By leveraging advantages such as lifelike interaction and virtual simulation, the metaverse will enable the growth of various applications ranging from virtual meetings, digital modeling and analysis, to virtual communities, gaming, and content creation, in the infancy of its development. According to TrendForce’s latest investigations, constructing the metaverse, which is more complex than the existing internet world, requires more powerful data processing cores, networking environments capable of transferring enormous data, and user-side AR/VR devices with improved display performances. These requirements will further drive forward the development of memory products, advanced process technologies, 5G telecommunications, and display technologies.

Regarding memory products, the conceptual framework of the metaverse is heavily contingent on the support provided by compute nodes. The data center industry will therefore experience more catalysts brought about by the metaverse, and there will be a corresponding growth in micro-servers and edge processing applications. The metaverse will also require an increase in the performance of storage devices. This means that SSDs, which are substantially faster than HDDs in writing data, will become an indispensable storage solution. On the DRAM front, take VR devices as an example; most existing devices are equipped with 4GB LPDRAM, which has the dual advantage of low power consumption and high performance. In the short run, manufacturers will not plan to massively upgrade the applications processors in these devices, which also operate in relatively simple processing environments. Hence, the growth in VR devices’ DRAM density will remain relatively stable. In terms of storage, on the other hand, because most AR/VR devices are equipped with Qualcomm chips whose specifications closely resemble those of flagship smartphone SoCs, AR/VR devices will also feature UFS 3.1 solutions.

Regarding advanced process technologies, the integration of AI and the increase in demand for computing power have resulted in a corresponding demand for high-performance chips, which enable improved graphics rendering and computation of massive amounts of data. Advanced process technologies allow the production of high-performance chips that deliver enhancements in performance, power consumption, and chip size. The realization of the metaverse requires high-performance chips for data and graphics processing, so high-performance CPUs and GPUs will assume key roles in this regard. TrendForce’s investigations indicate that, with respect to CPUs, the current mainstream products from Intel and AMD are manufactured at the Intel 7 node (equivalent to the 10nm node) and TSMC’s 7nm node, respectively, and the two companies will migrate to TSMC’s 3nm and 5nm nodes in 2022. With regards to GPUs, AMD’s wafer input plans for GPUs are basically in lockstep with its plans for CPUs, whereas Nvidia has been inputting wafers at TSMC’s 7nm node and Samsung’s 8nm node. Nvidia is currently planning to input wafers at the 5nm node, and the resultant GPUs will likely be released to market in early 2023.

Regarding networking and telecommunications, due to the metaverse’s demand for virtual interactions that are instant, lifelike, and stable, greater attention will be paid to the bandwidth and latency of data transmissions. 5G communication is able to meet this demand as it features high bandwidth, low latency, and support for a greater number of connected devices. Hence, the arrival of the metaverse will likely bring about the commercialization of 5G-related technologies at an increasingly rapid pace. Notably, some of these 5G technologies that are set to become the backbone of network environments powering the metaverse include SA (standalone) 5G networks, which delivers greater flexibility via network slicing; MEC (multi-access edge computing), which increases the computing capabilities of the cloud; and TSN (time sensitive networking), which improves the reliability of data transmissions. In addition, 5G networks will also be combined with Wi-Fi 6 in order to extend the range of indoor wireless connections. In light of their importance in enabling the metaverse, all of these aforementioned technologies have become major drivers of network service development in recent years.

Regarding display technologies, the immersive experiences of VR/AR devices depend on the integration of higher resolutions and refresh rates. In particular, an increase in resolution will receive much more attention in the market now that Micro LED and Micro OLED technologies have gained gradual adoption as display technologies shrink in terms of physical dimensions. As well, the traditional 60Hz refresh rate can no longer satisfy the visual demands of advanced display applications, meaning display solutions with higher than 120Hz refresh rates will become the mainstream going forward. In addition, the metaverse’s emphasis on interactivity demands display technologies that are not limited by traditional physical designs. The market for flexible display panels, which allow for free form factors, is expected to benefit as a result. At the same time, the metaverse is also expected to generate some demand for transparent displays, which serve as an important interface between the virtual world and real life.

