Driven by forces such as the pandemic, geopolitics, and the digital transformation of everyday life, there has been a shortage of global foundry production capacity for nearly two years and shortages have been especially severe for mature 1Xnm~180nm nodes, according to TrendForce’s investigations. Although all foundries are furiously increasing capital expenditures to expand capacity, unrealized future expansion does not ease existing supply issues. In addition, the uneven distribution of supply chain resources that has exacerbated the shortage of parts and components has yet to be definitively alleviated. Circumstances as a whole will continue affecting shipments of related whole devices. Only the PC category is expected to emerge largely unscathed in 1Q22.

Moving into 1Q22, TrendForce states, due to the limited increase in production capacity, the market’s supply situation is expected to be approximately the same as in 4Q21. However, some end products have entered their traditional off-season cycle and the slowdown in demand momentum is expected to alleviate the immediate pressure on OEMs and ODMs regarding supply chain stocking.

In terms of the whole servers, the FPGA delivery cycle is currently at over 50 weeks at most, while the delivery cycle of Lan chips has improved significantly, from the original 50+ weeks to approximately 40 weeks. However, escalating purchase order activity caused by the uncertainty of the pandemic combined with an accumulated backlog of demand (Back order/backlog) have pushed the SMT capacity of ODMs to full load in general. The aforementioned phenomenon have not only accelerated the consumption of ICs such as FPGA and PMIC, but the demand for additional purchase orders of FPGA, PMIC and MOSFET is still compelling. The overall market remains tight and the production of server motherboards in the future may face hidden issues. TrendForce has ascertained a more crucial matter. Taking the L6 server as an example, its production scale in 1Q22 will be roughly the same as the previous quarter. However, whole server shipments will show a seasonal decline with a decrease of approximately 8% QoQ.

In terms of mobile phones, material shortages have gradually eased from the second half of 2021 partly due to the discretionary adjustment of mobile phone specifications. Mobile phone brands can adjust their specifications and configurations based on available materials. Currently, the supply of four components remains relatively tight. Among them, 4G SoC (30-40 weeks) and OLED DDIC/Touch IC (20-22 weeks) have a significant impact on the market. The former will affect brands that focus on selling 4G mobile phones. The latter is affected by oligopolistic market structure and the adjustment of foundry capacity. Thus, there are rumblings of insufficient supply. Though the supply of the remaining two items, PMIC and A+G Sensor, remains tight, material shortage risk can be largely mitigated through alternative material replacements or the adjustment of specifications and configurations. In terms of production, the 1Q22 supply chain will essentially carry on its performance from the previous quarter. However, due to disappointing holiday demand at the end of 2021, mobile phone brands must adjust the distributed inventory level of finished products in a timely manner. Combined with uncertainty caused by disruptions stemming from a winter-time pandemic, 1Q22 production performance is estimated to fall by approximately 13% QoQ.

In terms of PCs and laptops, starting from November 2021, material shortages have been partially alleviated. Therefore, the shipment volume of PC ODMs in 4Q21 has been revised upwards. Compared with mobile phones and whole servers, the impact of under/oversupply of materials on end PCs and notebooks is relatively minor. Except for the SSD PCIe 3.0 controller, current tightness exhibited in component supply is due to delays in the transition of Intel’s new platform. This temporary shortfall has led to a delivery cycle of approximately 8-12 weeks while any tightness in the supply of Type C IC, WiFi, and PMIC is gradually abating. TrendForce expects that, as overall supply chain stability recuperates, notebook shipments from ODM brands in 1Q22 will only decrease by 5.1% QoQ. However, if the component shortage factor is discounted, subsequent sales originating from various distribution channels will be another major variable TrendForce must consider.

For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms. Latte Chung from the Sales Department at lattechung@trendforce.com

The market in general had high hopes for Mini LED notebook computers in 2021. Although most brands were relatively unenthusiastic towards the adoption of Mini LED displays, the release of Mini LED products by Apple will likely generate a copycat effect and inject fresh momentum into both demand and shipment for the Mini LED notebook market. Apple did, in fact, release two brand new MacBook Pros with 14.2-inch and 16.2-inch displays, both of which are equipped with Mini LED backlights as expected. However, these Mini LED notebook displays did not receive as much marketing and publicity as the Mini LED displays used for the iPad Pro models, which had been released about six months prior.

During the unveiling of the 12.9-inch iPad Pro in 2Q21, Apple made special mention of improvements brought about by the Liquid Retina XDR display technology thanks to the company’s adoption of Mini LED backlights. Conversely, perhaps because the new physical dimensions and processors took most of the spotlight, Apple was surprisingly quiet on its new MacBook Pro models’ Mini LED displays as it announced the release of these new computers during its October event. Not only did the Mini LED iPad Pros completely replace the previous edge-lit models, but these new tablets also featured a mere US$100 retail price hike, which basically entirely accounts for the cost of the new displays. Subsequently, the market began eagerly anticipating the release of the new Mini LED iPad Pro models. In contrast, whereas the 14.2-inch and 16.2-inch models of the new MacBook Pros also feature Mini LED displays exclusively, their retail prices saw significant jumps owing to the integration of multiple updated components and designs, in turn refreshing the enthusiasm of the market for Mini LED displays.

