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HBM and 2.5D Packaging: the Essential Backbone Behind AI Server
With the advancements in AIGC models such as ChatGPT and Midjourney, we are witnessing the rise of more super-sized language models, opening up new possibilities for High-Performance Computing (HPC) platforms. According to TrendForce, by 2025, the global demand for computational resources in the ...
Press Releases
Panel Price Analysis for Late June
According to the latest panel price analysis released by TrendForce in late June, TV panel prices continue to rise as panel manufacturers maintain control over their production capacity, ensuring a balance between supply and demand. Despite lackluster sales performance during the 618 promotion, t...
Insights
Apple Plans to Introduce RCC Materials in 2024, Enabling Space Saving and Increased Battery Capacity in iPhones
TrendForce's investigation into the supply chain reveals that Apple plans to upgrade the PCB materials in its new iPhone models in 2024. The current copper-clad laminate (CCL) will be partially replaced with resin-coated copper (RCC), aiming to reduce the size and thickness of the mainboard. This up...
In-Depth Analyses
The Rapid Development of the Micro LED Industry seeing from innovation to the market
Throughout this year, the Micro LED industry has been receiving a constant stream of positive news in terms of new product launches, latest technological achievements, project progress, and investment and financing. This has once again accelerated the commercial development of Micro LED. TrendForce ...
In-Depth Analyses
Sporadic Uptick Observed in Lower-Priced DDR4 Memory Modules
DRAM Spot Market Regarding recent developments in the spot market, there have been sporadic price upticks for low-priced DDR4 products. Meanwhile, prices of DDR5 products have kept falling due to the plentiful chip supply. Unlike the contract market, the spot market has been relatively unaffected b...
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