（Image credit: Ready Player One）

DRAM buyers were aggressively stocking up during 1H21 because quotes began to rise at the start of the year, and there were concerns about shortages in the supply chain, according to TrendForce’s latest investigations. To avoid the risk of a supply crunch, most DRAM buyers kept raising their demand until the middle of the year. Moving into this second half of the year, the COVID-19 pandemic has exacerbated component gaps, the adverse effect of which on OEMs’ ability to assemble their end products has widened as well. Due to having a glut of memory and a shortage of other key components, some OEMs have opted to scale back DRAM procurement. PC OEMs have especially become noticeably restrained in this regard. Fortunately, the server-related segment of the market has been propping up the overall demand; and because of this, most DRAM suppliers were able to post a marginal growth in shipments for 3Q21. Additionally, quotes for DRAM product also kept rising in 3Q21. On account of these factors, the quarterly total DRAM revenue rose again by 10.2% QoQ to US$26.6 billion for 3Q21.

Regarding 4Q21, DRAM buyers that are already carrying a high level of inventory will probably adopt an even more conservative stance, as OEMs are still affected by component gaps in the supply chain while also preparing for stock-taking at the end of the year. Without adequate demand for support, DRAM prices on the whole are going to make a downward turn in 4Q21 and thereby end this short three-quarter period of cyclical price upturn. Also, since 4Q21 is going to be the first quarter in the general downtrend in quotes, buyers anticipate further price reductions in the future and are more reluctant to stock up in the near term. Declines in quotes will continue to widen as a result. With demand shrinking and prices falling, the DRAM industry will inevitably experience a drop in revenue as well.

DRAM suppliers saw higher profits in 3Q21 because of rising prices and growth in output shares of more advanced process technologies

Looking at the performances of individual DRAM suppliers for 3Q21, the three dominant suppliers all had positive revenue growth but diverged slightly in bit shipments. Samsung and Micron posted a small QoQ increase in their respective bit shipments, whereas SK hynix posted a small QoQ drop. The rise in quotes was able to offset the weakening momentum in bit shipments, so the top three suppliers managed to again raise their revenues from the previous quarter. Samsung’s, Sk hynix’s, and Micron’s QoQ revenue growth rates came to 11%, 8%, and 12% respectively. While their growth rates were still around the 10% level, they were more modest compared with the previous quarter. In the ranking by revenue market share, Samsung remained at the top with its market share expanding further to 44%. SK hynix and Micron were still at second and third place respectively. The former’s market share shrank a bit to 27.2% due to the decline in bit shipments, whereas the latter’s market share grew slightly to 22.9%.

In terms of profitability, 3Q21 saw continuing improvements thanks to rising quotes and growth in the output shares of the more advanced process technologies. Samsung raised its operating margin to 53% in 3Q21 as the share of 1Z nm products in its output kept growing. As such, Samsung’s operating margin reached almost to the high of nearly three years ago. Likewise, SK hynix’s operating margin grew to 47% in 3Q21 because of the increase in the output share of 1Z nm products. As for third-largest supplier Micron, the increase in its ASP for its latest fiscal quarter (June to August) is similar to the increases in the two South Korean suppliers’ respective ASPs for 3Q21. Its operating margin also rose to 42% for this period. Moving into 4Q21, TrendForce expects the slide in DRAM prices to be an inescapable trend. Whether individual suppliers will be able to maintain a high level of profitability depends on their own progress in process migration and yield rate improvement.

While the specialty DRAM market weakened in 3Q21, Taiwanese suppliers trailed closely behind the three dominant suppliers

Compared with mainstream DRAM products, specialty DRAM underwent a higher magnitude of price hikes in 1H21. Hence, as demand for TVs and other consumer electronics fell in 3Q21, and supply chain disruptions persisted, clients in turn reduced their DRAM procurement. This reduced demand indirectly impacted the revenue performances of Taiwanese suppliers, which primarily target the consumer electronics market. Nanya Tech continued to raise its quarterly ASP in order to offset weak shipment. The company’s revenue increased by about 6% QoQ in 3Q21, while its operating profit margin also increased from 31.2% in 2Q21 to 38.1% in 3Q21 due to the price hike. Winbond benefitted from high demand for its low-density (1/2Gb) products and recorded a nearly 13% QoQ increase in DRAM revenue in 3Q21. Among all Taiwanese suppliers, Winbond registered the strongest revenue growth during the quarter.