Thanks to the release of the two new MacBook models, annual Mini LED notebook shipment for 2021 reached 2.2 million units, representing a 1% penetration rate in the total notebook market. Regrettably, apart from MacBooks, the shipment volume of Mini LED notebooks released by non-Apple brands was rather insignificant. Looking ahead to 2022, given the all-out effort by Apple to ramp up MacBook shipment throughout the whole year, annual Mini LED notebook shipment for 2022 will likely undergo a staggering 360% YoY increase to eight million units for a 3.4% penetration rate. However, judging by notebook brands’ adoption of display solutions at the moment, most non-Apple brands will still gravitate towards OLED panels in 2022, with minimal adoption of Mini LED displays.

If Gen 8.5 OLED panel production lines are able to kick off mass production from 2024 onwards, will Apple transition its MacBook displays to a different solution much like it did for iPad? TrendForce believes that Apple has historically held a receptive attitude towards OLED solutions. Furthermore, from a technology assessment perspective, notebook computers and tablets are relatively similar in their display technologies and, to a lesser extent, use cases. If Apple does decide to transition iPad displays from Mini LED to OLED, then the company will likely do the same for MacBook display as well, in principle. On the other hand, LCD panels are still expected to remain the mainstream display technology for notebook computers in 2025. It, therefore, makes competitive sense for notebook brands to differentiate their products with OLED panels in the high-end segment and with LCD panels and Mini LED backlights in the premium mid-range segment or even mid-range segment. At any rate, given the shrinking gap between the cost structures of Mini LED solutions and OLED solutions, only by continually optimizing the manufacturing costs of Mini LED backlights can suppliers convince Apple to continue adopting Mini LED displays.

（Image credit: Pixabay）

A fire occurred at ASML’s factory in Berlin, Germany on January 3, according to TrendForce’s investigations. ASML is the largest supplier of key equipment (including EUV and DUV) required for foundry and memory production. According to TrendForce’s preliminary inquiry, approximately 200m2 out of a factory floor covering 32,000m2 was affected by the fire. This factory primarily manufactures optical components used in lithography systems such as wafer tables, reticle chucks, and mirror blocks. Reticle chucks used for affixing photomasks are in short supply. Currently, the majority of components produced at this factory go towards supplying EUV machines while the lion’s share of demand for these products come from foundries. If the fire delays component delivery, it cannot be ruled out that ASML will prioritize the allocation of output towards fulfilling foundry orders.

Lead time for this exclusive supply of key EUV machines has been long and may affect the timeframe of advanced manufacturing process transition  

In terms of foundries, EUV is primarily used in advanced manufacturing processes smaller than the 7nm node. Currently, the only companies in the world using this equipment for manufacturing are TSMC and Samsung including TSMC’s 7nm, 5nm, 3nm nodes, Samsung’s EUV Line (7nm, 5nm and 4nm) built in Hwaseong, South Korea, and 3nm GAA node. However, due to factors such as the shortage of global foundry production capacity and the active expansion of manufacturing, semiconductor equipment lead times are also stretching further into the future.

In terms of DRAM, Samsung and SK Hynix are already using EUV in their 1Znm and 1alpha nm processes, while US manufacturer Micron is expected to introduce EUV to their 1gamma nm process in 2024. According to TrendForce’s current information, the lead time on ASML EUV equipment is approximately 12 to 18 months. Due to this long equipment lead time, ASML is at liberty to wait for the completion of replace components for those lost in the fire during the time necessary for equipment assembly.

Overall, the ASML Berlin factory fire will have a greater impact on the manufacturing of EUV lithography equipment when it comes to foundries and memory. According to TrendForce’s information, it cannot be ruled out that ASML will obtain necessary components from other factory campuses. In addition, the current lead time for EUV equipment is quite long. Therefore, the actual impact on EUV supply remains to be seen.

For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms. Latte Chung from the Sales Department at lattechung@trendforce.com

An earthquake that was around magnitude 6.0 on the Richter scale occurred off the east coast of Taiwan at 5:46PM local time on January 3, 2022. As most local DRAM and foundry fabs are located in the northern and central parts of the island, TrendForce’s latest investigations reveal no notable damages to the equipment from the fabs. Therefore, the production side is expected to continue normal operation, and the actual impact of the earthquake on the output of Taiwan’s DRAM and foundry industries will likely be limited. Taiwan’s memory fabs, including those operated by MTTW, Nanya, and other smaller semiconductor companies, collectively account for about 21% of the global DRAM production capacity. In the foundry industry, Taiwan’s fabs, including those operated by TSMC, UMC, Vanguard, PSMC, etc., together make up as much as 51% of the global production capacity.

