High Bandwidth Memory (HBM) is emerging as the preferred solution for overcoming memory transfer speed restrictions due to the bandwidth limitations of DDR SDRAM in high-speed computation. HBM is recognized for its revolutionary transmission efficiency and plays a pivotal role in allowing core compu...

The global automotive industry is pouring billions of dollars into SiC semiconductors, hoping that they could be key to transforming vehicle power systems. This shift is rapidly changing the supply chain at all levels, from components to modules. In the previous piece "SiC vs. Silicon Debate: Wil...

With the advancements in AIGC models such as ChatGPT and Midjourney, we are witnessing the rise of more super-sized language models, opening up new possibilities for High-Performance Computing (HPC) platforms. According to TrendForce, by 2025, the global demand for computational resources in the ...

According to the latest panel price analysis released by TrendForce in late June, TV panel prices continue to rise as panel manufacturers maintain control over their production capacity, ensuring a balance between supply and demand. Despite lackluster sales performance during the 618 promotion, t...

TrendForce's investigation into the supply chain reveals that Apple plans to upgrade the PCB materials in its new iPhone models in 2024. The current copper-clad laminate (CCL) will be partially replaced with resin-coated copper (RCC), aiming to reduce the size and thickness of the mainboard. This up...