Nevertheless, TrendForce’s investigations also find that the physical spaces within the two aforementioned Taiwanese suppliers’ fabs are now fully occupied, meaning the suppliers are unable to install additional equipment in these fabs before building new fabs. Hence, these suppliers’ financial performances will be heavily impacted by their ASPs in the short run. For instance, Nanya Tech’s new facilities will not contribute to DRAM production until construction finalizes in 2024. In the short run, Nanya Tech is able to slightly increase its DRAM bit shipment only through migrating to the advanced 1A/1B nm process technologies. Similarly, Winbond will be able to continue expanding its production capacity only after its new fab located in Luzhu, Kaohsiung kicks off mass production in 2H22. As for PSMC, its revenue from sales of PC DRAM products manufactured in-house increased by about 6% QoQ in 3Q21. However, PSMC’s total revenue from both sales of in-house DRAM and its DRAM foundry business increased by 12% QoQ in 3Q21.

For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms. Latte Chung from the Sales Department at lattechung@trendforce.com

According to TrendForce’s latest report on the server industry, not only have emerging applications in recent years accelerated the pace of AI and HPC development, but the complexity of models built from machine learning applications and inferences that involve increasingly sophisticated calculations has also undergone a corresponding growth as well, resulting in more data to be processed. While users are confronted with an ever-growing volume of data along with constraints placed by existing hardware, they must make tradeoffs among performance, memory capacity, latency, and cost. HBM (High Bandwidth Memory) and CXL (Compute Express Link) have thus emerged in response to the aforementioned conundrum. In terms of functionality, HBM is a new type of DRAM that addresses more diverse and complex computational needs via its high I/O speeds, whereas CXL is an interconnect standard that allows different processors, or xPUs, to more easily share the same memory resources.

HBM breaks through bandwidth limitations of traditional DRAM solutions through vertical stacking of DRAM dies

Memory suppliers developed HBM in order to be free from the previous bandwidth constraints posed by traditional memory solutions. Regarding memory architecture, HBM consists of a base logic die with DRAM dies vertically stacked on top of the logic die. The 3D-stacked DRAM dies are interconnected with TSV and microbumps, thereby enabling HBM’s high-bandwidth design. The mainstream HBM memory stacks involve four or eight DRAM die layers, which are referred to as “4-hi” or “8-hi”, respectively. Notably, the latest HBM product currently in mass production is HBM2e. This generation of HBM contains four or eight layers of 16Gb DRAM dies, resulting in a memory capacity of 8GB or 16GB per single HBM stack, respectively, with a bandwidth of 410-460GB/s. Samples of the next generation of HBM products, named HBM3, have already been submitted to relevant organizations for validation, and these products will likely enter mass production in 2022.

TrendForce’s investigations indicate that HBM comprises less than 1% of total DRAM bit demand for 2021 primarily because of two reasons. First, the vast majority of consumer applications have yet to adopt HBM due to cost considerations. Second, the server industry allocates less than 1% of its hardware to AI applications; more specifically, servers that are equipped with AI accelerators account for less than 1% of all servers currently in use, not to mention the fact that most AI accelerators still use GDDR5(x) and GDDR6 memories, as opposed to HBM, to support their data processing needs.

Although HBM currently remains in the developmental phase, as applications become increasingly reliant on AI usage (more precise AI needs to be supported by more complex models), computing hardware will then require the integration of HBM to operate these applications effectively. In particular, FPGA and ASIC represent the two hardware categories that are most closely related to AI development, with Intel’s Stratix and Agilex-M as well as Xilinx’s Versal HBM being examples of FPGA with onboard HBM. Regarding ASIC, on the other hand, most CSPs are gradually adopting their own self-designed ASICs, such Google’s TPU, Tencent’s Enflame DTU, and Baidu’s Kunlun – all of which are equipped with HBM – for AI deployments. In addition, Intel will also release a high-end version of its Sapphire Rapids server CPU equipped with HBM by the end of 2022. Taking these developments into account, TrendForce believes that an increasing number of HBM applications will emerge going forward due to HBM’s critical role in overcoming hardware-related bottlenecks in AI development.

