Following Micron’s sequential doubling of HBM sales in the previous quarter, the U.S. memory giant is making strides in overseas expansion amid the AI boom. According to Micron’s press release, it breaks ground on a new HBM packaging facility in Singapore on January 8. With an estimated investme...

NVIDIA CEO Jensen Huang takes center stage again at CES 2025, as he unveiled several AI advancements in addition to the powerful GeForce RTX 50 GPU, built on its next-gen Blackwell architecture. Notably, he also made an update on Samsung’s HBM3E verification, as per South Korean media outlet Korea...

According to a MoneyDJ report, citing Nikkei, Japan's leading automotive chip manufacturer, Renesas Electronics, is planning to lay off several hundred employees both domestically and internationally, while also reducing factory capacity utilization. As reported by Nikkei on January 7, Renesas El...

Amid the AI frenzy at CES 2025, Samsung Electronics announced a lackluster fourth-quarter earnings guidance, which could be attributed to ongoing delays in obtaining NVIDIA’s approval for next-gen HBM products, according to Yonhap News and Reuters. As per Samsung’s press release, the company ...

12-inch wafer fabs play a crucial role in semiconductor manufacturing. By the end of 2024, several major projects have made headlines. Production has commenced for five 12-inch wafer lines from Runpeng Semiconductor, Tiancheng Advanced, Yandong Microelectronics, Guangzhou Chip Semiconductor, and Hua...