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2024-05-21

[News] Intel to Adopt New High-NA EUV, High Costs Could Lead to Increased Losses

Intel's early adoption of ASML's High Numerical Aperture Extreme Ultraviolet Lithography (High-NA EUV) equipment is seen by many as a crucial move for Intel to reclaim its technological leadership. Yet, according to a report from CNA, industry sources cited in the report have warned that the high co...

2024-05-20

[News] DRAM Price Surge Halts, Could HBM Demand Drive Price Increases?

The recovery in demand for PCs and smartphones will take time, leading to a halt in the upward trend of DRAM prices, remaining stable for two consecutive months. However, the rapid growth in demand for High Bandwidth Memory (HBM), essential for data center servers and generative AI, is expected to b...

2024-05-20

[News] AMD Reportedly Seeks Major Subsidy with Four Conditions from Taiwan Ministry of Economic Affairs

As the era of AI advances, following NVIDIA's application to the Ministry of Economic Affairs (MOEA) for the "A+ Industrial Innovative R&D Program,"  which led to the establishment of the first R&D center in Asia and the creation of Taiwan's largest AI supercomputer, "Taipei-1", American AI...

2024-05-20

[News] CoWoS Production Capacity Reportedly Falls Short of GPU Demand

The world's four major CSPs (Cloud Service Providers) – Microsoft, Google, Amazon, and META – are continuously expanding their AI infrastructure, with their combined capital expenditures projected to reach USD 170 billion this year. According to the industry sources cited in a report from Commer...

2024-05-20

[News] Apple COO Rumored to Make Secret Visit to TSMC, Booking Advanced Capacity for AI In-house Chips

As Apple keeps advancing in AI as well as developing its own in-house processors, industry sources indicated that the tech giant’s Chief Operating Officer (COO) Jeff Williams recently made a visit to TSMC, and was personally received by TSMC’s President, C.C. Wei, according a report by Economic ...

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