A new memory standard born out of demand from high-speed computing, CXL will be more effective in integrating resources of whole system

Evolved from PCIe Gen5, CXL is a memory standard that provides high-speed and low-latency interconnections between the CPU and other accelerators such as the GPU and FPGA. It enables memory virtualization so that different devices can share the same memory pool, thereby raising the performance of a whole computer system while reducing its cost. Hence, CXL can effectively deal with the heavy workloads related to AI and HPC applications.

CXL is just one of several interconnection technologies that feature memory sharing. Other examples that are also in the market include NVLink from NVIDIA and Gen-Z from AMD and Xilinx. Their existence is an indication that the major ICT vendors are increasingly attentive to the integration of various resources within a computer system. TrendForce currently believes that CXL will come out on top in the competition mainly because it is introduced and promoted by Intel, which has an enormous advantage with respect to the market share for CPUs. With Intel’s support in the area of processors, CXL advocates and hardware providers that back the standard will be effective in organizing themselves into a supply chain for the related solutions. The major ICT companies that have in turn joined the CXL Consortium include AMD, ARM, NVIDIA, Google, Microsoft, Facebook (Meta), Alibaba, and Dell. All in all, CXL appears to be the most favored among memory protocols.

The consolidation of memory resources among the CPU and other devices can reduce communication latency and boost the computing performance needed for AI and HPC applications. For this reason, Intel will provide CXL support for its next-generation server CPU Sapphire Rapids. Likewise, memory suppliers have also incorporated CXL support into their respective product roadmaps. Samsung has announced that it will be launching CXL-supported DDR5 DRAM modules that will further expand server memory capacity so as to meet the enormous resource demand of AI computing. There is also a chance that CXL support will be extended to NAND Flash solutions in the future, thus benefiting the development of both types of memory products.

Synergy between HBM and CXL will contribute significantly to AI development; their visibility will increase across different applications starting in 2023

TrendForce believes that the market penetration rate of CXL will rise going forward as this interface standard is built into more and more CPUs. Also, the combination of HBM and CXL will be increasingly visible in the future hardware designs of AI servers. In the case of HBM, it will contribute to a further ramp-up of data processing speed by increasing the memory bandwidth of the CPU or the accelerator. As for CXL, it will enable high-speed interconnections among CPU and other devices. By working together, HBM and CXL will raise computing power and thereby expedite the development of AI applications.

The latest advances in memory pooling and sharing will help overcome the current hardware bottlenecks in the designs of different AI models and continue the trend of more sophisticated architectures. TrendForce anticipates that the adoption rate of CXL-supported Sapphire Rapids processors will reach a certain level, and memory suppliers will also have put their HBM3 products and their CXL-supported DRAM and SSD products into mass production. Hence, examples of HBM-CXL synergy in different applications will become increasingly visible from 2023 onward.

For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms. Latte Chung from the Sales Department at lattechung@trendforce.com

Total global sales of NEVs (new energy vehicles) for the first three quarters of 2021 (January-September) reached 4.2 million units, with BEVs in particular accounting for 2.92 million units, a 153% YoY growth, according to TrendForce’s latest investigations. Total sales of PHEVs, on the other hand, reached 1.28 million units, a 135% YoY growth. Compared to the overall automotive market, whose growth has been constrained by the ongoing semiconductor shortage and effects of the COVID-19 pandemic, sales of NEVs still remained relatively strong.

Regarding BEV sales, Tesla comfortably took the leadership position with a 21.5% market share. The automaker’s sales volume for the first three quarters of this year already surpassed its sales volume for 2020. Taking second place on the top 10 list, Wuling Hongguang was able to maintain its high volume of sales due to not only low retail prices, but also a gradual expansion of its target markets from tier-three and tier-four cities to tier-one and tier-two cities in China. This shift would seem to indicate a corresponding expansion of and shift in Wuling Hongguang’s customer base. BYD and Volkswagen took third and fourth places, respectively, with the latter aggressively consolidating its BEV offerings into the ID. Family this year. Vehicles in the ID. Family have accounted for nearly all of Volkswagen’s BEV sales since 3Q21. Despite the rapid growth of the BEV market, competition has been intensifying after traditional automakers began releasing their own BEV models at a faster pace while emerging automakers also began delivering vehicles.

