.S. material suppliers, thus TrendForce’s assessment is that there is no impact on the supply and shipment of ChuZhou HKC products for the time being.

It should be noted that according to TrendForce statistics, HKC’s Chuzhou plant will account for only 3.8% of global LCD panel capacity in 2022, which is a fairly insignificant share. However, this plant accounts for 30% of HKC’s own capacity, thereby playing a pivotal role in company production. The Chuzhou factory primarily produces TV panels and monitor panels, among which TV panels account for nearly 80% of the factory’s production. If the current ban cannot be resolved smoothly, it will impact shipments of HKC TV panels.

In addition, the glass substrates used in HKC’s Chuzhou factory are sourced from multiple glass substrate suppliers, with approximately 40% coming from Corning, a U.S. supplier. Since Corning localized it production according to the location of panel makers, it is not expected to be limited by the restrictions on the export of U.S. production to China enumerated on the UVL, but detailed regulations are still awaiting clarification. At present, the supply of materials has not been affected, HKC’s Chuzhou plant maintains normal operation, and its clients have yet to move panel procurement away from the Chuzhou production line.

For more information on reports and market data from TrendForce’s Department of Display Research, please click here, or email Ms. Vivie Liu from the Sales Department at vivieliu@trendforce.com

From 2020 to 2025, the compound annual growth rate (CAGR) of 12-inch equivalent wafer capacity at the world’s top ten foundries will be approximately 10% with the majority of these companies focusing on 12-inch capacity expansion, which will see a CAGR of approximately 13.2%, according to TrendForce’s research. In terms of 8-inch wafers, due to factors such as difficult to obtain equipment and whether capacity expansion is cost-effective, most fabs can only expand production slightly by means of capacity optimization, equating to a CAGR of only 3.3%. In terms of demand, the products primarily derived from 8-inch wafers, PMIC and Power Discrete, are driven by demand for electric vehicles, 5G smartphones, and servers. Stocking momentum has not fallen off, resulting in a serious shortage of 8-inch wafer production capacity that has festered since 2H19. Therefore, in order to mitigate competition for 8-inch capacity, a trend of shifting certain products to 12-inch production has gradually emerged. However, if shortages in overall 8-inch capacity is to be effectively alleviated, it is still necessary to wait for a large number of mainstream products to migrate to 12-inch production. The timeframe for this migration is estimated to be close to 2H23 into 2024.

PMIC and Audio Codec gradually transferred to 12-inch production, alleviating shortage of 8-inch production capacity

At present, mainstream products produced using 8-inch wafers include large-sized panel Driver IC, CIS, MCU, PMIC, Power Discrete (including MOSFET, IGBT), Fingerprint, Touch IC, and Audio Codec. Among them, there are plans to gradually migrate Audio Codec and some more severely backordered PMICs to the 12-inch process.

In terms of PMICs, other than certain PMICs used in Apple iPhones already manufactured at 12-inch 55nm, most mainstream PMIC processes are still at 8-inch 0.18-0.11μm. Burdened with the long-term supply shortage, IC design companies including Mediatek, Qualcomm, and Richtek have successively planned to transfer some PMICs to 12-inch 90/55nm production. However, since product process conversion requires time-consuming development and verification and total current production capacity of the 90/55nm BCD process is limited, short term relief to 8-inch production capacity remains small. Effective relief is expected in 2024 when large swathes of mainstream products migrate to 12-inch production.

In terms of Audio Codec, Audio Codecs for laptops are primarily manufactured on 8-inch wafers, and Realtek is the main supplier. In the 1H21, the squeeze on capacity delayed lead times which affected notebook computers shipments. Although the stocking efforts of certain tier1 customers proceeded smoothly in the second half of the year, these products remained difficult to obtain for some small and medium-sized customers. At present, Realtek has partnered with Semiconductor Manufacturing International Corporation (SMIC) to transfer the process development of laptop Audio Codecs from 8-inch to 12-inch 55nm. Mass production is forecast for mid-2022 and is expected to improve Audio Codec supply.