Regarding the current state of the DRAM market, it is in midst of the conventional off-season. However, the recent easing of component gaps in the supply chain is generating some stock-up activities in different application segments and thus bolstering the overall demand. The headwinds of the off-season are not as strong as usual. Also, there are now concerns brewing in the wider memory market about the supply side being affected by the COVID-19 lockdown in the Chinese city of Xi’an. Consequently, memory spot prices have been registering daily hikes lately. It is worth noting that increases in DRAM spot prices have been more significant than the increases in NAND Flash spot prices. Regarding DRAM contract prices, TrendForce for now maintains its original forecast of QoQ drops in the 8-13% range for 1Q22. However, the latest earthquake that struck Taiwan could affect DRAM buyers’ behavior at any time. How contract prices will actually end up is something that requires further observation. As for DRAM spot trading, the memory spot market of Mainland China was still in midst of the year-end holiday on January 3. Hence, spot traders were passive for the most part. TrendForce will continue monitoring the spot market to see if the earthquake is going to be a positive driver going forward.

Turning to the current state of the foundry market, the chip demand related to some categories of end products has slowed down a bit recently because of seasonality. However, demand remains quite strong for chips that were previously in short supply, such as PMIC, Wi-Fi SoC, etc. Foundry fabs on the whole are still operating with a fully loaded capacity because demand continues to outstrip supply. The fabs of Taiwan-based foundries, including TSMC, UMC, PSMC, and Vanguard, are concentrated in Hsinchu, Taichung, and Tainan. In those places, an earthquake intensity scale of 3 or under was recorded. As such, no foundry fab in Taiwan has halted operation because of the earthquake, and all fabs are operating normally at the moment.

For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms. Latte Chung from the Sales Department at lattechung@trendforce.com

Benefiting from expanded introduction of AMOLED mobile phone models by Apple, Samsung and Chinese brands, the market penetration rate of AMOLED panels for mobile phones in 2021 was 42%, according to TrendForce‘s investigations. In 2022, continuous investment undertaken by numerous panel factories to expand AMOLED production lines will drive AMOLED panel penetration rate to an estimated 46%. However, TrendForce further asserts that the continued tight supply of AMOLED DDI and the willingness of mobile phone brands to expand the use of AMOLED panels will be the keys influencing AMOLED market penetration rate next year.

Continued tightness in AMOLED DDI supply for mobile phones

The AMOLED DDI process requires dedicated medium voltage 8V processes at the 40nm and 28nm nodes. However, the supply of dedicated process capacity in 2021 is limited. In addition, Samsung’s Austin, Texas fab was shut down due to a snowstorm in early 2021, resulting in serious shortages of AMOLED DDI. New capacity in 2022 includes UMC at the 28nm node and SMIC at the 40nm node. However, since capacity and expanded capacity still cannot effectively meet the various brand’s demand for AMOLED DDI, Samsung’s fab will continue to reduce OLED DDIC production scale in the future. Stocking issues are expected to plague AMOLED DDI continuing into 2022.

TrendForce states, UMC’s primary expansion plan for 28nm AMOLED DDI will be completed by the end of 2023, so AMOLED DDI supply tightness is expected to be alleviated in 2023. In addition, other foundries have plans to develop dedicated AMOLED DDI processes but, due to a belated development schedule, these plans will not be able to address the AMOLED DDI shortage in 2022. Facing limitations on dedicated AMOLED DDI production capacity, traditional front-line DDI design houses are actively booking the majority of production capacity, while other DDI design houses are also competing for limited production capacity in order to enter the AMOLED panel factory supply chain.

Mobile phone brands expand their willingness to adopt AMOLED panels

Facing the gradual maturity of AMOLED panel technology and the continuous improvement of production yields, AMOLED market penetration rate will increase from 42% in 2021 to 46% in 2022. This will reduce the market share of LTPS panels in the mid-tier market and drive panel makers to transfer LTPS production capacity to medium size applications. However, mobile phone brands face the risk of AMOLED DDI continuing to being out of stock in 2022. In addition to the high price of AMOLED panels and the steady increase in the pricing of other semiconductor components, in order for mobile phone brands to maintain profitability and achieve annual shipment goals, TrendForce expects that a small number of AMOLED products may switch over to LCD panels to pad shipments in the mid-to-low-end mobile phone market, allowing LTPS panel makers to gain a bit of breathing room in the mid-end market.

For more information on reports and market data from TrendForce’s Department of Display Research, please click here, or email Ms. Vivie Liu from the Sales Department at vivieliu@trendforce.com