It should be noted that, although the global semiconductor shortage has not damaged the NEV market to the same degree as it did the traditional ICE vehicle market, the NEV market is not entirely immune to the resultant supply-side issues. In addition, China’s power rationing and pandemic-generated transportation/logistics disruptions likewise affected automakers’ manufacturing operations to various degrees. Taken together, these aforementioned factors became some of the underlying causes responsible for the shifts in NEV automakers’ market shares.

Regarding PHEV sales, BYD put up a remarkable performance by leapfrogging to second place in the rankings, and this can primarily be attributed to the release of BYD’s DM-i vehicles, which feature a super hybrid technology aimed at reducing fuel consumption. Thanks to the DM-i vehicles, BYD’s PHEV sales began skyrocketing in 2Q21, and the automaker was able to overtake several European automakers with respect to total PHEV sales for the first nine months of 2021. Much like the BEV market, despite the growths in most automakers’ sales volumes, companies will find it increasingly difficult to raise their PHEV market share.

Looking ahead to the NEV market’s future, TrendForce believes that, as traditional global automakers gradually kick off mass production of vehicles based on the battery electric platform, more and more new BEV models will be released to market at an accelerated pace. Furthermore, the next one to three years will serve as the key timeframe for emerging automakers as well as new entrants that crossed from other industries to achieve mass production. Therefore, there remains much potential for changes to occur within the rankings of NEV automakers’ sales and market shares.

For additional insights from TrendForce analysts on the latest tech industry news, trends, and forecasts, please visit our blog at https://insider.trendforce.com/

As the COVID-19 pandemic wreaked havoc on the global electronics supply chain, the packaging and testing operations of mid-range and high-end chips were subsequently confronted with prolonged lead times. This can primarily be attributed to the fact that IC substrate suppliers were unable to raise output or expand their production capacities in the short run in order to meet the skyrocketing volume of client orders. Hence, products that are packaged using BGA (Ball Grid Array), Flip Chip, or SiP technologies, all of which require the use of IC substrates, had their lead times lengthened. Certain IC design companies are therefore considering the feasibility of packaging technologies that do not require substrates.

Regarding the trend of advanced packaging development, technologies such as 2.5D/3D IC, SiP, and FOPLP (Fan-out Panel Level Packaging) remain the current mainstream R&D targets. Given the ongoing shortage of semiconductor components, including IC substrates, FOPLP, in particular, has garnered the most attention among the aforementioned three packaging technologies as it can be operated without substrates. At present, most OSAT companies and other chipmakers have successively invested in FOPLP-related technological and manufacturing development in order to capitalize on potential new commercial opportunities.

Despite FOPLP’s advantage of packaging chips across large areas, technological development remains problematic

Regarding the history of FOPLP development as well as the technology’s evolution going forward, its earliest roots can be traced to existing packaging applications including Flip Chip and BGA. As end-products continued to experience performance upgrades, leading to the number of I/O pins being insufficient for meeting the increase in performance demand, new types of wafer-level packaging technologies such as Fan-in and Fan-out subsequently emerged to fulfill the packaging demands of mid-range chips, high-end chips, and other emergent applications.

Although Fan-in and Fan-out packaging technologies are able to effectively raise the number of I/O pins, they also result in a substantial increase in manufacturing costs compared to previous-generation technologies such as Flip Chip and BGA. For both 8-inch wafers and 12-inch wafers, packaging costs have only been on a very slight downtrend. That is why the packaging industry has placed a top priority on simultaneously lowering production costs while raising the number of chips packaged at once. Hence, FOPLP technology has emerged in response to this demand for large-area packaging technology.

Regarding the actual implementation of FOPLP, a potential solution may be found in wafer-level packaging RDL (Redistribution Layer) designs, such as chip first or chip last. It should be noted that chip first FOWLP or chip last FOWLP processes do in fact serve as feasible concepts for FOPLP development. However, the FOPLP process involves stacking massive amounts of packaging materials and chips together, and their combined weight may lead to such issues as panel warpage. In addition, it remains difficult to maintain a consistent uniformity and yield rate during the FOPLP process, meaning further collaborations and optimizations on the parts of OSAT companies and semiconductor equipment suppliers are necessary for FOPLP to succeed going forward.

（Image credit: Unsplash）