In addition to PMIC/Power Discrete, another mainstream product derived from 8-inch manufacturers is the large-sized panel Driver IC. Although most fabs still manufacture 8-inch wafers, Nexchip provides a 12-inch 0.11-0.15μm process technology used to produce large-sized Driver ICs. As production capacity at Nexchip grows rapidly, the supply of this product has been quite smooth. However, TrendForce believes that this is a special case. Mainstream large-sized Driver ICs are still manufactured on 8-inch wafers and there is no trend to switch to 12-inch wafers.

For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms. Latte Chung from the Sales Department at lattechung@trendforce.com

According to TrendForce research, since reaching a peak of 1.457 billion units in 2017, it has been difficult for smartphones to significantly increase their penetration rate. In addition, mobile phone hardware updates have slowed which has lengthened the consumer replacement cycle. Add to this the negative effects of the COVID-19 pandemic and growth in overall smartphone shipment volume has become increasingly difficult to achieve. However, based on the premise that the pandemic is slowing down, coupled with the strategy of certain brands actively exploring emerging markets, growth momentum in the global smartphone market has gradually gotten back on track in 2021, with shipments reaching 1.333 billion units, or 6.4% growth YoY. This upward trend is expected to continue in 2022, with shipments expected to reach 1.386 billion, or 4% growth YoY.

TrendForce emphasizes, it should be noted that the status of the pandemic is still the biggest concern affecting the smartphone market this year and this applies doubly to the production capacity of semiconductors. The current problem of material shortages has yet to be alleviated and RF chips, OLED DDICs, and PMICs continue to be in short supply. In addition, issues such as China’s rolling blackouts, spiking shipping costs, and rising chip costs, will cause smartphone brands to face price pressures and it remains to be seen whether higher prices will be acceptable to consumers.

Judging from the 2022 brand market share forecast, Samsung will remain number one followed by Apple, Xiaomi, OPPO, VIVO, and Transsion. Among these companies, Xiaomi is the brand with the fastest-growing annual shipment growth rate. In addition to stimulating sales in the Chinese market through the strategy of expanding brick and mortar stores, Xiaomi’s sales occur mostly overseas, and it is first in market share in India and Russia. In the future, it will continue to explore the Middle East, Latin America, Southeast Asia, and Africa markets.

Four keys to mobile phone trends in 2022

Folding phones, 5G, self-developed chips, and a reduction in the number of rear-facing cameras are the four keys to focus on this year. In terms of 5G mobile phones, the global penetration rate in 2021 was 37%, this is expected to rise to 47% in 2022, and may exceed 50% by 2023. At present, China is the most active country in promoting 5G models. More than 80% of the country’s shipments are 5G mobile phones. Therefore, the key to increasing the global penetration rate of 5G mobile phones in the future is focusing on regions outside China.

Regarding self-developed chips, in the past, only Samsung, Apple, and Huawei were capable of self-developing chips. However, Google launched its self-developed Tensor processor in 2021, and Xiaomi, OPPO, and VIVO have each launched professional imaging chips in succession.

（Image credit: Apple）

According to GSMARENA (1/20), Apple may unveil the new iPhone SE, christened the iPhone SE+ 5G, sometime between late April and early May. According to what is currently known, this model will be a continuation of the previous generation design wise but whether it will employ a 4.7-inch LCD screen with a Touch ID button is unknown. The only thing known for certain is that it will be able to connect to 5G.

The SE models launched in 2020 utilized the A13 chip and a 4G Modem (the same configuration as the iPhone 11) and, according to rumors, the new SE will adopt the A15 chip and a Qualcomm Snapdragon X60 modem, (like the iPhone 13). TrendForce believes, as the release of the affordable iPhone SE (third generation) is imminent in 1H22, it has entered small batch production. The plan to supply in April is roughly on schedule and the first batch of mass production is expected to be 4 million to 5 million units. Although this new model is distinguished in neither appearance and nor specifications, as the most affordable of Apple’s 5G mobile phones, paired with brand premiums, it is still expected to occupy a place in a market where large-sized panels are king, More than 20 million units of this single model will ship throughout the year. （Image credit: Pixabay）

Resource: The iPhone SE+ 5G will become available in late April or early May, claims analyst